JPWO2023080092A5 - - Google Patents
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- Publication number
- JPWO2023080092A5 JPWO2023080092A5 JP2023558017A JP2023558017A JPWO2023080092A5 JP WO2023080092 A5 JPWO2023080092 A5 JP WO2023080092A5 JP 2023558017 A JP2023558017 A JP 2023558017A JP 2023558017 A JP2023558017 A JP 2023558017A JP WO2023080092 A5 JPWO2023080092 A5 JP WO2023080092A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- main surface
- electrode
- covering portion
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 239000010410 layer Substances 0.000 claims 4
- 239000013078 crystal Substances 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181323 | 2021-11-05 | ||
| PCT/JP2022/040504 WO2023080092A1 (ja) | 2021-11-05 | 2022-10-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080092A1 JPWO2023080092A1 (https=) | 2023-05-11 |
| JPWO2023080092A5 true JPWO2023080092A5 (https=) | 2024-07-23 |
Family
ID=86241149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023558017A Pending JPWO2023080092A1 (https=) | 2021-11-05 | 2022-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240274481A1 (https=) |
| JP (1) | JPWO2023080092A1 (https=) |
| CN (1) | CN118176576A (https=) |
| DE (1) | DE112022004779T5 (https=) |
| WO (1) | WO2023080092A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026004740A1 (ja) * | 2024-06-27 | 2026-01-02 | ローム株式会社 | 半導体装置および半導体モジュール |
| CN119486211B (zh) * | 2025-01-13 | 2025-05-13 | 长飞先进半导体(武汉)有限公司 | 半导体器件及制备方法、功率模块、功率转换电路和车辆 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4386239B2 (ja) * | 2003-03-12 | 2009-12-16 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
| JP7038518B2 (ja) * | 2017-10-11 | 2022-03-18 | ローム株式会社 | 半導体装置 |
| JP7530202B2 (ja) * | 2019-05-23 | 2024-08-07 | ローム株式会社 | 半導体装置 |
| JP2020202313A (ja) * | 2019-06-11 | 2020-12-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2021181323A (ja) | 2020-05-19 | 2021-11-25 | 株式会社古川製作所 | 粉体充填ホッパ及びその粉体充填ホッパの制御方法 |
-
2022
- 2022-10-28 CN CN202280072992.1A patent/CN118176576A/zh active Pending
- 2022-10-28 DE DE112022004779.8T patent/DE112022004779T5/de active Pending
- 2022-10-28 JP JP2023558017A patent/JPWO2023080092A1/ja active Pending
- 2022-10-28 WO PCT/JP2022/040504 patent/WO2023080092A1/ja not_active Ceased
-
2024
- 2024-04-29 US US18/648,686 patent/US20240274481A1/en active Pending
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