JPWO2023189650A1 - - Google Patents
Info
- Publication number
- JPWO2023189650A1 JPWO2023189650A1 JP2024511785A JP2024511785A JPWO2023189650A1 JP WO2023189650 A1 JPWO2023189650 A1 JP WO2023189650A1 JP 2024511785 A JP2024511785 A JP 2024511785A JP 2024511785 A JP2024511785 A JP 2024511785A JP WO2023189650 A1 JPWO2023189650 A1 JP WO2023189650A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/465—Bumps or wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/415—Leadframe inner leads serving as die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/417—Bonding materials between chips and die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022060621 | 2022-03-31 | ||
| PCT/JP2023/010293 WO2023189650A1 (ja) | 2022-03-31 | 2023-03-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189650A1 true JPWO2023189650A1 (https=) | 2023-10-05 |
| JPWO2023189650A5 JPWO2023189650A5 (https=) | 2024-12-12 |
Family
ID=88201751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511785A Pending JPWO2023189650A1 (https=) | 2022-03-31 | 2023-03-16 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250022777A1 (https=) |
| JP (1) | JPWO2023189650A1 (https=) |
| WO (1) | WO2023189650A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115428143A (zh) * | 2020-04-27 | 2022-12-02 | 罗姆股份有限公司 | 半导体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382066A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | 半導体装置 |
| JPH06224357A (ja) * | 1993-01-26 | 1994-08-12 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPH0745778A (ja) * | 1993-07-29 | 1995-02-14 | Sumitomo Electric Ind Ltd | リードフレーム及び半導体装置 |
| JP3356680B2 (ja) * | 1998-04-10 | 2002-12-16 | 日本電気株式会社 | リードフレーム及び半導体装置及び半導体装置の製造方法 |
| JP4469654B2 (ja) * | 2004-05-13 | 2010-05-26 | パナソニック株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2006147602A (ja) * | 2004-11-16 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 高周波半導体装置 |
| JP5001872B2 (ja) * | 2008-02-13 | 2012-08-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2023
- 2023-03-16 WO PCT/JP2023/010293 patent/WO2023189650A1/ja not_active Ceased
- 2023-03-16 JP JP2024511785A patent/JPWO2023189650A1/ja active Pending
-
2024
- 2024-09-27 US US18/900,109 patent/US20250022777A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250022777A1 (en) | 2025-01-16 |
| WO2023189650A1 (ja) | 2023-10-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240912 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260309 |