WO2019153414A1 - 一种用于柔性显示器件上的封装结构及制备方法 - Google Patents

一种用于柔性显示器件上的封装结构及制备方法 Download PDF

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WO2019153414A1
WO2019153414A1 PCT/CN2018/078803 CN2018078803W WO2019153414A1 WO 2019153414 A1 WO2019153414 A1 WO 2019153414A1 CN 2018078803 W CN2018078803 W CN 2018078803W WO 2019153414 A1 WO2019153414 A1 WO 2019153414A1
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organic layer
display device
flexible display
package structure
inorganic
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PCT/CN2018/078803
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English (en)
French (fr)
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蔡丰豪
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武汉华星光电半导体显示技术有限公司
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Priority to US16/023,314 priority Critical patent/US10510986B2/en
Publication of WO2019153414A1 publication Critical patent/WO2019153414A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

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  • the present invention relates to the field of display technologies, and in particular, to a package structure and a preparation method for a flexible display device.
  • OLED displays which are new-generation displays, have many advantages such as self-luminescence, fast response, wide viewing angle, and color saturation.
  • the packaging method is to make an organic film on a substrate including an OLED light-emitting device, so that the organic The film is sandwiched between the cathode and the anode metal or conductive layer, and once a voltage is applied to the electrodes, the organic film emits light.
  • the effective packaging of the OLED light-emitting device enables the OLED light-emitting device and the water. Sufficient oxygen isolation is critical to extending the life of OLED light-emitting devices.
  • an effective OLED device packaging method is to form an inorganic layer by chemical vapor deposition, and an organic layer is formed by an inkjet method, and then a plurality of inorganic layers and an organic layer are stacked on each other to form a package having superior performance, but in practice
  • the inorganic layer is prone to pinhole phenomenon, which causes the water oxygen in the air to penetrate the pinhole of the inorganic layer, and enters the OLED light-emitting device through the organic layer to corrode the device, thereby affecting the lifetime of the OLED.
  • the technical problem to be solved by the embodiments of the present invention is to provide a package structure and a preparation method for a flexible display device, which can prolong the water oxygen intrusion path in the air and prevent the water oxygen in the air from penetrating through the pinhole of the inorganic layer.
  • the inside of the OLED light-emitting device is corroded to extend the life of the OLED light-emitting device.
  • an embodiment of the present invention provides a package structure for a flexible display device, which is disposed above the OLED light-emitting device on the flexible substrate, and includes:
  • a laminate for preventing intrusion of water oxygen in air comprising at least one first organic layer and at least two inorganic layers encasing the first organic layer; wherein two inorganic layers are present in the laminate
  • the laminate is formed by a regular structure or a plurality of regular structures, and each of the regular structures includes two inorganic layers and a first organic layer wrapped in the two inorganic layers; ,
  • the two inorganic layers in each of the regular structures have contact faces that are in contact with each other, and the contact faces divide the corresponding first organic layer into a plurality of independent geometric regions.
  • the first organic layer is formed by a plurality of independent bumps; wherein each of the bumps has a shape of a small middle and a small head such that a radial cross-sectional area of both ends thereof is smaller than a radial cross-sectional area of the intermediate portion thereof. .
  • the first organic layer is made of one of acrylic, epoxy resin and silica gel.
  • the inorganic layer is made of one of silicon nitride, silicon oxide, and silicon oxynitride.
  • the method further includes: covering the second organic layer above the laminate.
  • the second organic layer is made of one of acrylic, epoxy resin and silica gel.
  • an embodiment of the present invention further provides a package structure for a flexible display device, wherein the OLED light-emitting device is disposed on the flexible substrate, and includes:
  • a laminate for preventing intrusion of water oxygen in air comprising at least one first organic layer and at least two inorganic layers encasing the first organic layer; wherein two inorganic layers are present in the laminate a contact surface having the first organic layer separated into a plurality of independent geometric regions and in contact with each other;
  • the laminate is formed by one irregular structure or a plurality of irregular structures, and each of the irregular structures includes at least two inorganic layers and a plurality of first ones wrapped in any two inorganic layers.
  • Organic layer among them,
  • Each of the inorganic structures in each of the irregular structures has a contact surface that separates the plurality of first organic layers of the corresponding package into a plurality of independent geometric regions and contacts each other.
  • the first organic layer is formed by a plurality of independent bumps; wherein each of the bumps has a shape of a small middle and a small head such that a radial cross-sectional area of both ends thereof is smaller than a radial cross-sectional area of the intermediate portion thereof. .
