JPWO2023080090A5 - - Google Patents

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Publication number
JPWO2023080090A5
JPWO2023080090A5 JP2023558015A JP2023558015A JPWO2023080090A5 JP WO2023080090 A5 JPWO2023080090 A5 JP WO2023080090A5 JP 2023558015 A JP2023558015 A JP 2023558015A JP 2023558015 A JP2023558015 A JP 2023558015A JP WO2023080090 A5 JPWO2023080090 A5 JP WO2023080090A5
Authority
JP
Japan
Prior art keywords
fillers
semiconductor package
sectional area
matrix resin
package according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023558015A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023080090A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/040502 external-priority patent/WO2023080090A1/ja
Publication of JPWO2023080090A1 publication Critical patent/JPWO2023080090A1/ja
Publication of JPWO2023080090A5 publication Critical patent/JPWO2023080090A5/ja
Pending legal-status Critical Current

Links

JP2023558015A 2021-11-05 2022-10-28 Pending JPWO2023080090A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021181321 2021-11-05
PCT/JP2022/040502 WO2023080090A1 (ja) 2021-11-05 2022-10-28 半導体パッケージ

Publications (2)

Publication Number Publication Date
JPWO2023080090A1 JPWO2023080090A1 (https=) 2023-05-11
JPWO2023080090A5 true JPWO2023080090A5 (https=) 2024-07-24

Family

ID=86241131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023558015A Pending JPWO2023080090A1 (https=) 2021-11-05 2022-10-28

Country Status (5)

Country Link
US (1) US20240282682A1 (https=)
JP (1) JPWO2023080090A1 (https=)
CN (1) CN118176578A (https=)
DE (1) DE112022004806T5 (https=)
WO (1) WO2023080090A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0870081A (ja) * 1994-08-29 1996-03-12 Nippondenso Co Ltd Ｉｃパッケージおよびその製造方法
JP5384913B2 (ja) * 2008-11-18 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JPWO2012133098A1 (ja) * 2011-03-31 2014-07-28 日本ゼオン株式会社 半導体装置及びその製造方法
JP6168153B2 (ja) * 2013-09-13 2017-07-26 富士電機株式会社 半導体装置
WO2017047283A1 (ja) * 2015-09-17 2017-03-23 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2019212730A (ja) * 2018-06-04 2019-12-12 住友電気工業株式会社 半導体装置
JP7119817B2 (ja) * 2018-09-18 2022-08-17 昭和電工マテリアルズ株式会社 半導体装置
JP7382277B2 (ja) 2020-05-18 2023-11-16 サントリーホールディングス株式会社 飲料供給システムのための監視装置及び監視方法並びにプログラム

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