JPWO2023080087A5 - - Google Patents
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- Publication number
- JPWO2023080087A5 JPWO2023080087A5 JP2023558012A JP2023558012A JPWO2023080087A5 JP WO2023080087 A5 JPWO2023080087 A5 JP WO2023080087A5 JP 2023558012 A JP2023558012 A JP 2023558012A JP 2023558012 A JP2023558012 A JP 2023558012A JP WO2023080087 A5 JPWO2023080087 A5 JP WO2023080087A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- terminal
- film
- based metal
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 239000002184 metal Substances 0.000 claims 12
- 239000012212 insulator Substances 0.000 claims 8
- 238000007789 sealing Methods 0.000 claims 7
- 239000010410 layer Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181318 | 2021-11-05 | ||
| PCT/JP2022/040499 WO2023080087A1 (ja) | 2021-11-05 | 2022-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080087A1 JPWO2023080087A1 (https=) | 2023-05-11 |
| JPWO2023080087A5 true JPWO2023080087A5 (https=) | 2024-07-24 |
Family
ID=86241069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023558012A Pending JPWO2023080087A1 (https=) | 2021-11-05 | 2022-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282836A1 (https=) |
| JP (1) | JPWO2023080087A1 (https=) |
| CN (1) | CN118176589A (https=) |
| DE (1) | DE112022004839T5 (https=) |
| WO (1) | WO2023080087A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5594215B2 (ja) * | 2011-03-31 | 2014-09-24 | 日本ゼオン株式会社 | 半導体装置及びその製造方法 |
| JP2017143126A (ja) * | 2016-02-09 | 2017-08-17 | ローム株式会社 | 電子装置および受発光装置 |
| JP7201296B2 (ja) * | 2018-02-06 | 2023-01-10 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP6930495B2 (ja) * | 2018-05-18 | 2021-09-01 | 株式会社デンソー | 半導体装置 |
| CN115485858A (zh) * | 2020-05-08 | 2022-12-16 | 罗姆股份有限公司 | 半导体装置 |
| JP2021181318A (ja) | 2020-05-18 | 2021-11-25 | 共同印刷株式会社 | 包装用吸湿フィルム |
| CN116830262A (zh) * | 2021-03-18 | 2023-09-29 | 罗姆股份有限公司 | 宽带隙半导体装置 |
-
2022
- 2022-10-28 WO PCT/JP2022/040499 patent/WO2023080087A1/ja not_active Ceased
- 2022-10-28 DE DE112022004839.5T patent/DE112022004839T5/de active Pending
- 2022-10-28 JP JP2023558012A patent/JPWO2023080087A1/ja active Pending
- 2022-10-28 CN CN202280072909.0A patent/CN118176589A/zh active Pending
-
2024
- 2024-05-03 US US18/654,238 patent/US20240282836A1/en active Pending
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