JPWO2023228782A5 - - Google Patents

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Publication number
JPWO2023228782A5
JPWO2023228782A5 JP2024523039A JP2024523039A JPWO2023228782A5 JP WO2023228782 A5 JPWO2023228782 A5 JP WO2023228782A5 JP 2024523039 A JP2024523039 A JP 2024523039A JP 2024523039 A JP2024523039 A JP 2024523039A JP WO2023228782 A5 JPWO2023228782 A5 JP WO2023228782A5
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JP
Japan
Prior art keywords
insulating layer
wiring
semiconductor device
electrode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024523039A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023228782A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/017924 external-priority patent/WO2023228782A1/ja
Publication of JPWO2023228782A1 publication Critical patent/JPWO2023228782A1/ja
Publication of JPWO2023228782A5 publication Critical patent/JPWO2023228782A5/ja
Pending legal-status Critical Current

Links

JP2024523039A 2022-05-27 2023-05-12 Pending JPWO2023228782A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022087151 2022-05-27
PCT/JP2023/017924 WO2023228782A1 (ja) 2022-05-27 2023-05-12 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023228782A1 JPWO2023228782A1 (https=) 2023-11-30
JPWO2023228782A5 true JPWO2023228782A5 (https=) 2025-02-06

Family

ID=88919078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523039A Pending JPWO2023228782A1 (https=) 2022-05-27 2023-05-12

Country Status (2)

Country Link
JP (1) JPWO2023228782A1 (https=)
WO (1) WO2023228782A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3876770B2 (ja) * 2002-06-07 2007-02-07 日産自動車株式会社 配線構造
WO2021205926A1 (ja) * 2020-04-08 2021-10-14 ローム株式会社 半導体装置
WO2022091288A1 (ja) * 2020-10-29 2022-05-05 三菱電機株式会社 半導体パッケージ、半導体装置および電力変換装置

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