JPWO2022264981A5 - - Google Patents

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Publication number
JPWO2022264981A5
JPWO2022264981A5 JP2023529872A JP2023529872A JPWO2022264981A5 JP WO2022264981 A5 JPWO2022264981 A5 JP WO2022264981A5 JP 2023529872 A JP2023529872 A JP 2023529872A JP 2023529872 A JP2023529872 A JP 2023529872A JP WO2022264981 A5 JPWO2022264981 A5 JP WO2022264981A5
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JP
Japan
Prior art keywords
light
light emitting
receiving element
emitting element
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023529872A
Other languages
English (en)
Japanese (ja)
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JPWO2022264981A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/023701 external-priority patent/WO2022264981A1/ja
Publication of JPWO2022264981A1 publication Critical patent/JPWO2022264981A1/ja
Publication of JPWO2022264981A5 publication Critical patent/JPWO2022264981A5/ja
Pending legal-status Critical Current

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JP2023529872A 2021-06-14 2022-06-14 Pending JPWO2022264981A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021098853 2021-06-14
PCT/JP2022/023701 WO2022264981A1 (ja) 2021-06-14 2022-06-14 絶縁モジュール

Publications (2)

Publication Number Publication Date
JPWO2022264981A1 JPWO2022264981A1 (https=) 2022-12-22
JPWO2022264981A5 true JPWO2022264981A5 (https=) 2024-03-18

Family

ID=84526491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529872A Pending JPWO2022264981A1 (https=) 2021-06-14 2022-06-14

Country Status (5)

Country Link
US (1) US20240113093A1 (https=)
JP (1) JPWO2022264981A1 (https=)
CN (1) CN117480622A (https=)
DE (1) DE112022003052T5 (https=)
WO (1) WO2022264981A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7582156B2 (ja) * 2021-10-27 2024-11-13 三菱電機株式会社 半導体装置及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3418664B2 (ja) * 1996-11-29 2003-06-23 シャープ株式会社 複数型光結合素子及びその製造方法
JP2010153816A (ja) * 2008-11-21 2010-07-08 Renesas Electronics Corp フォトカプラおよびその組立方法
US9000675B2 (en) 2010-09-21 2015-04-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Transmitting and receiving digital and analog signals across an isolator
JP2012222224A (ja) * 2011-04-12 2012-11-12 Sharp Corp 光結合装置
JP2013065717A (ja) * 2011-09-16 2013-04-11 Toshiba Corp 半導体装置およびその製造方法
US9236521B2 (en) * 2012-10-30 2016-01-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Optocoupler having lens layer
JP2014135473A (ja) * 2012-12-11 2014-07-24 Renesas Electronics Corp 光結合素子
JP5956968B2 (ja) * 2013-09-13 2016-07-27 株式会社東芝 受光素子および光結合型信号絶縁装置
JP2019012713A (ja) * 2017-06-29 2019-01-24 ルネサスエレクトロニクス株式会社 半導体装置

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