WO2023100681A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2023100681A1
WO2023100681A1 PCT/JP2022/042795 JP2022042795W WO2023100681A1 WO 2023100681 A1 WO2023100681 A1 WO 2023100681A1 JP 2022042795 W JP2022042795 W JP 2022042795W WO 2023100681 A1 WO2023100681 A1 WO 2023100681A1
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WO
WIPO (PCT)
Prior art keywords
lead
semiconductor device
resin
thickness direction
resin surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/042795
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
僚太郎 柿▲崎▼
泰正 糟谷
光俊 齊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to CN202280079006.5A priority Critical patent/CN118318301A/zh
Priority to JP2023564880A priority patent/JPWO2023100681A1/ja
Priority to DE112022005222.8T priority patent/DE112022005222T5/de
Publication of WO2023100681A1 publication Critical patent/WO2023100681A1/ja
Priority to US18/649,331 priority patent/US20240282676A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present disclosure relates to semiconductor devices.
  • Patent Document 1 discloses a first lead, a second lead, and a third lead including a first pad having a pad main surface and a pad back surface, a semiconductor element mounted on the pad main surface, and a semiconductor element in contact with the pad main surface. and a sealing resin that covers the semiconductor element.
  • the first, second and third leads have first, second and third terminals extending in the same direction.
  • the semiconductor device is mounted on the circuit board by inserting the first terminal, the second terminal, and the third terminal through the through holes of the circuit board or the like.
  • a heat sink for example, an insulating sheet is provided between the rear surface of the pad and the heat sink.
  • the semiconductor device is required to be surface-mounted on the circuit board, for example, in addition to the mounting form in which the terminal portion is inserted through the circuit board.
  • An object of the present disclosure is to provide a semiconductor device that is improved over conventional semiconductor devices.
  • one object of the present disclosure is to provide a surface-mountable semiconductor device.
  • a semiconductor device provided by one aspect of the present disclosure includes a semiconductor element, first leads, and sealing resin.
  • the first lead includes a die pad portion having a first lead main surface on which the semiconductor element is mounted facing one thickness direction side and a first lead back surface facing the thickness direction other side, and a first terminal portion.
  • the sealing resin has a first resin surface facing one side in the thickness direction, a second resin surface facing the other side in the thickness direction, and a third resin surface facing one side in the first direction perpendicular to the thickness direction. covering the semiconductor element and part of the die pad portion.
  • the back surface of the first lead has a portion exposed from the second resin surface and located on one side in the first direction from the third resin surface when viewed in the thickness direction.
  • a surface-mountable semiconductor device can be provided.
  • FIG. 1 is a perspective view showing a semiconductor device according to a first embodiment of the present disclosure
  • FIG. FIG. 2 is a perspective view showing the semiconductor device according to the first embodiment of the present disclosure
  • FIG. FIG. 3 is a perspective view showing the semiconductor device according to the first embodiment of the present disclosure
  • FIG. FIG. 4 is a main part perspective view showing the semiconductor device according to the first embodiment of the present disclosure
  • FIG. 5 is a main part perspective view showing the semiconductor device according to the first embodiment of the present disclosure.
  • FIG. 6 is a plan view showing the semiconductor device according to the first embodiment of the present disclosure
  • FIG. 7 is a bottom view showing the semiconductor device according to the first embodiment of the present disclosure;
  • FIG. FIG. 8 is a front view showing the semiconductor device according to the first embodiment of the present disclosure;
  • FIG. 9 is a fragmentary plan view showing the semiconductor device according to the first embodiment of the present disclosure
  • FIG. FIG. 10 is a bottom view of essential parts showing the semiconductor device according to the first embodiment of the present disclosure.
  • 11 is a cross-sectional view taken along line XI--XI in FIG. 10.
  • FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 10.
  • FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 10.
  • FIG. 14 is a cross-sectional view taken along line XIV-XIV in FIG. 10.
  • FIG. FIG. 15 is a cross-sectional view showing how the semiconductor device according to the first embodiment of the present disclosure is used.
