JPWO2025115059A5 - - Google Patents

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Publication number
JPWO2025115059A5
JPWO2025115059A5 JP2025560384A JP2025560384A JPWO2025115059A5 JP WO2025115059 A5 JPWO2025115059 A5 JP WO2025115059A5 JP 2025560384 A JP2025560384 A JP 2025560384A JP 2025560384 A JP2025560384 A JP 2025560384A JP WO2025115059 A5 JPWO2025115059 A5 JP WO2025115059A5
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JP
Japan
Prior art keywords
recesses
metal plate
circuit board
manufacturing
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025560384A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025115059A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/042326 external-priority patent/WO2025115059A1/ja
Publication of JPWO2025115059A1 publication Critical patent/JPWO2025115059A1/ja
Publication of JPWO2025115059A5 publication Critical patent/JPWO2025115059A5/ja
Pending legal-status Critical Current

Links

JP2025560384A 2023-11-27 2023-11-27 Pending JPWO2025115059A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/042326 WO2025115059A1 (ja) 2023-11-27 2023-11-27 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025115059A1 JPWO2025115059A1 (https=) 2025-06-05
JPWO2025115059A5 true JPWO2025115059A5 (https=) 2026-04-22

Family

ID=95896453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025560384A Pending JPWO2025115059A1 (https=) 2023-11-27 2023-11-27

Country Status (2)

Country Link
JP (1) JPWO2025115059A1 (https=)
WO (1) WO2025115059A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253950A (ja) * 2010-06-02 2011-12-15 Mitsubishi Electric Corp 電力半導体装置
JP2016029676A (ja) * 2012-12-19 2016-03-03 富士電機株式会社 半導体装置
JP6485397B2 (ja) * 2016-04-04 2019-03-20 株式会社デンソー 電子装置及びその製造方法
JP6696480B2 (ja) * 2017-03-22 2020-05-20 株式会社デンソー 半導体装置
US20210280551A1 (en) * 2018-09-07 2021-09-09 Rohm Co., Ltd. Bonding structure, semiconductor device, and bonding structure formation method
JP7363682B2 (ja) * 2020-06-26 2023-10-18 株式会社デンソー 半導体装置
CN114787991A (zh) * 2020-06-30 2022-07-22 富士电机株式会社 半导体模块以及半导体模块的制造方法
JP7647914B2 (ja) * 2021-10-22 2025-03-18 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
WO2023140042A1 (ja) * 2022-01-20 2023-07-27 ローム株式会社 半導体装置

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