JPWO2023080083A5 - - Google Patents
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- Publication number
- JPWO2023080083A5 JPWO2023080083A5 JP2023558008A JP2023558008A JPWO2023080083A5 JP WO2023080083 A5 JPWO2023080083 A5 JP WO2023080083A5 JP 2023558008 A JP2023558008 A JP 2023558008A JP 2023558008 A JP2023558008 A JP 2023558008A JP WO2023080083 A5 JPWO2023080083 A5 JP WO2023080083A5
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- semiconductor device
- insulating film
- recess
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181314 | 2021-11-05 | ||
| PCT/JP2022/040495 WO2023080083A1 (ja) | 2021-11-05 | 2022-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080083A1 JPWO2023080083A1 (https=) | 2023-05-11 |
| JPWO2023080083A5 true JPWO2023080083A5 (https=) | 2024-07-24 |
Family
ID=86241067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023558008A Pending JPWO2023080083A1 (https=) | 2021-11-05 | 2022-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240290673A1 (https=) |
| JP (1) | JPWO2023080083A1 (https=) |
| CN (1) | CN118160100A (https=) |
| DE (1) | DE112022004870T5 (https=) |
| WO (1) | WO2023080083A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20260053057A1 (en) * | 2024-08-16 | 2026-02-19 | Wolfspeed, Inc. | Encapsulation delamination prevention structures at die edge |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013239607A (ja) * | 2012-05-16 | 2013-11-28 | Mitsubishi Electric Corp | 半導体装置 |
| JP6846687B2 (ja) | 2017-09-12 | 2021-03-24 | パナソニックＩｐマネジメント株式会社 | 半導体装置およびその製造方法 |
| CN113016067B (zh) * | 2018-11-15 | 2024-02-02 | 罗姆股份有限公司 | 半导体器件 |
| JP7508858B2 (ja) | 2020-05-18 | 2024-07-02 | 東洋製罐グループホールディングス株式会社 | 二重容器、二重容器の製造方法及び二重プリフォーム |
| US20230335633A1 (en) * | 2021-03-18 | 2023-10-19 | Rohm Co., Ltd. | Wide bandgap semiconductor device |
-
2022
- 2022-10-28 DE DE112022004870.0T patent/DE112022004870T5/de active Pending
- 2022-10-28 JP JP2023558008A patent/JPWO2023080083A1/ja active Pending
- 2022-10-28 WO PCT/JP2022/040495 patent/WO2023080083A1/ja not_active Ceased
- 2022-10-28 CN CN202280073021.9A patent/CN118160100A/zh active Pending
-
2024
- 2024-05-01 US US18/651,728 patent/US20240290673A1/en active Pending
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