JPWO2023080088A5 - - Google Patents

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Publication number
JPWO2023080088A5
JPWO2023080088A5 JP2023558013A JP2023558013A JPWO2023080088A5 JP WO2023080088 A5 JPWO2023080088 A5 JP WO2023080088A5 JP 2023558013 A JP2023558013 A JP 2023558013A JP 2023558013 A JP2023558013 A JP 2023558013A JP WO2023080088 A5 JPWO2023080088 A5 JP WO2023080088A5
Authority
JP
Japan
Prior art keywords
semiconductor device
fillers
insulating film
thicker
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023558013A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023080088A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/040500 external-priority patent/WO2023080088A1/ja
Publication of JPWO2023080088A1 publication Critical patent/JPWO2023080088A1/ja
Publication of JPWO2023080088A5 publication Critical patent/JPWO2023080088A5/ja
Pending legal-status Critical Current

Links

JP2023558013A 2021-11-05 2022-10-28 Pending JPWO2023080088A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021181319 2021-11-05
PCT/JP2022/040500 WO2023080088A1 (ja) 2021-11-05 2022-10-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023080088A1 JPWO2023080088A1 (https=) 2023-05-11
JPWO2023080088A5 true JPWO2023080088A5 (https=) 2024-07-24

Family

ID=86241094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023558013A Pending JPWO2023080088A1 (https=) 2021-11-05 2022-10-28

Country Status (5)

Country Link
US (1) US20240297088A1 (https=)
JP (1) JPWO2023080088A1 (https=)
CN (1) CN118176587A (https=)
DE (1) DE112022004626T5 (https=)
WO (1) WO2023080088A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7758340B2 (ja) * 2022-03-07 2025-10-22 住友電工デバイス・イノベーション株式会社 キャパシタの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013239607A (ja) * 2012-05-16 2013-11-28 Mitsubishi Electric Corp 半導体装置
JP6846687B2 (ja) 2017-09-12 2021-03-24 パナソニックＩｐマネジメント株式会社 半導体装置およびその製造方法
JP7384820B2 (ja) * 2018-11-15 2023-11-21 ローム株式会社 半導体装置
JP7532888B2 (ja) 2020-05-18 2024-08-14 東洋製罐株式会社 合成樹脂製容器
CN116830262A (zh) * 2021-03-18 2023-09-29 罗姆股份有限公司 宽带隙半导体装置

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