  • the first organic layer is made of one of acrylic, epoxy resin and silica gel.
  • the inorganic layer is made of one of silicon nitride, silicon oxide, and silicon oxynitride.
  • the method further includes: covering the second organic layer above the laminate.
  • the second organic layer is made of one of acrylic, epoxy resin and silica gel.
  • an embodiment of the present invention further provides a method for fabricating a package structure on a flexible display device, the method comprising the following steps:
  • a first inorganic layer covering the OLED light emitting device, a first organic layer having a plurality of independent geometric regions, and a second inorganic layer covering the first organic layer are sequentially formed over the OLED light emitting device on the selected flexible substrate.
  • the method further comprises:
  • a second organic layer is disposed on the second inorganic layer.
  • the material of the first inorganic layer is one of silicon nitride, silicon oxide and silicon oxynitride, and the thickness is 0.5 um to 20 um, which is formed by a CVD process.
  • the first organic layer is made of one of acrylic, epoxy resin and silica gel, and has a thickness of 20 nm to 200 nm, which is formed by an inkjet process.
  • the material of the second inorganic layer is one of silicon nitride, silicon oxide and silicon oxynitride, and the thickness is 0.5 um-20 um, which is formed by a CVD process.
  • the material of the second organic layer is one of acrylic, epoxy resin and silica gel, and is formed by a CVD process, and has a thickness ranging from 20 nm to 200 nm.
  • the package structure of the present invention first adopts a laminate manner in which an outer inorganic layer is wrapped with an organic layer (such as a first organic layer).
  • an organic layer such as a first organic layer.
  • at least one of the inorganic layers in the second stack is provided with a plurality of protrusions separating the first organic layer into a plurality of independent geometric regions on the contact surface contacting the first organic layer.
  • the structure can further effectively prevent the water oxygen in the air from passing through the pinhole of the inorganic layer into the OLED light-emitting device through the organic layer, thereby prolonging the life of the OLED light-emitting device.
  • FIG. 1 is a cross-sectional view showing a package structure for a flexible display device disposed on a flexible display device according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic plan view showing a first inorganic layer in a package structure for a flexible display device according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic plan view showing a first organic layer in a package structure on a flexible display device according to Embodiment 1 of the present invention
  • FIG. 4 is a schematic plan view showing a planar structure of a second inorganic layer in a package structure for a flexible display device according to Embodiment 1 of the present invention
  • FIG. 5 is a schematic plan view showing a planar structure of a second organic layer in a package structure for a flexible display device according to Embodiment 1 of the present invention
  • FIG. 6 is a schematic diagram showing the operation of a package structure for a flexible display device disposed on a flexible display device for preventing water and oxygen from intruding in the air according to Embodiment 1 of the present invention
  • FIG. 7 is a flowchart of a method for fabricating a package structure on a flexible display device according to Embodiment 2 of the present invention.
  • a package structure for a flexible display device is provided on the flexible substrate 3 above the OLED light-emitting device 4 , and the flexible substrate 3 is made of polyimide.
  • the package structure includes:
  • the laminate for preventing intrusion of water oxygen in the air, the laminate comprising at least one first organic layer 11 and at least two inorganic layers 12 encasing the first organic layer 11; wherein two inorganic layers 12 are present in the laminate
  • the first organic layer 11 is divided into a plurality of independent geometric regions and contact surfaces that are in contact with each other.
  • the second organic layer 2 overlies the laminate, i.e., covers the inorganic layer 12 over its entire surface, including the edges of the inorganic layer 12.
  • the laminate has at least three layers of structure, and the inorganic layer 12 is provided on both sides of the laminate regardless of the number of the first organic layers 11 in the laminate.
  • the laminate adopts a design structure in which the first organic layer 11 and the inorganic layer 12 are alternately distributed, and the plurality of first organic layers 11 may be stacked together, and then the outer sides are A design structure wrapped with a single or multiple layers of inorganic layers 12, or other design structures.
  • the laminate is formed by a regular structure or a plurality of regular structures, and each of the regular structures includes two inorganic layers 12 and one first organic layer wrapped in the two inorganic layers 12. 11, a design structure in which the first organic layer 11 and the inorganic layer 12 are alternately distributed;
  • the two inorganic layers 12 in each regular structure have contact faces that contact each other, which separates the corresponding first organic layer 11 into a plurality of independent geometric regions.