  • FIG. 16 is a cross-sectional view showing a first modification of the semiconductor device according to the first embodiment of the present disclosure
  • FIG. FIG. 17 is a cross-sectional view showing a usage state of the first modification of the semiconductor device according to the first embodiment of the present disclosure.
  • 18 is a perspective view showing a second modification of the semiconductor device according to the first embodiment of the present disclosure
  • FIG. 19 is a cross-sectional view showing a second modification of the semiconductor device according to the first embodiment of the present disclosure
  • FIG. FIG. 20 is a perspective view showing a third modification of the semiconductor device according to the first embodiment of the present disclosure
  • FIG. 21 is a cross-sectional view showing a third modification of the semiconductor device according to the first embodiment of the present disclosure
  • FIG. 22 is a cross-sectional view showing a fourth modification of the semiconductor device according to the first embodiment of the present disclosure
  • FIG. 23 is a fragmentary plan view showing a semiconductor device according to a second embodiment of the present disclosure.
  • a certain entity A is formed on a certain entity B” and “a certain entity A is formed on a certain entity B” mean “a certain entity A is formed on a certain entity B”. It includes "being directly formed in entity B” and “being formed in entity B while another entity is interposed between entity A and entity B”.
  • ⁇ an entity A is placed on an entity B'' and ⁇ an entity A is located on an entity B'' mean ⁇ an entity A is located on an entity B.'' It includes "directly placed on B” and "some entity A is placed on an entity B while another entity is interposed between an entity A and an entity B.”
  • ⁇ an object A is located on an object B'' means ⁇ an object A is adjacent to an object B and an object A is positioned on an object B. and "the thing A is positioned on the thing B while another thing is interposed between the thing A and the thing B".
  • ⁇ an object A overlaps an object B when viewed in a certain direction'' means ⁇ an object A overlaps all of an object B'' and ⁇ an object A overlaps an object B.'' It includes "overlapping a part of a certain thing B".
  • a certain surface A faces (one side or the other side of) direction B is not limited to the case where the angle of surface A with respect to direction B is 90 °, and the surface A Including when it is tilted against.
  • First embodiment: 1 to 15 show a semiconductor device according to a first embodiment of the present disclosure.
  • a semiconductor device A10 of this embodiment includes a conduction member 10, a semiconductor element 20, connection members 31, 32, and 33, and a sealing resin 40.
  • the z-direction is an example of the "thickness direction”
  • the x-direction is an example of the "first direction”
  • the y-direction is an example of the "second direction.”
  • the conductive member 10 is a member that constitutes a conductive path to the semiconductor element 20 .
  • the conducting member 10 of this embodiment includes a first lead 11, a second lead 12, a third lead 13 and a fourth lead .
  • the material of first lead 11, second lead 12, third lead 13 and fourth lead 14 is not limited at all, and includes copper (Cu) or a copper alloy, for example. Further, appropriate portions of the first lead 11, the second lead 12, the third lead 13 and the fourth lead 14 may be plated with silver (Ag), nickel (Ni), bell (Sn) or the like. .
  • first lead 11 has die pad portion 111 and a plurality of first terminal portions 112 .
  • the die pad portion 111 has a first lead main surface 1111 , a first lead rear surface 1112 and a first lead side surface 1113 .
  • the first lead main surface 1111 is a surface facing one side in the z direction.
  • the first lead back surface 1112 is a surface facing the other side in the z direction.
  • a semiconductor element 20 is mounted on the first lead main surface 1111 .
  • the first lead side surface 1113 is located between the first lead main surface 1111 and the first lead back surface 1112 in the z direction, and faces one side in the x direction.
  • the shape of the first lead side surface 1113 is not limited at all, and in the illustrated example, it is rectangular when viewed in the x direction.
  • the die pad portion 111 of this embodiment further has a first intermediate surface 1114 .
  • the first intermediate surface 1114 is located between the first lead main surface 1111 and the first lead back surface 1112 in the z direction, and faces one side in the z direction (the same side as the first lead main surface 1111). is.
  • the shape of the die pad portion 111 is not limited at all. In the illustrated example, the die pad portion 111 has a rectangular shape when viewed in the z direction. Also, the shapes of the first lead main surface 1111 and the first lead back surface 1112 are not limited at all, and in the illustrated example, they are rectangular when viewed in the z direction.
