JPWO2023248804A1 - - Google Patents

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Publication number
JPWO2023248804A1
JPWO2023248804A1 JP2024528771A JP2024528771A JPWO2023248804A1 JP WO2023248804 A1 JPWO2023248804 A1 JP WO2023248804A1 JP 2024528771 A JP2024528771 A JP 2024528771A JP 2024528771 A JP2024528771 A JP 2024528771A JP WO2023248804 A1 JPWO2023248804 A1 JP WO2023248804A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024528771A
Other languages
Japanese (ja)
Other versions
JPWO2023248804A5 (https=
JP7747207B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2023248804A1 publication Critical patent/JPWO2023248804A1/ja
Publication of JPWO2023248804A5 publication Critical patent/JPWO2023248804A5/ja
Application granted granted Critical
Publication of JP7747207B2 publication Critical patent/JP7747207B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024528771A 2022-06-23 2023-06-07 伸縮性デバイス Active JP7747207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022101187 2022-06-23
JP2022101187 2022-06-23
PCT/JP2023/021213 WO2023248804A1 (ja) 2022-06-23 2023-06-07 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2023248804A1 true JPWO2023248804A1 (https=) 2023-12-28
JPWO2023248804A5 JPWO2023248804A5 (https=) 2025-02-28
JP7747207B2 JP7747207B2 (ja) 2025-10-01

Family

ID=89379640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528771A Active JP7747207B2 (ja) 2022-06-23 2023-06-07 伸縮性デバイス

Country Status (3)

Country Link
US (1) US20250120021A1 (https=)
JP (1) JP7747207B2 (https=)
WO (1) WO2023248804A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6462754A (en) * 1987-09-02 1989-03-09 Oki Electric Ind Co Ltd Manufacture of thin electronic appliance
JP2003347503A (ja) * 2002-05-30 2003-12-05 Hitachi Ltd 半導体装置及びその製造方法並びに半導体実装方法
JP2010016339A (ja) * 2008-06-03 2010-01-21 Nippon Mektron Ltd 多層フレキシブルプリント回路基板を用いたモジュールおよびその製造方法
JP2010192883A (ja) * 2009-01-20 2010-09-02 Sumitomo Bakelite Co Ltd 光電気混載基板および光電気混載基板の製造方法
JP2013191621A (ja) * 2012-03-12 2013-09-26 Fujifilm Corp 回路基板モジュールならびにその製造装置および製造方法
US20150098196A1 (en) * 2012-05-18 2015-04-09 Advanced Bionics Ag Printed circuit board apparatus and methods of making the same
US20190087622A1 (en) * 2017-09-19 2019-03-21 Idex Asa Double sided sensor module suitable for integration into electronic devices
WO2020158031A1 (ja) * 2019-01-30 2020-08-06 株式会社村田製作所 伸縮性実装基板
JP2021072428A (ja) * 2019-11-01 2021-05-06 株式会社サトーセン 回路基板およびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6462754A (en) * 1987-09-02 1989-03-09 Oki Electric Ind Co Ltd Manufacture of thin electronic appliance
JP2003347503A (ja) * 2002-05-30 2003-12-05 Hitachi Ltd 半導体装置及びその製造方法並びに半導体実装方法
JP2010016339A (ja) * 2008-06-03 2010-01-21 Nippon Mektron Ltd 多層フレキシブルプリント回路基板を用いたモジュールおよびその製造方法
JP2010192883A (ja) * 2009-01-20 2010-09-02 Sumitomo Bakelite Co Ltd 光電気混載基板および光電気混載基板の製造方法
JP2013191621A (ja) * 2012-03-12 2013-09-26 Fujifilm Corp 回路基板モジュールならびにその製造装置および製造方法
US20150098196A1 (en) * 2012-05-18 2015-04-09 Advanced Bionics Ag Printed circuit board apparatus and methods of making the same
US20190087622A1 (en) * 2017-09-19 2019-03-21 Idex Asa Double sided sensor module suitable for integration into electronic devices
WO2020158031A1 (ja) * 2019-01-30 2020-08-06 株式会社村田製作所 伸縮性実装基板
JP2021072428A (ja) * 2019-11-01 2021-05-06 株式会社サトーセン 回路基板およびその製造方法

Also Published As

Publication number Publication date
WO2023248804A1 (ja) 2023-12-28
US20250120021A1 (en) 2025-04-10
JP7747207B2 (ja) 2025-10-01

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