  • the first organic layer 11 is formed by a plurality of independent bumps; wherein each of the bumps has a shape of a small central portion and a small shape (ie, a spindle shape) such that a radial cross-sectional area of both ends thereof is smaller than a middle portion thereof. Radial section area.
  • the bumps can also be vertebral bodies, cylinders or other shaped cylinders.
  • the stack is formed by one irregular structure or a plurality of irregular structures, and each of the irregular structures includes at least two inorganic layers 12 and is wrapped in any two inorganic layers 12.
  • a plurality of first organic layers 11 that is, a design structure in which a plurality of first organic layers 11 are stacked, and then the outer sides are surrounded by a single layer or a plurality of inorganic layers 12;
  • the plurality of first organic layers 11 are formed by a plurality of independent bumps; wherein each of the bumps has a shape of a small central portion and a small shape (ie, a spindle shape) such that the radial cross-sectional areas at both ends thereof are smaller than the middle portion thereof.
  • the radial cross-sectional area of the part can also be vertebral bodies, cylinders or other shaped cylinders.
  • the laminate has only three layers, and the inorganic layer 12 can be divided into first according to the position.
  • a first inorganic layer 121 shown in FIG. 3 below the organic layer 11 (shown in FIG. 2) and a second inorganic layer 122 (shown in FIG. 4) above the first organic layer 11.
  • the second organic layer 2 is disposed on the second inorganic layer 122 (as shown in FIG. 5).
  • the first organic layer 11 can be maximally ensured.
  • the pinholes of the water in the air on the inorganic layer 12 are in different geometric regions, thereby extending the water oxygen intrusion path in the air and prolonging the service life of the flexible display device. As shown in FIG.
  • the water oxygen in the air penetrates through the second organic layer 2 through the pinhole A of the upper inorganic layer 12, but the pinhole A of the upper inorganic layer 12 and the pinhole B of the lower inorganic layer 12 are not in the same In a geometric region, water oxygen intruding into the pinhole A cannot continue to invade the pinhole B, thereby effectively prolonging the water oxygen intrusion path in the air, so that water oxygen intrusion in the air is prevented.
  • the first organic layer 11 and the second organic layer 12 are all made of one of acrylic, epoxy resin and silica gel.
  • the inorganic layer 12 is made of one of silicon nitride, silicon oxide, and silicon oxynitride.
  • a method for fabricating a package structure for a flexible display device As shown in FIG. 7, a method for fabricating a package structure for a flexible display device according to a second embodiment of the present invention is provided.
  • the method shows a preparation process of wrapping the first organic layer by the first inorganic layer and the second inorganic layer, and specifically includes the following steps:
  • Step S1 selecting a flexible substrate, wherein the flexible substrate is provided with an OLED light emitting device;
  • Step S2 sequentially forming a first inorganic layer covering the OLED light emitting device, a first organic layer having a plurality of independent geometric regions, and a second inorganic layer covering the first organic layer over the selected flexible substrate.
  • the first inorganic layer is made of silicon nitride, silicon oxide or silicon oxynitride, and has a thickness of 0.5 um to 20 um, which can be formed by a CVD process;
  • the first organic layer is made of acrylic, One of epoxy resin and silica gel, having a thickness of 20 nm to 200 nm, can be formed by an inkjet process;
  • the second inorganic layer is made of silicon nitride, silicon oxide or silicon oxynitride, and has a thickness of 0.5 um. -20um can be formed by a CVD process.
  • first inorganic layer, the first organic layer, and the second inorganic layer may each have a single layer structure or a multilayer structure.
  • the method further comprises:
  • a second organic layer is disposed on the second inorganic layer.
  • the material of the second organic layer is one of acrylic, epoxy resin and silica gel, which can be formed by a CVD process and has a thickness ranging from 20 nm to 200 nm.
  • the implementation of the embodiments of the present invention has the following beneficial effects: in contrast to the conventional package structure for a flexible display device, the package structure of the present invention first coats the organic layer (such as the first organic layer) with an outer inorganic layer. Forming a laminate to prevent water oxygen from intruding into the flexible display device, and at least one inorganic layer in the second stack is provided on the contact surface in contact with the first organic layer to separate the first organic layer into a plurality of independent geometries The plurality of convex structures in the region can further effectively prevent the water oxygen in the air from passing through the pinholes of the inorganic layer into the OLED light-emitting device through the organic layer, thereby prolonging the life of the OLED light-emitting device.

