JPWO2024190426A1 - - Google Patents
Info
- Publication number
- JPWO2024190426A1 JPWO2024190426A1 JP2025506691A JP2025506691A JPWO2024190426A1 JP WO2024190426 A1 JPWO2024190426 A1 JP WO2024190426A1 JP 2025506691 A JP2025506691 A JP 2025506691A JP 2025506691 A JP2025506691 A JP 2025506691A JP WO2024190426 A1 JPWO2024190426 A1 JP WO2024190426A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023040790 | 2023-03-15 | ||
| PCT/JP2024/007410 WO2024190426A1 (ja) | 2023-03-15 | 2024-02-28 | 半導体装置および車両 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024190426A1 true JPWO2024190426A1 (https=) | 2024-09-19 |
| JPWO2024190426A5 JPWO2024190426A5 (https=) | 2025-12-04 |
Family
ID=92754945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025506691A Pending JPWO2024190426A1 (https=) | 2023-03-15 | 2024-02-28 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024190426A1 (https=) |
| WO (1) | WO2024190426A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005051038A (ja) * | 2003-07-29 | 2005-02-24 | Nec Kansai Ltd | 半導体装置及びその製造方法 |
| JP2008294384A (ja) * | 2007-04-27 | 2008-12-04 | Renesas Technology Corp | 半導体装置 |
| JP6338937B2 (ja) * | 2014-06-13 | 2018-06-06 | ローム株式会社 | パワーモジュールおよびその製造方法 |
| US11482479B2 (en) * | 2017-04-24 | 2022-10-25 | Rohm Co., Ltd. | Semiconductor device |
| JP2019075522A (ja) * | 2017-10-19 | 2019-05-16 | 株式会社デンソー | 半導体モジュール |
| DE212020000562U1 (de) * | 2019-07-12 | 2021-11-16 | Rohm Co., Ltd. | Halbleiterbauteil |
| US12412814B2 (en) * | 2020-12-15 | 2025-09-09 | Rohm Co., Ltd. | Semiconductor apparatus |
-
2024
- 2024-02-28 JP JP2025506691A patent/JPWO2024190426A1/ja active Pending
- 2024-02-28 WO PCT/JP2024/007410 patent/WO2024190426A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024190426A1 (ja) | 2024-09-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250908 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251107 |