JPWO2023248804A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023248804A5 JPWO2023248804A5 JP2024528771A JP2024528771A JPWO2023248804A5 JP WO2023248804 A5 JPWO2023248804 A5 JP WO2023248804A5 JP 2024528771 A JP2024528771 A JP 2024528771A JP 2024528771 A JP2024528771 A JP 2024528771A JP WO2023248804 A5 JPWO2023248804 A5 JP WO2023248804A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- electronic component
- stretchable
- disposed
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022101187 | 2022-06-23 | ||
| JP2022101187 | 2022-06-23 | ||
| PCT/JP2023/021213 WO2023248804A1 (ja) | 2022-06-23 | 2023-06-07 | 伸縮性デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248804A1 JPWO2023248804A1 (https=) | 2023-12-28 |
| JPWO2023248804A5 true JPWO2023248804A5 (https=) | 2025-02-28 |
| JP7747207B2 JP7747207B2 (ja) | 2025-10-01 |
Family
ID=89379640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528771A Active JP7747207B2 (ja) | 2022-06-23 | 2023-06-07 | 伸縮性デバイス |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250120021A1 (https=) |
| JP (1) | JP7747207B2 (https=) |
| WO (1) | WO2023248804A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6462754A (en) * | 1987-09-02 | 1989-03-09 | Oki Electric Ind Co Ltd | Manufacture of thin electronic appliance |
| JP2003347503A (ja) * | 2002-05-30 | 2003-12-05 | Hitachi Ltd | 半導体装置及びその製造方法並びに半導体実装方法 |
| JP2010016339A (ja) * | 2008-06-03 | 2010-01-21 | Nippon Mektron Ltd | 多層フレキシブルプリント回路基板を用いたモジュールおよびその製造方法 |
| JP2010192883A (ja) * | 2009-01-20 | 2010-09-02 | Sumitomo Bakelite Co Ltd | 光電気混載基板および光電気混載基板の製造方法 |
| JP2013191621A (ja) * | 2012-03-12 | 2013-09-26 | Fujifilm Corp | 回路基板モジュールならびにその製造装置および製造方法 |
| EP2850923B1 (en) * | 2012-05-18 | 2016-04-27 | Advanced Bionics AG | Printed circuit board apparatus and methods of making the same |
| US10713461B2 (en) * | 2017-09-19 | 2020-07-14 | IDEX Biometrtics ASA | Double sided sensor module suitable for integration into electronic devices |
| WO2020158031A1 (ja) * | 2019-01-30 | 2020-08-06 | 株式会社村田製作所 | 伸縮性実装基板 |
| JP2021072428A (ja) * | 2019-11-01 | 2021-05-06 | 株式会社サトーセン | 回路基板およびその製造方法 |
-
2023
- 2023-06-07 WO PCT/JP2023/021213 patent/WO2023248804A1/ja not_active Ceased
- 2023-06-07 JP JP2024528771A patent/JP7747207B2/ja active Active
-
2024
- 2024-12-17 US US18/983,614 patent/US20250120021A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200709476A (en) | Side view LED with improved arrangement of protection device | |
| JPWO2023248804A5 (https=) | ||
| JPWO2023106055A5 (https=) | ||
| US20250311125A1 (en) | Display assembly and electronic device | |
| JP2022041869A5 (https=) | ||
| JPWO2022264834A5 (https=) | ||
| JPWO2021206050A5 (https=) | ||
| US11044829B1 (en) | Heat dissipation architecture | |
| JPWO2024071069A5 (https=) | ||
| CN204859740U (zh) | 柔性电路板 | |
| JPWO2024128011A5 (https=) | ||
| JP2005317912A5 (https=) | ||
| CN209149185U (zh) | 电子设备 | |
| JPWO2022239718A5 (https=) | ||
| JP2022181812A5 (https=) | ||
| JPWO2023100731A5 (https=) | ||
| JPWO2023063025A5 (https=) | ||
| JPWO2024214573A5 (https=) | ||
| JP2009086909A5 (https=) | ||
| JPWO2024166846A5 (https=) | ||
| JPWO2023100681A5 (https=) | ||
| JPWO2021152743A5 (https=) | ||
| JPWO2024004590A5 (https=) | ||
| JPWO2024161996A5 (https=) | ||
| JPWO2023171294A5 (https=) |