JPWO2024057838A1 - - Google Patents
Info
- Publication number
- JPWO2024057838A1 JPWO2024057838A1 JP2024546803A JP2024546803A JPWO2024057838A1 JP WO2024057838 A1 JPWO2024057838 A1 JP WO2024057838A1 JP 2024546803 A JP2024546803 A JP 2024546803A JP 2024546803 A JP2024546803 A JP 2024546803A JP WO2024057838 A1 JPWO2024057838 A1 JP WO2024057838A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/417—Bonding materials between chips and die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/533—Cross-sectional shape
- H10W72/534—Cross-sectional shape being rectangular
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022146346 | 2022-09-14 | ||
| PCT/JP2023/030130 WO2024057838A1 (ja) | 2022-09-14 | 2023-08-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024057838A1 true JPWO2024057838A1 (https=) | 2024-03-21 |
| JPWO2024057838A5 JPWO2024057838A5 (https=) | 2025-05-22 |
Family
ID=90274851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024546803A Pending JPWO2024057838A1 (https=) | 2022-09-14 | 2023-08-22 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250210475A1 (https=) |
| JP (1) | JPWO2024057838A1 (https=) |
| WO (1) | WO2024057838A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0437050A (ja) * | 1990-05-31 | 1992-02-07 | Hitachi Ltd | 樹脂封止型半導体装置 |
| US5585667A (en) * | 1994-12-23 | 1996-12-17 | National Semiconductor Corporation | Lead frame for handling crossing bonding wires |
| JP2011054626A (ja) * | 2009-08-31 | 2011-03-17 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| JP6721346B2 (ja) * | 2016-01-27 | 2020-07-15 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-08-22 JP JP2024546803A patent/JPWO2024057838A1/ja active Pending
- 2023-08-22 WO PCT/JP2023/030130 patent/WO2024057838A1/ja not_active Ceased
-
2025
- 2025-03-11 US US19/076,503 patent/US20250210475A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250210475A1 (en) | 2025-06-26 |
| WO2024057838A1 (ja) | 2024-03-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250214 |