JPWO2023080081A5 - - Google Patents
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- Publication number
- JPWO2023080081A5 JPWO2023080081A5 JP2023558006A JP2023558006A JPWO2023080081A5 JP WO2023080081 A5 JPWO2023080081 A5 JP WO2023080081A5 JP 2023558006 A JP2023558006 A JP 2023558006A JP 2023558006 A JP2023558006 A JP 2023558006A JP WO2023080081 A5 JPWO2023080081 A5 JP WO2023080081A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- gap
- semiconductor device
- source
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 19
- 239000004020 conductor Substances 0.000 claims 8
- 239000012212 insulator Substances 0.000 claims 5
- 230000000149 penetrating effect Effects 0.000 claims 4
- 239000013078 crystal Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181312 | 2021-11-05 | ||
| PCT/JP2022/040493 WO2023080081A1 (ja) | 2021-11-05 | 2022-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080081A1 JPWO2023080081A1 (https=) | 2023-05-11 |
| JPWO2023080081A5 true JPWO2023080081A5 (https=) | 2024-07-23 |
Family
ID=86241138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023558006A Pending JPWO2023080081A1 (https=) | 2021-11-05 | 2022-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282738A1 (https=) |
| JP (1) | JPWO2023080081A1 (https=) |
| CN (1) | CN118176592A (https=) |
| DE (1) | DE112022004819T5 (https=) |
| WO (1) | WO2023080081A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09135023A (ja) * | 1995-11-08 | 1997-05-20 | Toshiba Corp | 圧接型半導体装置 |
| JP6729003B2 (ja) * | 2015-10-19 | 2020-07-22 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US10896863B2 (en) * | 2017-01-13 | 2021-01-19 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
| TWI761740B (zh) * | 2018-12-19 | 2022-04-21 | 日商新唐科技日本股份有限公司 | 半導體裝置 |
| JP2021181312A (ja) | 2020-05-18 | 2021-11-25 | Smk株式会社 | 粉粒体排出具 |
-
2022
- 2022-10-28 WO PCT/JP2022/040493 patent/WO2023080081A1/ja not_active Ceased
- 2022-10-28 DE DE112022004819.0T patent/DE112022004819T5/de active Pending
- 2022-10-28 JP JP2023558006A patent/JPWO2023080081A1/ja active Pending
- 2022-10-28 CN CN202280073195.5A patent/CN118176592A/zh active Pending
-
2024
- 2024-04-30 US US18/650,144 patent/US20240282738A1/en active Pending
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