  • the plurality of first terminal portions 112 are arranged side by side in the y direction.
  • the first terminal portion 112 has a first portion 1121 , a second portion 1122 and a third portion 1123 .
  • the first part 1121 is connected to the pad part 121.
  • the first portion 1121 extends from the first lead side surface 1113 of the die pad portion 111 to one side in the x direction, and is parallel to the xy plane in the illustrated example.
  • the shape of the first part 1121 is not limited at all, and in the illustrated example, it is rectangular when viewed in the z direction.
  • the die pad portion 111 is larger in size in the z direction than the first portion 1121 .
  • the first portion 1121 is separated from the first lead back surface 1112 in the z-direction, and is in contact with the first lead main surface 1111 in the illustrated example. One surface of the first portion 1121 is flush with the first lead main surface 1111 .
  • the second part 1122 is located on one side of the first part 1121 in the z direction.
  • the second part 1122 is used when the semiconductor device A10 is surface-mounted on a circuit board or the like.
  • the second portion 1122 has a shape extending along the x direction.
  • the third part 1123 is interposed between the first part 1121 and the second part 1122.
  • the third portion 1123 extends from the first portion 1121 to one side in the z direction.
  • the third portion 1123 is tilted with respect to the z direction (yz plane).
  • the shape of the third part 1123 is not limited at all, and in the illustrated example it is rectangular when viewed in the x direction.
  • Second lead 12 The second lead 12 is located away from the first lead 11 (die pad portion 111) on the other side in the x direction.
  • the second lead 12 has a pad portion 121 and a plurality of second terminal portions 122 .
  • the pad portion 121 has a second lead main surface 1211 and a second lead rear surface 1212 .
  • the second lead main surface 1211 is a surface facing one side in the z direction.
  • the second lead back surface 1212 is a surface facing the other side in the z direction.
  • a connection member 31 is connected to the second lead main surface 1211 .
  • the shape of the pad portion 121 is not limited at all, and in the illustrated example, it is a rectangular shape with the y direction as the longitudinal direction.
  • the pad section 121 is smaller than the die pad section 111 when viewed in the z direction.
  • the pad portion 121 is smaller in size in the z direction than the die pad portion 111 and is the same as the first terminal portion 112 .
  • the second lead main surface 1211 has the same position in the z-direction as the first lead main surface 1111 of the die pad portion 111 .
  • the plurality of second terminal portions 122 are arranged side by side in the y direction.
  • the second terminal portion 122 has a fourth portion 1221 , a fifth portion 1222 and a sixth portion 1223 .
  • the fourth portion 1221 is connected to the pad portion 121, extends from the pad portion 121 to the other side in the x direction, and is parallel to the xy plane in the illustrated example.
  • the shape of the fourth part 1221 is not limited at all, and in the illustrated example it is rectangular when viewed in the z direction.
  • the fifth part 1222 is located on one side of the fourth part 1221 in the z direction.
  • the fifth part 1222 is used when the semiconductor device A10 is surface-mounted on a circuit board or the like.
  • the fifth portion 1222 has a shape extending along the x direction.
  • the sixth part 1223 is interposed between the fourth part 1221 and the fifth part 1222 .
  • the sixth portion 1223 extends from the fourth portion 1221 to one side in the z direction.
  • the sixth portion 1223 is tilted with respect to the z direction (yz plane).
  • the shape of the sixth portion 1223 is not limited at all, and in the illustrated example it is rectangular when viewed in the x direction.
  • the third lead 13 is located away from the first lead 11 (die pad portion 111) on the other side in the x direction. Also, the third lead 13 is aligned with the second lead 12 in the y direction. The third lead 13 has a pad portion 131 and a third terminal portion 132 .
  • the pad portion 131 has a third lead main surface 1311 and a third lead back surface 1312 .
  • the third lead main surface 1311 is a surface facing one side in the z direction.
  • the third lead back surface 1312 is a surface facing the other side in the z direction.
  • a connection member 32 is connected to the third lead main surface 1311 .