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Abstract

本发明提供一种用于柔性显示器件上的封装结构,设置于柔性基板上OLED 发光器件的上方,包括用于防止空气中水氧侵入的叠层,叠层包括至少一个第一有机层以及包裹第一有机层的至少两个无机层;其中,叠层中存在两个无机层具有将第一有机层分隔为多个独立几何区域并且相互接触的接触面。实施本发明,能延长空气中的水氧侵入路径,防止空气中的水氧透过无机层的针孔进入 OLED 发光器件内部对器件进行腐蚀,延长了 OLED 发光器件寿命。

Description

一种用于柔性显示器件上的封装结构及制备方法
本申请要求于2018年2月9日提交中国专利局、申请号为201810135114.5、发明名称为“一种用于柔性显示器件上的封装结构及制备方法”的中国专利申请的优先权,上述专利的全部内容通过引用结合在本申请中。
技术领域
本发明涉及显示技术领域,尤其涉及一种用于柔性显示器件上的封装结构及制备方法。
背景技术
相对于液晶显示器,作为新一代显示器的OLED显示器,则具有自发光、响应快、视角广以及色彩饱和等许多优点,其封装方式是通过在包含OLED发光器件的基板上制作有机薄膜,使得该有机薄膜被包夹在阴极和阳极金属或导电层之间,一旦给两极施加电压,则该有机薄膜会发光。然而,由于空气中的水氧会使OLED发光器件阴极的活波金属被氧化并会与有机材料发生化学反应,从而使得OLED发光器件失效,因此OLED发光器件的有效封装,使OLED发光器件与水氧充分隔离对延长OLED发光器件寿命至关重要。
一般比较有效的OLED器件封装方式是通过化学气相沉积法来制作无机层,以及通过喷墨法制作有机层,然后多层无机层和有机层相互堆积,形成性能优越的封装整体,但由于在实际制作封装时,无机层容易出现针孔现象,导致空气中的水氧透过无机层的针孔,经过有机层,进入OLED发光器件内部对器件进行腐蚀,影响OLED的寿命。
发明内容
本发明实施例所要解决的技术问题在于,提供一种用于柔性显示器件上的封装结构及制备方法,能延长空气中的水氧侵入路径,防止空气中的水氧透过无机层的针孔进入OLED发光器件内部对器件进行腐蚀,延长了OLED发光器件寿命。
为了解决上述技术问题,本发明实施例提供了一种用于柔性显示器件上的封装结构,设置于柔性基板上OLED发光器件的上方,包括:
用于防止空气中水氧侵入的叠层,所述叠层包括至少一个第一有机层以及包裹所述第一有机层的至少两个无机层;其中,所述叠层中存在两个无机层具有将所述第一有机层分隔为多个独立几何区域并且相互接触的接触面。
其中,所述叠层由一个规则结构形成或多个规则结构堆叠而成,且每一规则结构中均包括两个无机层以及包裹于所述两个无机层中的一个第一有机层;其中,
所述每一规则结构中的两个无机层均具有相互接触的接触面,所述接触面将对应的第一有机层分隔为多个独立几何区域。
其中,所述第一有机层由多个独立的凸块形成;其中,每一凸块均呈中间大两头小的形状,使得其两端的径向剖面面积均小于其中间部位的径向剖面面积。
其中,所述第一有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
其中,所述无机层采用氮化硅、氧化硅、氮氧化硅之中其一制作而成。
其中,还包括:覆盖于所述叠层上方的第二有机层。
其中,所述第二有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
相应于,本发明实施例还提供了另一种用于柔性显示器件上的封装结构,其中,设置于柔性基板上OLED发光器件的上方,包括:
用于防止空气中水氧侵入的叠层,所述叠层包括至少一个第一有机层以 及包裹所述第一有机层的至少两个无机层;其中,所述叠层中存在两个无机层具有将所述第一有机层分隔为多个独立几何区域并且相互接触的接触面;
其中,所述叠层由一个非规则结构形成或多个非规则结构堆叠而成,且每一非规则结构中均包括至少两个无机层以及包裹于任意两个无机层中的多个第一有机层;其中,
所述每一非规则结构中均存在两个无机层具有将对应包裹的多个第一有机层分隔为多个独立几何区域并且相互接触的接触面。
其中,所述第一有机层由多个独立的凸块形成;其中,每一凸块均呈中间大两头小的形状,使得其两端的径向剖面面积均小于其中间部位的径向剖面面积。
