JPWO2024122492A5 - - Google Patents

Info

Publication number
JPWO2024122492A5
JPWO2024122492A5 JP2024562758A JP2024562758A JPWO2024122492A5 JP WO2024122492 A5 JPWO2024122492 A5 JP WO2024122492A5 JP 2024562758 A JP2024562758 A JP 2024562758A JP 2024562758 A JP2024562758 A JP 2024562758A JP WO2024122492 A5 JPWO2024122492 A5 JP WO2024122492A5
Authority
JP
Japan
Prior art keywords
wires
semiconductor device
lead
semiconductor element
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024562758A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024122492A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/043259 external-priority patent/WO2024122492A1/ja
Publication of JPWO2024122492A1 publication Critical patent/JPWO2024122492A1/ja
Publication of JPWO2024122492A5 publication Critical patent/JPWO2024122492A5/ja
Pending legal-status Critical Current

Links

JP2024562758A 2022-12-05 2023-12-04 Pending JPWO2024122492A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022194191 2022-12-05
JP2022194190 2022-12-05
PCT/JP2023/043259 WO2024122492A1 (ja) 2022-12-05 2023-12-04 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024122492A1 JPWO2024122492A1 (https=) 2024-06-13
JPWO2024122492A5 true JPWO2024122492A5 (https=) 2025-08-14

Family

ID=91379307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024562758A Pending JPWO2024122492A1 (https=) 2022-12-05 2023-12-04

Country Status (3)

Country Link
US (1) US20250293199A1 (https=)
JP (1) JPWO2024122492A1 (https=)
WO (1) WO2024122492A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010283053A (ja) * 2009-06-03 2010-12-16 Renesas Electronics Corp 半導体装置及びその製造方法
JP6111973B2 (ja) * 2013-10-15 2017-04-12 株式会社デンソー 半導体装置
JP6752639B2 (ja) * 2016-05-02 2020-09-09 ローム株式会社 半導体装置の製造方法
WO2022176729A1 (ja) * 2021-02-22 2022-08-25 ローム株式会社 半導体装置

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