  • the shape of the pad portion 131 is not limited at all, and in the illustrated example, it is rectangular when viewed in the z direction.
  • the pad portion 131 is smaller than the pad portion 121 when viewed in the z direction.
  • the pad portion 131 is smaller in size in the z direction than the die pad portion 111 and is the same as the pad portion 121 .
  • the third lead main surface 1311 has the same position in the z-direction as the first lead main surface 1111 of the die pad section 111 .
  • the third terminal portion 132 has a seventh portion 1321 , an eighth portion 1322 and a ninth portion 1323 .
  • the seventh portion 1321 is connected to the pad portion 131, extends from the pad portion 131 to the other side in the x direction, and is parallel to the xy plane in the illustrated example.
  • the shape of the seventh part 1321 is not limited at all, and in the illustrated example it is rectangular when viewed in the z direction.
  • the eighth part 1322 is located on one side of the seventh part 1321 in the z direction.
  • the eighth part 1322 is used when the semiconductor device A10 is surface-mounted on a circuit board or the like.
  • the eighth portion 1322 has a shape extending along the x direction.
  • the ninth part 1323 is interposed between the seventh part 1321 and the eighth part 1322 .
  • the ninth portion 1323 extends from the seventh portion 1321 to one side in the z direction.
  • the ninth portion 1323 is tilted with respect to the z direction (yz plane).
  • the shape of the ninth portion 1323 is not limited at all, and in the illustrated example it is rectangular when viewed in the x direction.
  • the fourth lead 14 is located away from the first lead 11 (die pad portion 111) on the other side in the x direction. Also, the fourth lead 14 is positioned between the second lead 12 and the third lead 13 in the y direction. The fourth lead 14 has a pad portion 141 and a fourth terminal portion 142 .
  • the pad portion 141 has a fourth lead main surface 1411 and a fourth lead rear surface 1412 .
  • the fourth lead main surface 1411 is a surface facing one side in the z direction.
  • the fourth lead back surface 1412 is a surface facing the other side in the z direction.
  • a connection member 33 is connected to the fourth lead main surface 1411 .
  • the shape of the pad portion 141 is not limited at all, and in the illustrated example, it has a rectangular shape when viewed in the z direction. Also, when viewed in the z-direction, the pad portion 141 is smaller than the pad portion 121 and approximately the same size as the pad portion 131 .
  • the pad portion 141 is smaller in size in the z direction than the die pad portion 111 and is the same as the pad portion 121 and the pad portion 131 .
  • the fourth lead main surface 1411 has the same position in the z-direction as the first lead main surface 1111 of the die pad portion 111 .
  • the fourth terminal portion 142 has a tenth portion 1421 , an eleventh portion 1422 and a twelfth portion 1423 .
  • the tenth portion 1421 is connected to the pad portion 141, extends from the pad portion 141 to the other side in the x direction, and is parallel to the xy plane in the illustrated example.
  • the shape of the tenth part 1421 is not limited at all, and in the illustrated example, it is rectangular when viewed in the z direction.
  • the eleventh part 1422 is located on one side of the tenth part 1421 in the z direction.
  • the eleventh part 1422 is used when the semiconductor device A10 is surface-mounted on a circuit board or the like.
  • the eleventh part 1422 has a shape extending along the x direction.
  • the twelfth part 1423 is interposed between the tenth part 1421 and the eleventh part 1422 .
  • the twelfth portion 1423 extends from the tenth portion 1421 to one side in the z direction.
  • the twelfth portion 1423 is tilted with respect to the z direction (yz plane).
  • the shape of the twelfth portion 1423 is not limited at all, and in the illustrated example it is rectangular when viewed in the x direction.
  • Semiconductor device 20 The semiconductor element 20 is mounted on the first lead main surface 1111 of the die pad portion 111, as shown in FIGS.
  • the semiconductor element 20 is an n-channel type vertical MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor).
  • Semiconductor device 20 is not limited to a MOSFET.
  • the semiconductor element 20 may be another transistor such as an IGBT (Insulated Gate Bipolar Transistor).
  • the semiconductor element 20 may be a diode.