其中,所述第一有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
其中,所述无机层采用氮化硅、氧化硅、氮氧化硅之中其一制作而成。
其中,还包括:覆盖于所述叠层上方的第二有机层。
其中,所述第二有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
相应于,本发明实施例还提供了一种用于柔性显示器件上的封装结构的制备方法,所述方法包括以下步骤:
选择一柔性基板,所述柔性基板上设有OLED发光器件;
在所选柔性基板上的OLED发光器件上方依次形成覆盖所述OLED发光器件的第一无机层、具有多个独立几何区域的第一有机层以及覆盖所述第一有机层的第二无机层。
其中,所述方法进一步包括:
在所述第二无机层上设置第二有机层。
其中,所述第一无机层的材质为氮化硅、氧化硅、氮氧化硅之中其一,厚度为0.5um-20um,通过CVD工艺形成。
其中,所述第一有机层材质为亚克力、环氧树脂、硅胶之中其一,厚度为20nm-200nm,通过inkjet工艺形成。
其中,所述第二无机层的材质为氮化硅、氧化硅、氮氧化硅之中其一,厚度为0.5um-20um,通过CVD工艺形成。
其中,所述第二有机层的材质为亚克力、环氧树脂、硅胶之中其一,通过CVD工艺形成,厚度范围为20nm-200nm。
实施本发明实施例具有如下有益效果:与传统的用于柔性显示器件上的封装结构相对比,本发明中封装结构首先采用外部无机层包裹有机层(如第一有机层)形成的叠层方式来防止空气中水氧侵入柔性显示器件,其次叠层中至少有一个无机层在与第一有机层相接触的接触面上设有将第一有机层分隔为多个独立几何区域的多个凸状结构,这样就可以进一步有效防止空气中水氧透过无机层的针孔经有机层进入OLED发光器件,延长了OLED发光器件寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例一提供的用于柔性显示器件上的封装结构设置于柔性显示器件上的剖切图;
图2为本发明实施例一提供的用于柔性显示器件上的封装结构中第一无机层的平面结构示意图;
图3为本发明实施例一提供的用于柔性显示器件上的封装结构中第一有机层的平面结构示意图;
图4为本发明实施例一提供的用于柔性显示器件上的封装结构中第二无机层的平面结构示意图;
图5为本发明实施例一提供的用于柔性显示器件上的封装结构中第二有 机层的平面结构示意图;
图6为本发明实施例一提供的用于柔性显示器件上的封装结构设置于柔性显示器件上用于阻止空气中水氧侵入的工作原理图;
图7为本发明实施例二提供的用于柔性显示器件上的封装结构的制备方法的流程图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明作进一步地详细描述。
如图1所示,为本发明实施例一中,提供的一种用于柔性显示器件上的封装结构,设置于柔性基板3上OLED发光器件4的上方,该柔性基板3采用聚酰亚胺PI、聚对苯二甲酸乙二酯PET等材料制作而成,该封装结构包括:
用于防止空气中水氧侵入的叠层,该叠层包括至少一个第一有机层11以及包裹第一有机层11的至少两个无机层12;其中,叠层中存在两个无机层12具有将第一有机层11分隔为多个独立几何区域并且相互接触的接触面。
可以理解的是,为了更有效的降低应力来延长柔性显示的使用寿命,该第二有机层2覆盖于叠层上方,即整面覆盖无机层12,包括覆盖无机层12的边缘。
在本发明实施例一中,叠层至少有三层结构,不管叠层中有多少个第一有机层11,则叠层外部两侧都是无机层12。当然,在满足柔性显示器件厚度及应力的作用,叠层采用第一有机层11和无机层12交错分布方式的设计结构,也可以采用多层第一有机层11堆叠在一起,然后外部两侧采用单层或多层无机层12包裹的设计结构,或者其它方式的设计结构。
在一个实施例中,叠层由一个规则结构形成或多个规则结构堆叠而成, 且每一规则结构中均包括两个无机层12以及包裹于两个无机层12中的一个第一有机层11,即形成第一有机层11和无机层12交错分布方式的设计结构;其中,
