JPWO2024075589A5 - - Google Patents

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Publication number
JPWO2024075589A5
JPWO2024075589A5 JP2024555738A JP2024555738A JPWO2024075589A5 JP WO2024075589 A5 JPWO2024075589 A5 JP WO2024075589A5 JP 2024555738 A JP2024555738 A JP 2024555738A JP 2024555738 A JP2024555738 A JP 2024555738A JP WO2024075589 A5 JPWO2024075589 A5 JP WO2024075589A5
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JP
Japan
Prior art keywords
conductive member
metal layer
semiconductor device
insulating spacer
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024555738A
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English (en)
Japanese (ja)
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JPWO2024075589A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034861 external-priority patent/WO2024075589A1/ja
Publication of JPWO2024075589A1 publication Critical patent/JPWO2024075589A1/ja
Publication of JPWO2024075589A5 publication Critical patent/JPWO2024075589A5/ja
Pending legal-status Critical Current

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JP2024555738A 2022-10-03 2023-09-26 Pending JPWO2024075589A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022159378 2022-10-03
PCT/JP2023/034861 WO2024075589A1 (ja) 2022-10-03 2023-09-26 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024075589A1 JPWO2024075589A1 (https=) 2024-04-11
JPWO2024075589A5 true JPWO2024075589A5 (https=) 2025-06-19

Family

ID=90608314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555738A Pending JPWO2024075589A1 (https=) 2022-10-03 2023-09-26

Country Status (2)

Country Link
JP (1) JPWO2024075589A1 (https=)
WO (1) WO2024075589A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013026361A (ja) * 2011-07-20 2013-02-04 Panasonic Corp 半導体装置及び半導体装置の製造方法
JP7052444B2 (ja) * 2018-03-15 2022-04-12 住友大阪セメント株式会社 光変調器、及び光伝送装置

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