  • the semiconductor element 20 has a semiconductor layer 205 , a first electrode 201 , a second electrode 202 and a third electrode 203 .
  • the semiconductor layer 205 includes a compound semiconductor substrate.
  • the main material of compound semiconductor substrates is silicon carbide (SiC).
  • silicon (Si) may be used as the main material of the compound semiconductor substrate.
  • the first electrode 201 is provided on the side (one side) of the semiconductor layer 205 facing the first lead main surface 1111 of the die pad portion 111 of the first lead 11 in the z direction.
  • the first electrode 201 corresponds to the source electrode of the semiconductor element 20 .
  • the second electrode 202 is provided on a portion of the semiconductor layer 205 opposite to the first electrode 201 in the z direction.
  • the second electrode 202 faces the first lead main surface 1111 of the die pad portion 111 of the first lead 11 .
  • the second electrode 202 corresponds to the drain electrode of the semiconductor element 20 .
  • the second electrode 202 is bonded to the first lead main surface 1111 via the bonding layer 29 .
  • the bonding layer 29 is, for example, solder, silver (Ag) paste, baked silver, or the like.
  • the third electrode 203 is provided on the same side of the semiconductor layer 205 as the first electrode 201 in the z-direction, and is located away from the first electrode 201 .
  • the third electrode 203 corresponds to the gate electrode of the semiconductor element 20 . Viewed in the z-direction, the area of the third electrode 203 is smaller than the area of the first electrode 201 .
  • connection members 31, 32, 33 The connection member 31 is joined to the first electrode 201 of the semiconductor element 20 and the second lead main surface 1211 of the pad portion 121 of the second lead 12 .
  • the material of the connection member 31 is not limited at all, and includes metals such as aluminum (Al), copper (Cu), and gold (Au).
  • the number of connection members 31 is not limited at all, and a plurality of connection members 31 may be provided.
  • the connection member 31 is a flat strip-shaped member containing aluminum (Al).
  • connection member 32 is connected to the third electrode 203 of the semiconductor element 20 and the third lead main surface 1311 of the pad portion 131 of the third lead 13 .
  • the connection member 32 is a linear member containing gold (Au) and thinner than the connection member 31 .
  • connection member 33 is connected to the first electrode 201 of the semiconductor element 20 and the fourth lead main surface 1411 of the pad portion 141 of the fourth lead 14 .
  • the connection member 33 is a linear member containing gold (Au) and thinner than the connection member 31 .
  • the first terminal portion 112 of the first lead 11 is the drain terminal
  • the second terminal portion 122 of the second lead 12 is the source terminal
  • the third terminal portion 132 of the third lead 13 is the drain terminal.
  • the fourth terminal portion 142 of the fourth lead 14 is a source sense terminal.
  • Sealing resin 40 As shown in FIGS. 1 to 15, the sealing resin 40 includes the semiconductor element 20, the connection members 31, 32, and 33, and one of the first lead 11, second lead 12, third lead 13, and fourth lead . Each part is covered.
  • the sealing resin 40 has electrical insulation.
  • Sealing resin 40 is made of a material containing, for example, black epoxy resin.
  • the sealing resin 40 has a first resin surface 41 , a second resin surface 42 , a third resin surface 43 , a fourth resin surface 44 , a fifth resin surface 45 and a sixth resin surface 46 .
  • the first resin surface 41 faces the same side (one side) as the first lead main surface 1111 of the die pad portion 111 of the first lead 11 in the z direction.
  • the second resin surface 42 faces the opposite side (the other side) of the first resin surface 41 in the z direction.
  • the first lead rear surface 1112 of the die pad portion 111 of the first lead 11 is exposed from the second resin surface 42 .
  • the second resin surface 42 and the first lead back surface 1112 are flush with each other.
  • the third resin surface 43 faces one side in the x direction.
  • the first lead back surface 1112 has a portion located on one side in the x direction from the third resin surface 43 when viewed in the z direction. That is, part of the first lead back surface 1112 protrudes from the third resin surface 43 to one side in the x direction.
  • the first lead side surface 1113 of the die pad portion 111 is located on one side in the x direction with respect to the third resin surface 43 .
