JPWO2024048187A1 - - Google Patents
Info
- Publication number
- JPWO2024048187A1 JPWO2024048187A1 JP2024544062A JP2024544062A JPWO2024048187A1 JP WO2024048187 A1 JPWO2024048187 A1 JP WO2024048187A1 JP 2024544062 A JP2024544062 A JP 2024544062A JP 2024544062 A JP2024544062 A JP 2024544062A JP WO2024048187 A1 JPWO2024048187 A1 JP WO2024048187A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022139667 | 2022-09-02 | ||
| PCT/JP2023/028284 WO2024048187A1 (ja) | 2022-09-02 | 2023-08-02 | 半導体装置、および、半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024048187A1 true JPWO2024048187A1 (https=) | 2024-03-07 |
| JPWO2024048187A5 JPWO2024048187A5 (https=) | 2025-05-14 |
Family
ID=90099246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024544062A Pending JPWO2024048187A1 (https=) | 2022-09-02 | 2023-08-02 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024048187A1 (https=) |
| WO (1) | WO2024048187A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005236019A (ja) * | 2004-02-19 | 2005-09-02 | Fuji Electric Holdings Co Ltd | 半導体装置の製造方法 |
| JP6200759B2 (ja) * | 2013-10-09 | 2017-09-20 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| JP2018019000A (ja) * | 2016-07-29 | 2018-02-01 | 株式会社ケーヒン | パワー半導体モジュール |
-
2023
- 2023-08-02 WO PCT/JP2023/028284 patent/WO2024048187A1/ja not_active Ceased
- 2023-08-02 JP JP2024544062A patent/JPWO2024048187A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024048187A1 (ja) | 2024-03-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250130 |