每一规则结构中的两个无机层12均具有相互接触的接触面,该接触面将对应的第一有机层11分隔为多个独立几何区域。其中,第一有机层11由多个独立的凸块形成;其中,每一凸块均呈中间大两头小的形状(即纺锤状),使得其两端的径向剖面面积均小于其中间部位的径向剖面面积。当然,凸块也可为椎体、圆柱体或者其它形状的柱体。
在另一个实施例中,叠层由一个非规则结构形成或多个非规则结构堆叠而成,且每一非规则结构中均包括至少两个无机层12以及包裹于任意两个无机层12中的多个第一有机层11,即形成多层第一有机层11堆叠在一起,然后外部两侧采用单层或多层无机层12包裹的设计结构;其中,
每一非规则结构中均存在两个无机层12具有将对应包裹的多个第一有机层11分隔为多个独立几何区域并且相互接触的接触面。其中,多个第一有机层11由多个独立的凸块形成;其中,每一凸块均呈中间大两头小的形状(即纺锤状),使得其两端的径向剖面面积均小于其中间部位的径向剖面面积。该凸块也可为椎体、圆柱体或者其它形状的柱体。
如图2至图5所示,在本发明实施例一中的用于柔性显示器件上的封装结构的应用场景中,叠层只有三层结构,可以根据位置将无机层12划分为位于第一有机层11(如图2所示)下方的第一无机层121(如图3所示)以及位于第一有机层11上方的第二无机层122(如图4所示)。待叠层完成后,在第二无机层122设置第二有机层2(如图5所示)。
因此,不管叠层采用任何一种设计结构,则只要存在两个无机层12将包裹的第一有机层11隔离出多个独立的几何区域,即可最大化的确保第一有机层11上下对应的无机层12上空气中水氧侵入的针孔处于不同的几何区域内,从而达到延长空气中水氧侵入路径的目的,延长柔性显示器件的使用 寿命。如图6所示,空气中的水氧透过第二有机层2经上无机层12的针孔A侵入,但由于上无机层12的针孔A和下无机层12的针孔B不在同一个几何区域内,因此使得侵入针孔A的水氧无法继续侵入针孔B中,从而有效的延长了空气中水氧侵入路径,使得空气中水氧侵入得到阻止。
在本发明实施例一中,第一有机层11和第二有机层12均采用亚克力、环氧树脂、硅胶之中其一制作而成。无机层12采用氮化硅、氧化硅、氮氧化硅之中其一制作而成。
如图7所示,相应于本发明实施例一中的用于柔性显示器件上的封装结构,本发明实施例二中还提供的一种用于柔性显示器件上的封装结构的制备方法,该方法示出了由第一无机层和第二无机层包裹第一有机层的制备流程,具体包括以下步骤:
步骤S1、选择一柔性基板,所述柔性基板上设有OLED发光器件;
步骤S2、在所选柔性基板上方依次形成覆盖所述OLED发光器件的第一无机层、具有多个独立几何区域的第一有机层以及覆盖所述第一有机层的第二无机层。
具体的,所述第一无机层的材质为氮化硅、氧化硅、氮氧化硅之中其一,厚度为0.5um-20um,可以通过CVD工艺形成;所述第一有机层材质为亚克力、环氧树脂、硅胶之中其一,厚度为20nm-200nm,可以通过inkjet工艺形成;所述第二无机层的材质为氮化硅、氧化硅、氮氧化硅之中其一,厚度为0.5um-20um,可以通过CVD工艺形成。
应当说明的是,第一无机层、第一有机层和第二无机层均可以采用单层结构或多层结构。
其中,所述方法进一步包括:
在所述第二无机层上设置第二有机层。所述第二有机层的材质为亚克力、环氧树脂、硅胶之中其一,可以通过CVD工艺形成,厚度范围为20nm-200nm。
综上所述,实施本发明实施例具有如下有益效果:与传统的用于柔性显示器件上的封装结构相对比,本发明中封装结构首先采用外部无机层包裹有机层(如第一有机层)形成的叠层方式来防止空气中水氧侵入柔性显示器件,其次叠层中至少有一个无机层在与第一有机层相接触的接触面上设有将第一有机层分隔为多个独立几何区域的多个凸状结构,这样就可以进一步有效防止空气中水氧透过无机层的针孔经有机层进入OLED发光器件,延长了OLED发光器件寿命。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本发明的保护范围。

Claims (19)

  1. 一种用于柔性显示器件上的封装结构,其中,设置于柔性基板上OLED发光器件的上方,包括:
    用于防止空气中水氧侵入的叠层,所述叠层包括至少一个第一有机层以及包裹所述第一有机层的至少两个无机层;其中,所述叠层中存在两个无机层具有将所述第一有机层分隔为多个独立几何区域并且相互接触的接触面。