  • the fourth resin surface 44 faces the opposite side (the other side) of the third resin surface 43 in the x direction.
  • the second terminal portion 122 of the plurality of second terminal portions 122 of the second lead 12, the seventh portion 1321 of the third terminal portion 132 of the third lead 13, and the fourth terminal portion of the fourth lead 14 A tenth portion 1421 of 142 passes through the fourth resin surface 44 .
  • the fifth resin surface 45 and the sixth resin surface 46 are surfaces facing opposite to each other in the y direction.
  • the sealing resin 40 has grooves 49 .
  • the groove 49 is recessed in the x direction from the second resin surface 42 and extends along the y direction.
  • the groove 49 reaches the fifth resin surface 45 and the sixth resin surface 46 .
  • the groove 49 is positioned between the first lead back surface 1112 and the fourth resin surface 44 .
  • the sealing resin 40 has two recesses 47 .
  • One recessed portion 47 is recessed from the first resin surface 41 and the fifth resin surface 45 .
  • the other recess 47 is recessed from 41 and sixth resin surface 46 .
  • a portion of the first lead main surface 1111 is exposed from the recess 47 .
  • FIG. 15 shows the state of use of the semiconductor device A10.
  • the semiconductor device A10 is surface-mounted on the circuit board 92 . That is, the second portion 1122 of the first terminal portion 112, the fifth portion 1222 of the second terminal portion 122, the eighth portion 1322 of the third terminal portion 132, and the eleventh portion 1422 of the fourth terminal portion 142 are solder 921, for example. are conductively connected to the wiring pattern (not shown) of the circuit board 92 by means of the .
  • a heat sink 91 is arranged opposite to the back surface 1112 of the first lead of the die pad section 111 .
  • a sheet material 919 is arranged between the first lead back surface 1112 and the heat sink 91 .
  • Sheet material 919 is, for example, an insulating sheet.
  • the first lead back surface 1112 is exposed from the second resin surface 42 .
  • a heat sink 91 can be arranged opposite to the back surface 1112 of the first lead.
  • the first lead back surface 1112 has a portion that protrudes from the third resin surface 43 to one side in the x direction. This makes it possible to increase the area of the first lead back surface 1112 facing the heat sink 91 . Therefore, the heat dissipation efficiency from the semiconductor device A10 to the heat sink 91 can be improved.
  • the second portion 1122 is located on one side in the z direction relative to the first portion 1121 . As a result, the semiconductor device A10 can be surface-mounted on the circuit board 92 or the like using the second portion 1122 .
  • the die pad section 111 has a plurality of first terminal sections 112 . Thereby, the mounting strength of the semiconductor device A10 can be increased.
  • the size of the first portion 1121 in the y direction is smaller than the size of the die pad portion 111 in the y direction. Thereby, the holding force of the first lead 11 by the sealing resin 40 can be further enhanced.
  • the die pad portion 111 is larger in size in the z direction than the first portion 1121 .
  • the heat can be transferred over a wider range in the x and y directions. Therefore, the wider area of the first portion 1121 allows the heat from the semiconductor element 20 to be dissipated to the heat sink 91 or the like, and heat dissipation efficiency can be improved.
  • One side of the first portion 1121 is flush with the first lead main surface 1111 . This makes it possible to increase the distance from the first portion 1121 to the third resin surface 43 in the z-direction, and suppress interference between the heat sink 91 and the like and the first terminal portion 112 .
  • a groove 49 is formed in the sealing resin 40 .
  • the surface of the sealing resin 40 from the first lead back surface 1112 to the second lead 12 (fourth portion 1221), the third lead 13 (seventh portion 1321) and the fourth lead 14 (tenth portion 1421) is formed. can extend the distance along the
  • First embodiment First modification 16 and 17 show a first modification of the semiconductor device A10.
  • the relationship between the second portion 1122, the fifth portion 1222, the eighth portion 1322, the eleventh portion 1422, and the first resin surface 41 is different from the example described above.
