JPWO2023080084A5 - - Google Patents

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Publication number
JPWO2023080084A5
JPWO2023080084A5 JP2023558009A JP2023558009A JPWO2023080084A5 JP WO2023080084 A5 JPWO2023080084 A5 JP WO2023080084A5 JP 2023558009 A JP2023558009 A JP 2023558009A JP 2023558009 A JP2023558009 A JP 2023558009A JP WO2023080084 A5 JPWO2023080084 A5 JP WO2023080084A5
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
terminal
sealing insulator
principal surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023558009A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023080084A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/040496 external-priority patent/WO2023080084A1/ja
Publication of JPWO2023080084A1 publication Critical patent/JPWO2023080084A1/ja
Publication of JPWO2023080084A5 publication Critical patent/JPWO2023080084A5/ja
Pending legal-status Critical Current

Links

JP2023558009A 2021-11-05 2022-10-28 Pending JPWO2023080084A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021181316 2021-11-05
PCT/JP2022/040496 WO2023080084A1 (ja) 2021-11-05 2022-10-28 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023080084A1 JPWO2023080084A1 (https=) 2023-05-11
JPWO2023080084A5 true JPWO2023080084A5 (https=) 2024-07-24

Family

ID=86241130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023558009A Pending JPWO2023080084A1 (https=) 2021-11-05 2022-10-28

Country Status (5)

Country Link
US (1) US20240282657A1 (https=)
JP (1) JPWO2023080084A1 (https=)
CN (1) CN118202471A (https=)
DE (1) DE112022004811T5 (https=)
WO (1) WO2023080084A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013239607A (ja) * 2012-05-16 2013-11-28 Mitsubishi Electric Corp 半導体装置
DK179513B1 (en) 2017-10-23 2019-02-04 Suntherm Aps PHASE CHANGE MATERIAL-BASED HEATING SYSTEM
CN113016067B (zh) * 2018-11-15 2024-02-02 罗姆股份有限公司 半导体器件
JP7563725B2 (ja) 2020-05-18 2024-10-08 株式会社プレッシオ 包装機
US20230335633A1 (en) * 2021-03-18 2023-10-19 Rohm Co., Ltd. Wide bandgap semiconductor device

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