JPWO2023080086A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023080086A5
JPWO2023080086A5 JP2023558011A JP2023558011A JPWO2023080086A5 JP WO2023080086 A5 JPWO2023080086 A5 JP WO2023080086A5 JP 2023558011 A JP2023558011 A JP 2023558011A JP 2023558011 A JP2023558011 A JP 2023558011A JP WO2023080086 A5 JPWO2023080086 A5 JP WO2023080086A5
Authority
JP
Japan
Prior art keywords
semiconductor device
pillar electrodes
electrode
main surface
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023558011A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023080086A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/040498 external-priority patent/WO2023080086A1/ja
Publication of JPWO2023080086A1 publication Critical patent/JPWO2023080086A1/ja
Publication of JPWO2023080086A5 publication Critical patent/JPWO2023080086A5/ja
Pending legal-status Critical Current

Links

Images

JP2023558011A 2021-11-05 2022-10-28 Pending JPWO2023080086A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021181317 2021-11-05
PCT/JP2022/040498 WO2023080086A1 (ja) 2021-11-05 2022-10-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023080086A1 JPWO2023080086A1 (https=) 2023-05-11
JPWO2023080086A5 true JPWO2023080086A5 (https=) 2024-07-24

Family

ID=86241141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023558011A Pending JPWO2023080086A1 (https=) 2021-11-05 2022-10-28

Country Status (5)

Country Link
US (1) US20240282749A1 (https=)
JP (1) JPWO2023080086A1 (https=)
CN (1) CN118176591A (https=)
DE (1) DE112022004821T5 (https=)
WO (1) WO2023080086A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5594215B2 (ja) * 2011-03-31 2014-09-24 日本ゼオン株式会社 半導体装置及びその製造方法
JP2015222743A (ja) * 2014-05-22 2015-12-10 三菱電機株式会社 半導体装置
JP2017143126A (ja) * 2016-02-09 2017-08-17 ローム株式会社 電子装置および受発光装置
JP7201296B2 (ja) * 2018-02-06 2023-01-10 ローム株式会社 半導体装置およびその製造方法
CN115485858A (zh) * 2020-05-08 2022-12-16 罗姆股份有限公司 半导体装置
JP7473391B2 (ja) 2020-05-18 2024-04-23 岩井ファルマテック株式会社 陽圧監視システム
US20230335633A1 (en) * 2021-03-18 2023-10-19 Rohm Co., Ltd. Wide bandgap semiconductor device

Similar Documents

Publication Publication Date Title
JP2024020477A5 (https=)
JP2023138517A5 (ja) 表示装置
JP2025123527A5 (https=)
JP2008227531A5 (https=)
US10211130B2 (en) Semiconductor device
JP2004500720A5 (https=)
JP2007194663A5 (https=)
JPWO2023080086A5 (https=)
JPWO2023080092A5 (https=)
JPWO2023166378A5 (https=)
JPWO2023140042A5 (https=)
JPWO2023080083A5 (https=)
JP6579653B2 (ja) 半導体装置および半導体装置の製造方法
US10991680B2 (en) Common source land grid array package
JPWO2023080087A5 (https=)
TWI754535B (zh) 封裝結構
JPWO2024101131A5 (https=)
JPWO2023243556A5 (https=)
JPWO2024143378A5 (https=)
JPWO2023171464A5 (https=)
JPWO2023080082A5 (https=)
US9245831B1 (en) Top-exposed semiconductor package and the manufacturing method
JPWO2024029336A5 (https=)
JPWO2023080088A5 (https=)
CN114823817A (zh) 显示面板及显示装置