  • the second portion 1122, the fifth portion 1222, the eighth portion 1322, and the eleventh portion 1422 are arranged on the other side of the first resin surface 41 in the z direction (the side to which the first lead back surface 1112 faces). positioned. The ends of the second portion 1122, the fifth portion 1222, the eighth portion 1322, and the eleventh portion 1422 on one side in the z direction are separated from the first resin surface 41 by a distance Gz.
  • the semiconductor device A11 can be surface-mounted, and the same effect as the semiconductor device A10 can be obtained. Further, the first resin surface 41 protrudes from the second portion 1122, the fifth portion 1222, the eighth portion 1322, and the eleventh portion 1422 to one side in the z direction by a distance Gz. Therefore, in the state of use of the semiconductor device A11 shown in FIG. 17, when the heat sink 91 is pressed against the semiconductor device A11, the first resin surface 41 is likely to come into contact with the circuit board 92 . Thereby, the force applied from the heat sink 91 can be suppressed from acting on the first lead 11 , the second lead 12 , the third lead 13 and the fourth lead 14 and the semiconductor element 20 .
  • First Embodiment Second Modification 18 and 19 show a second modification of the semiconductor device A10.
  • the semiconductor device A12 of this modified example two grooves 49 are provided in the sealing resin 40 .
  • Each groove 49 extends in the y direction and reaches the fifth resin surface 45 and the sixth resin surface 46 . Also, the two grooves 49 are spaced apart in the x direction.
  • the semiconductor device A12 can be surface-mounted, and the same effect as the above-described example can be obtained. Moreover, by having two grooves 49, the creeping distance between the first lead back surface 1112 and the second terminal portion 122, the third terminal portion 132 and the fourth terminal portion 142 can be further extended. As understood from this modified example, the number of grooves 49 is not limited at all.
  • First Embodiment Third Modification 20 and 21 show a third modification of the semiconductor device A10.
  • a convex portion 48 is provided on the sealing resin 40 .
  • the convex portion 48 protrudes from the second resin surface 42 to the other side in the z direction.
  • the protrusion 48 extends along the y direction and reaches the fifth resin surface 45 and the sixth resin surface 46 .
  • the convex portion 48 is arranged at the other end of the sealing resin 40 in the x direction and is in contact with the fourth resin surface 44 .
  • the semiconductor device A13 can be surface-mounted. Moreover, by having the convex portion 48, the creepage distance between the first lead back surface 1112 and the second terminal portion 122, the third terminal portion 132, and the fourth terminal portion 142 can be extended.
  • FIG. 22 shows a fourth modification of the semiconductor device A10.
  • the sealing resin 40 does not have the convex portion 48 and the groove 49 described above. This modification also allows the semiconductor device A14 to be surface-mounted. Further, as understood from this modified example, the sealing resin 40 may be configured without the projections 48 and the grooves 49 .
  • FIG. 23 shows a semiconductor device according to a second embodiment of the present disclosure.
  • the semiconductor device A20 of this embodiment does not include the connection members 31, 32, and 33 described above.
  • the second lead rear surface 1212 of the pad portion 121 of the second lead 12 is conductively joined to the first electrode 201 of the semiconductor element 20 .
  • the third lead rear surface 1312 of the pad portion 131 of the third lead 13 is conductively joined to the third electrode 203 of the semiconductor element 20 .
  • the fourth lead rear surface 1412 of the pad portion 141 of the fourth lead 14 is conductively joined to the first electrode 201 of the semiconductor element 20 .
  • the semiconductor device A20 can be surface-mounted.
  • the specific form of conduction between the second lead 12, the third lead 13 and the fourth lead 14 and the semiconductor element 20 is not limited at all.
  • the semiconductor device according to the present disclosure is not limited to the above-described embodiments.
  • the specific configuration of each part of the semiconductor device according to the present disclosure can be changed in various ways.
  • the present disclosure includes embodiments described in the appendices below.
  • Appendix 1 a semiconductor element; A first lead including: a first terminal portion; and, The semiconductor has a first resin surface facing one side in the thickness direction, a second resin surface facing the other side in the thickness direction, and a third resin surface facing one side in a first direction orthogonal to the thickness direction. a sealing resin that covers the element and a part of the die pad, A semiconductor device, wherein the back surface of the first lead has a portion exposed from the second resin surface and located on one side in the first direction from the third resin surface when viewed in the thickness direction.
