JPWO2023228782A1 - - Google Patents
Info
- Publication number
- JPWO2023228782A1 JPWO2023228782A1 JP2024523039A JP2024523039A JPWO2023228782A1 JP WO2023228782 A1 JPWO2023228782 A1 JP WO2023228782A1 JP 2024523039 A JP2024523039 A JP 2024523039A JP 2024523039 A JP2024523039 A JP 2024523039A JP WO2023228782 A1 JPWO2023228782 A1 JP WO2023228782A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022087151 | 2022-05-27 | ||
| PCT/JP2023/017924 WO2023228782A1 (ja) | 2022-05-27 | 2023-05-12 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228782A1 true JPWO2023228782A1 (https=) | 2023-11-30 |
| JPWO2023228782A5 JPWO2023228782A5 (https=) | 2025-02-06 |
Family
ID=88919078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523039A Pending JPWO2023228782A1 (https=) | 2022-05-27 | 2023-05-12 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023228782A1 (https=) |
| WO (1) | WO2023228782A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3876770B2 (ja) * | 2002-06-07 | 2007-02-07 | 日産自動車株式会社 | 配線構造 |
| WO2021205926A1 (ja) * | 2020-04-08 | 2021-10-14 | ローム株式会社 | 半導体装置 |
| WO2022091288A1 (ja) * | 2020-10-29 | 2022-05-05 | 三菱電機株式会社 | 半導体パッケージ、半導体装置および電力変換装置 |
-
2023
- 2023-05-12 JP JP2024523039A patent/JPWO2023228782A1/ja active Pending
- 2023-05-12 WO PCT/JP2023/017924 patent/WO2023228782A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023228782A1 (ja) | 2023-11-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241022 |