JPWO2022264981A1 - - Google Patents
Info
- Publication number
- JPWO2022264981A1 JPWO2022264981A1 JP2023529872A JP2023529872A JPWO2022264981A1 JP WO2022264981 A1 JPWO2022264981 A1 JP WO2022264981A1 JP 2023529872 A JP2023529872 A JP 2023529872A JP 2023529872 A JP2023529872 A JP 2023529872A JP WO2022264981 A1 JPWO2022264981 A1 JP WO2022264981A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/417—Bonding materials between chips and die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021098853 | 2021-06-14 | ||
| PCT/JP2022/023701 WO2022264981A1 (ja) | 2021-06-14 | 2022-06-14 | 絶縁モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264981A1 true JPWO2022264981A1 (https=) | 2022-12-22 |
| JPWO2022264981A5 JPWO2022264981A5 (https=) | 2024-03-18 |
Family
ID=84526491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529872A Pending JPWO2022264981A1 (https=) | 2021-06-14 | 2022-06-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240113093A1 (https=) |
| JP (1) | JPWO2022264981A1 (https=) |
| CN (1) | CN117480622A (https=) |
| DE (1) | DE112022003052T5 (https=) |
| WO (1) | WO2022264981A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7582156B2 (ja) * | 2021-10-27 | 2024-11-13 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3418664B2 (ja) * | 1996-11-29 | 2003-06-23 | シャープ株式会社 | 複数型光結合素子及びその製造方法 |
| JP2010153816A (ja) * | 2008-11-21 | 2010-07-08 | Renesas Electronics Corp | フォトカプラおよびその組立方法 |
| US9000675B2 (en) | 2010-09-21 | 2015-04-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transmitting and receiving digital and analog signals across an isolator |
| JP2012222224A (ja) * | 2011-04-12 | 2012-11-12 | Sharp Corp | 光結合装置 |
| JP2013065717A (ja) * | 2011-09-16 | 2013-04-11 | Toshiba Corp | 半導体装置およびその製造方法 |
| US9236521B2 (en) * | 2012-10-30 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optocoupler having lens layer |
| JP2014135473A (ja) * | 2012-12-11 | 2014-07-24 | Renesas Electronics Corp | 光結合素子 |
| JP5956968B2 (ja) * | 2013-09-13 | 2016-07-27 | 株式会社東芝 | 受光素子および光結合型信号絶縁装置 |
| JP2019012713A (ja) * | 2017-06-29 | 2019-01-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2022
- 2022-06-14 JP JP2023529872A patent/JPWO2022264981A1/ja active Pending
- 2022-06-14 DE DE112022003052.6T patent/DE112022003052T5/de not_active Withdrawn
- 2022-06-14 CN CN202280041897.5A patent/CN117480622A/zh active Pending
- 2022-06-14 WO PCT/JP2022/023701 patent/WO2022264981A1/ja not_active Ceased
-
2023
- 2023-12-12 US US18/537,324 patent/US20240113093A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022264981A1 (ja) | 2022-12-22 |
| US20240113093A1 (en) | 2024-04-04 |
| DE112022003052T5 (de) | 2024-04-04 |
| CN117480622A (zh) | 2024-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231208 |