  • Appendix 2. The semiconductor device according to appendix 1, wherein the back surface of the first lead is flush with the second resin surface.
  • the die pad section has a first lead side surface facing one side in the first direction, 3.
  • Appendix 11. The semiconductor device according to appendix 10, wherein one surface of the first part is flush with the main surface of the first lead. Appendix 12.
  • connection member connected to the semiconductor element; a second lead that is positioned on the other side in the first direction with respect to the first lead and includes a pad portion that has a second lead main surface facing the one side in the thickness direction;
  • the connecting member is connected to the main surface of the second lead, 12.
  • the semiconductor device according to any one of appendices 5 to 11, wherein the first lead main surface and the second lead main surface have the same position in the thickness direction.
  • Appendix 13 The sealing resin has a fourth resin surface facing the other side of the first direction, 13.
  • the second terminal portion includes a fifth portion located on one side in the thickness direction with respect to the fourth portion and used for mounting, and a sixth terminal portion interposed between the fourth portion and the fifth portion.
  • the semiconductor device according to Appendix 13 having a portion.
  • Appendix 15. The semiconductor device according to appendix 14, wherein the second portion of the first terminal portion and the fifth portion of the second terminal portion are positioned on the other side in the thickness direction with respect to the first resin surface.
  • Appendix 16. 16 The semiconductor device according to any one of appendices 1 to 15, wherein the sealing resin has a groove recessed in the thickness direction from the second resin surface.
  • Appendix 17. 17 The semiconductor device according to any one of appendices 1 to 16, wherein the sealing resin has a protrusion projecting in the thickness direction from the second resin surface.

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PCT/JP2022/042795 2021-12-01 2022-11-18 半導体装置 Ceased WO2023100681A1 (ja)

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CN202280079006.5A CN118318301A (zh) 2021-12-01 2022-11-18 半导体装置
JP2023564880A JPWO2023100681A1 (https=) 2021-12-01 2022-11-18
DE112022005222.8T DE112022005222T5 (de) 2021-12-01 2022-11-18 Halbleiterbauteil
US18/649,331 US20240282676A1 (en) 2021-12-01 2024-04-29 Semiconductor device

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JP2021195178 2021-12-01
JP2021-195178 2021-12-01

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US18/649,331 Continuation US20240282676A1 (en) 2021-12-01 2024-04-29 Semiconductor device

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150602A (ja) * 2003-11-19 2005-06-09 Denso Corp 半導体装置
JP2007073743A (ja) * 2005-09-07 2007-03-22 Denso Corp 半導体装置
JP2016072376A (ja) * 2014-09-29 2016-05-09 ルネサスエレクトロニクス株式会社 半導体装置
JP2017147433A (ja) * 2015-12-16 2017-08-24 ローム株式会社 半導体装置
US20190355643A1 (en) * 2018-05-18 2019-11-21 Infineon Technologies Ag Wire Bonded Package with Single Piece Exposed Heat Slug and Leads
WO2020255663A1 (ja) * 2019-06-20 2020-12-24 ローム株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6653199B2 (ja) 2016-03-23 2020-02-26 ローム株式会社 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150602A (ja) * 2003-11-19 2005-06-09 Denso Corp 半導体装置
JP2007073743A (ja) * 2005-09-07 2007-03-22 Denso Corp 半導体装置
JP2016072376A (ja) * 2014-09-29 2016-05-09 ルネサスエレクトロニクス株式会社 半導体装置
JP2017147433A (ja) * 2015-12-16 2017-08-24 ローム株式会社 半導体装置
US20190355643A1 (en) * 2018-05-18 2019-11-21 Infineon Technologies Ag Wire Bonded Package with Single Piece Exposed Heat Slug and Leads
WO2020255663A1 (ja) * 2019-06-20 2020-12-24 ローム株式会社 半導体装置及び半導体装置の製造方法

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US20240282676A1 (en) 2024-08-22

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