  2. 如权利要求1所述的用于柔性显示器件上的封装结构,其中,所述叠层由一个规则结构形成或多个规则结构堆叠而成,且每一规则结构中均包括两个无机层以及包裹于所述两个无机层中的一个第一有机层;其中,
    所述每一规则结构中的两个无机层均具有相互接触的接触面,所述接触面将对应的第一有机层分隔为多个独立几何区域。
  3. 如权利要求2所述的用于柔性显示器件上的封装结构,其中,所述第一有机层由多个独立的凸块形成;其中,每一凸块均呈中间大两头小的形状,使得其两端的径向剖面面积均小于其中间部位的径向剖面面积。
  4. 如权利要求3中所述的用于柔性显示器件上的封装结构,其中,所述第一有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
  5. 如权利要求4所述的用于柔性显示器件上的封装结构,其中,所述无机层采用氮化硅、氧化硅、氮氧化硅之中其一制作而成。
  6. 如权利要求5所述的用于柔性显示器件上的封装结构,其中,还包括:覆盖于所述叠层上方的第二有机层。
  7. 如权利要求6所述的用于柔性显示器件上的封装结构,其中,所述第二有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
  8. 一种用于柔性显示器件上的封装结构,其中,设置于柔性基板上OLED发光器件的上方,包括:
    用于防止空气中水氧侵入的叠层,所述叠层包括至少一个第一有机层以 及包裹所述第一有机层的至少两个无机层;其中,所述叠层中存在两个无机层具有将所述第一有机层分隔为多个独立几何区域并且相互接触的接触面;
    其中,所述叠层由一个非规则结构形成或多个非规则结构堆叠而成,且每一非规则结构中均包括至少两个无机层以及包裹于任意两个无机层中的多个第一有机层;其中,
    所述每一非规则结构中均存在两个无机层具有将对应包裹的多个第一有机层分隔为多个独立几何区域并且相互接触的接触面。
  9. 如权利要求8所述的用于柔性显示器件上的封装结构,其中,所述第一有机层由多个独立的凸块形成;其中,每一凸块均呈中间大两头小的形状,使得其两端的径向剖面面积均小于其中间部位的径向剖面面积。
  10. 如权利要求9中所述的用于柔性显示器件上的封装结构,其中,所述第一有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
  11. 如权利要求10所述的用于柔性显示器件上的封装结构,其中,所述无机层采用氮化硅、氧化硅、氮氧化硅之中其一制作而成。
  12. 如权利要求11所述的用于柔性显示器件上的封装结构,其中,还包括:覆盖于所述叠层上方的第二有机层。
  13. 如权利要求12所述的用于柔性显示器件上的封装结构,其中,所述第二有机层采用亚克力、环氧树脂、硅胶之中其一制作而成。
  14. 一种用于柔性显示器件上的封装结构的制备方法,其中,所述方法包括以下步骤:
    选择一柔性基板,所述柔性基板上设有OLED发光器件;
    在所选柔性基板上的OLED发光器件上方依次形成覆盖所述OLED发光器件的第一无机层、具有多个独立几何区域的第一有机层以及覆盖所述第一有机层的第二无机层。
  15. 如权利要求14所述的用于柔性显示器件上的封装结构的制备方法,其中,所述方法进一步包括:
    在所述第二无机层上设置第二有机层。
  16. 如权利要求14所述的用于柔性显示器件上的封装结构的制备方法,其中,所述第一无机层的材质为氮化硅、氧化硅、氮氧化硅之中其一,厚度为0.5um-20um,通过CVD工艺形成。
  17. 如权利要求14所述的用于柔性显示器件上的封装结构的制备方法,其中,所述第一有机层材质为亚克力、环氧树脂、硅胶之中其一,厚度为20nm-200nm,通过inkjet工艺形成。
  18. 如权利要求14所述的用于柔性显示器件上的封装结构的制备方法,其中,所述第二无机层的材质为氮化硅、氧化硅、氮氧化硅之中其一,厚度为0.5um-20um,通过CVD工艺形成。
  19. 如权利要求15所述的用于柔性显示器件上的封装结构的制备方法,其中,所述第二有机层的材质为亚克力、环氧树脂、硅胶之中其一,通过CVD工艺形成,厚度范围为20nm-200nm。
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