JPWO2023068149A5 - - Google Patents

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Publication number
JPWO2023068149A5
JPWO2023068149A5 JP2023554601A JP2023554601A JPWO2023068149A5 JP WO2023068149 A5 JPWO2023068149 A5 JP WO2023068149A5 JP 2023554601 A JP2023554601 A JP 2023554601A JP 2023554601 A JP2023554601 A JP 2023554601A JP WO2023068149 A5 JPWO2023068149 A5 JP WO2023068149A5
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JP
Japan
Prior art keywords
thickness direction
sheet
receiving element
emitting element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023554601A
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English (en)
Japanese (ja)
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JPWO2023068149A1 (https=
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Application filed filed Critical
Priority claimed from PCT/JP2022/038142 external-priority patent/WO2023068149A1/ja
Publication of JPWO2023068149A1 publication Critical patent/JPWO2023068149A1/ja
Publication of JPWO2023068149A5 publication Critical patent/JPWO2023068149A5/ja
Pending legal-status Critical Current

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JP2023554601A 2021-10-20 2022-10-13 Pending JPWO2023068149A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021171573 2021-10-20
PCT/JP2022/038142 WO2023068149A1 (ja) 2021-10-20 2022-10-13 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023068149A1 JPWO2023068149A1 (https=) 2023-04-27
JPWO2023068149A5 true JPWO2023068149A5 (https=) 2024-07-09

Family

ID=86059075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023554601A Pending JPWO2023068149A1 (https=) 2021-10-20 2022-10-13

Country Status (5)

Country Link
US (1) US20240274743A1 (https=)
JP (1) JPWO2023068149A1 (https=)
CN (1) CN118120050A (https=)
DE (1) DE112022004501T5 (https=)
WO (1) WO2023068149A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128478A (ja) * 1987-11-12 1989-05-22 Mitsubishi Electric Corp 半導体ホトカプラ装置
JPH02122677A (ja) * 1988-11-01 1990-05-10 Matsushita Electron Corp 光結合半導体装置
JP2009021333A (ja) * 2007-07-11 2009-01-29 Nec Electronics Corp 光結合装置の製造方法及び光結合装置
JP2010153816A (ja) 2008-11-21 2010-07-08 Renesas Electronics Corp フォトカプラおよびその組立方法

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