JP7747207B2 - 伸縮性デバイス - Google Patents

伸縮性デバイス

Info

Publication number
JP7747207B2
JP7747207B2 JP2024528771A JP2024528771A JP7747207B2 JP 7747207 B2 JP7747207 B2 JP 7747207B2 JP 2024528771 A JP2024528771 A JP 2024528771A JP 2024528771 A JP2024528771 A JP 2024528771A JP 7747207 B2 JP7747207 B2 JP 7747207B2
Authority
JP
Japan
Prior art keywords
region
electronic component
stretchable
interface circuit
circuit module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024528771A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023248804A1 (https=
JPWO2023248804A5 (https=
Inventor
匡彦 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023248804A1 publication Critical patent/JPWO2023248804A1/ja
Publication of JPWO2023248804A5 publication Critical patent/JPWO2023248804A5/ja
Application granted granted Critical
Publication of JP7747207B2 publication Critical patent/JP7747207B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2024528771A 2022-06-23 2023-06-07 伸縮性デバイス Active JP7747207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022101187 2022-06-23
JP2022101187 2022-06-23
PCT/JP2023/021213 WO2023248804A1 (ja) 2022-06-23 2023-06-07 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2023248804A1 JPWO2023248804A1 (https=) 2023-12-28
JPWO2023248804A5 JPWO2023248804A5 (https=) 2025-02-28
JP7747207B2 true JP7747207B2 (ja) 2025-10-01

Family

ID=89379640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528771A Active JP7747207B2 (ja) 2022-06-23 2023-06-07 伸縮性デバイス

Country Status (3)

Country Link
US (1) US20250120021A1 (https=)
JP (1) JP7747207B2 (https=)
WO (1) WO2023248804A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347503A (ja) 2002-05-30 2003-12-05 Hitachi Ltd 半導体装置及びその製造方法並びに半導体実装方法
JP2010016339A (ja) 2008-06-03 2010-01-21 Nippon Mektron Ltd 多層フレキシブルプリント回路基板を用いたモジュールおよびその製造方法
JP2010192883A (ja) 2009-01-20 2010-09-02 Sumitomo Bakelite Co Ltd 光電気混載基板および光電気混載基板の製造方法
US20190087622A1 (en) 2017-09-19 2019-03-21 Idex Asa Double sided sensor module suitable for integration into electronic devices
WO2020158031A1 (ja) 2019-01-30 2020-08-06 株式会社村田製作所 伸縮性実装基板
JP2021072428A (ja) 2019-11-01 2021-05-06 株式会社サトーセン 回路基板およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6462754A (en) * 1987-09-02 1989-03-09 Oki Electric Ind Co Ltd Manufacture of thin electronic appliance
JP2013191621A (ja) * 2012-03-12 2013-09-26 Fujifilm Corp 回路基板モジュールならびにその製造装置および製造方法
EP2850923B1 (en) * 2012-05-18 2016-04-27 Advanced Bionics AG Printed circuit board apparatus and methods of making the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347503A (ja) 2002-05-30 2003-12-05 Hitachi Ltd 半導体装置及びその製造方法並びに半導体実装方法
JP2010016339A (ja) 2008-06-03 2010-01-21 Nippon Mektron Ltd 多層フレキシブルプリント回路基板を用いたモジュールおよびその製造方法
JP2010192883A (ja) 2009-01-20 2010-09-02 Sumitomo Bakelite Co Ltd 光電気混載基板および光電気混載基板の製造方法
US20190087622A1 (en) 2017-09-19 2019-03-21 Idex Asa Double sided sensor module suitable for integration into electronic devices
WO2020158031A1 (ja) 2019-01-30 2020-08-06 株式会社村田製作所 伸縮性実装基板
JP2021072428A (ja) 2019-11-01 2021-05-06 株式会社サトーセン 回路基板およびその製造方法

Also Published As

Publication number Publication date
JPWO2023248804A1 (https=) 2023-12-28
WO2023248804A1 (ja) 2023-12-28
US20250120021A1 (en) 2025-04-10

Similar Documents

Publication Publication Date Title
US10445548B2 (en) Fingerprint sensing assemblies and methods of making
JP6982959B2 (ja) 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP6582155B2 (ja) 配線基板及び配線基板の製造方法
US12464911B2 (en) Flexible substrate and electronic device
JP2020010052A5 (https=)
CN111201839A (zh) 配线基板和配线基板的制造方法
CN111165077A (zh) 配线基板和配线基板的制造方法
JPWO2020004660A1 (ja) 伸縮配線部材
US12016117B2 (en) Extensible and contractible mounting board
JP7747207B2 (ja) 伸縮性デバイス
TWI845601B (zh) 感測器系統
CN119318210A (zh) 伸缩性器件
TWI755555B (zh) 印刷電路板以及具有印刷電路板的電子裝置
US12127337B2 (en) Flexible substrate
CN114596778A (zh) 显示装置
JP7521485B2 (ja) 配線基板及び配線基板の製造方法
US12588139B2 (en) Wiring board and method for manufacturing wiring board
JP7609130B2 (ja) 伸縮性デバイス
JP7758216B2 (ja) 伸縮性デバイス
JP7563632B2 (ja) 伸縮配線基板
US20240341653A1 (en) Flexible electronic device
WO2026033789A1 (ja) フレキシブルデバイス
JP2025095254A (ja) 伸縮性配線基板
CN120052856A (zh) 压力检测装置及电子设备
JP2014002699A (ja) 非接触式ｉｃカード及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241220

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20241220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250408

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250523

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250806

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250807

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250819

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250901

R150 Certificate of patent or registration of utility model

Ref document number: 7747207

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150