JPWO2025115059A1 - - Google Patents
Info
- Publication number
- JPWO2025115059A1 JPWO2025115059A1 JP2025560384A JP2025560384A JPWO2025115059A1 JP WO2025115059 A1 JPWO2025115059 A1 JP WO2025115059A1 JP 2025560384 A JP2025560384 A JP 2025560384A JP 2025560384 A JP2025560384 A JP 2025560384A JP WO2025115059 A1 JPWO2025115059 A1 JP WO2025115059A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/042326 WO2025115059A1 (ja) | 2023-11-27 | 2023-11-27 | 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025115059A1 true JPWO2025115059A1 (https=) | 2025-06-05 |
| JPWO2025115059A5 JPWO2025115059A5 (https=) | 2026-04-22 |
Family
ID=95896453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025560384A Pending JPWO2025115059A1 (https=) | 2023-11-27 | 2023-11-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025115059A1 (https=) |
| WO (1) | WO2025115059A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011253950A (ja) * | 2010-06-02 | 2011-12-15 | Mitsubishi Electric Corp | 電力半導体装置 |
| JP2016029676A (ja) * | 2012-12-19 | 2016-03-03 | 富士電機株式会社 | 半導体装置 |
| JP6485397B2 (ja) * | 2016-04-04 | 2019-03-20 | 株式会社デンソー | 電子装置及びその製造方法 |
| JP6696480B2 (ja) * | 2017-03-22 | 2020-05-20 | 株式会社デンソー | 半導体装置 |
| US20210280551A1 (en) * | 2018-09-07 | 2021-09-09 | Rohm Co., Ltd. | Bonding structure, semiconductor device, and bonding structure formation method |
| JP7363682B2 (ja) * | 2020-06-26 | 2023-10-18 | 株式会社デンソー | 半導体装置 |
| CN114787991A (zh) * | 2020-06-30 | 2022-07-22 | 富士电机株式会社 | 半导体模块以及半导体模块的制造方法 |
| JP7647914B2 (ja) * | 2021-10-22 | 2025-03-18 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| WO2023140042A1 (ja) * | 2022-01-20 | 2023-07-27 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-11-27 JP JP2025560384A patent/JPWO2025115059A1/ja active Pending
- 2023-11-27 WO PCT/JP2023/042326 patent/WO2025115059A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025115059A1 (ja) | 2025-06-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260122 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260122 |