JPWO2023181991A1 - - Google Patents
Info
- Publication number
- JPWO2023181991A1 JPWO2023181991A1 JP2024509997A JP2024509997A JPWO2023181991A1 JP WO2023181991 A1 JPWO2023181991 A1 JP WO2023181991A1 JP 2024509997 A JP2024509997 A JP 2024509997A JP 2024509997 A JP2024509997 A JP 2024509997A JP WO2023181991 A1 JPWO2023181991 A1 JP WO2023181991A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048677 | 2022-03-24 | ||
| PCT/JP2023/009288 WO2023181991A1 (ja) | 2022-03-24 | 2023-03-10 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181991A1 true JPWO2023181991A1 (https=) | 2023-09-28 |
Family
ID=88101310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509997A Pending JPWO2023181991A1 (https=) | 2022-03-24 | 2023-03-10 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023181991A1 (https=) |
| WO (1) | WO2023181991A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016157880A (ja) * | 2015-02-26 | 2016-09-01 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| JP2016192476A (ja) * | 2015-03-31 | 2016-11-10 | 株式会社沖データ | 半導体チップ、半導体装置、プリントヘッド、画像形成装置、および半導体チップの製造方法 |
| JP6721346B2 (ja) * | 2016-01-27 | 2020-07-15 | ローム株式会社 | 半導体装置 |
| JP7157630B2 (ja) * | 2018-11-05 | 2022-10-20 | ローム株式会社 | 半導体素子および半導体装置 |
-
2023
- 2023-03-10 JP JP2024509997A patent/JPWO2023181991A1/ja active Pending
- 2023-03-10 WO PCT/JP2023/009288 patent/WO2023181991A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023181991A1 (ja) | 2023-09-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260303 |