JPWO2023080088A5 - - Google Patents
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- Publication number
- JPWO2023080088A5 JPWO2023080088A5 JP2023558013A JP2023558013A JPWO2023080088A5 JP WO2023080088 A5 JPWO2023080088 A5 JP WO2023080088A5 JP 2023558013 A JP2023558013 A JP 2023558013A JP 2023558013 A JP2023558013 A JP 2023558013A JP WO2023080088 A5 JPWO2023080088 A5 JP WO2023080088A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- fillers
- insulating film
- thicker
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181319 | 2021-11-05 | ||
| PCT/JP2022/040500 WO2023080088A1 (ja) | 2021-11-05 | 2022-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080088A1 JPWO2023080088A1 (https=) | 2023-05-11 |
| JPWO2023080088A5 true JPWO2023080088A5 (https=) | 2024-07-24 |
Family
ID=86241094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023558013A Pending JPWO2023080088A1 (https=) | 2021-11-05 | 2022-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240297088A1 (https=) |
| JP (1) | JPWO2023080088A1 (https=) |
| CN (1) | CN118176587A (https=) |
| DE (1) | DE112022004626T5 (https=) |
| WO (1) | WO2023080088A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7758340B2 (ja) * | 2022-03-07 | 2025-10-22 | 住友電工デバイス・イノベーション株式会社 | キャパシタの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013239607A (ja) * | 2012-05-16 | 2013-11-28 | Mitsubishi Electric Corp | 半導体装置 |
| JP6846687B2 (ja) | 2017-09-12 | 2021-03-24 | パナソニックＩｐマネジメント株式会社 | 半導体装置およびその製造方法 |
| CN113016067B (zh) * | 2018-11-15 | 2024-02-02 | 罗姆股份有限公司 | 半导体器件 |
| JP7532888B2 (ja) | 2020-05-18 | 2024-08-14 | 東洋製罐株式会社 | 合成樹脂製容器 |
| US20230335633A1 (en) * | 2021-03-18 | 2023-10-19 | Rohm Co., Ltd. | Wide bandgap semiconductor device |
-
2022
- 2022-10-28 WO PCT/JP2022/040500 patent/WO2023080088A1/ja not_active Ceased
- 2022-10-28 DE DE112022004626.0T patent/DE112022004626T5/de active Pending
- 2022-10-28 CN CN202280072799.8A patent/CN118176587A/zh active Pending
- 2022-10-28 JP JP2023558013A patent/JPWO2023080088A1/ja active Pending
-
2024
- 2024-05-03 US US18/654,623 patent/US20240297088A1/en active Pending
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