JPWO2022264982A1 - - Google Patents
Info
- Publication number
- JPWO2022264982A1 JPWO2022264982A1 JP2023529873A JP2023529873A JPWO2022264982A1 JP WO2022264982 A1 JPWO2022264982 A1 JP WO2022264982A1 JP 2023529873 A JP2023529873 A JP 2023529873A JP 2023529873 A JP2023529873 A JP 2023529873A JP WO2022264982 A1 JPWO2022264982 A1 JP WO2022264982A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/26—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive semiconductor devices have potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/18—Modifications for indicating state of switch
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/78—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
- H03K17/785—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled controlling field-effect transistor switches
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021098854 | 2021-06-14 | ||
| PCT/JP2022/023702 WO2022264982A1 (ja) | 2021-06-14 | 2022-06-14 | 絶縁モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264982A1 true JPWO2022264982A1 (https=) | 2022-12-22 |
| JPWO2022264982A5 JPWO2022264982A5 (https=) | 2024-03-18 |
Family
ID=84526502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529873A Pending JPWO2022264982A1 (https=) | 2021-06-14 | 2022-06-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240113239A1 (https=) |
| JP (1) | JPWO2022264982A1 (https=) |
| CN (1) | CN117501459A (https=) |
| DE (1) | DE112022003051T5 (https=) |
| WO (1) | WO2022264982A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026023536A1 (ja) * | 2024-07-26 | 2026-01-29 | ローム株式会社 | 半導体装置および半導体装置アッセンブリ |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS584470B2 (ja) * | 1975-04-02 | 1983-01-26 | 株式会社日立製作所 | ヒカリケツゴウハンドウタイソウチ オヨビ ソノセイホウ |
| JP3816114B2 (ja) * | 1993-01-18 | 2006-08-30 | シャープ株式会社 | 光結合装置 |
| JP3418664B2 (ja) * | 1996-11-29 | 2003-06-23 | シャープ株式会社 | 複数型光結合素子及びその製造方法 |
| JPH11163391A (ja) * | 1997-11-29 | 1999-06-18 | New Japan Radio Co Ltd | 光半導体装置 |
| JP2003124437A (ja) * | 2001-10-19 | 2003-04-25 | Mitsubishi Electric Corp | 半導体装置 |
| US7736070B2 (en) * | 2005-08-31 | 2010-06-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Double mold optocoupler |
| US7973393B2 (en) * | 2009-02-04 | 2011-07-05 | Fairchild Semiconductor Corporation | Stacked micro optocouplers and methods of making the same |
| US9000675B2 (en) | 2010-09-21 | 2015-04-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transmitting and receiving digital and analog signals across an isolator |
| EP2677539B1 (en) * | 2011-02-15 | 2017-07-05 | Panasonic Intellectual Property Management Co., Ltd. | Process for manufacture of a semiconductor device |
| JP2013065717A (ja) * | 2011-09-16 | 2013-04-11 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP2013175561A (ja) * | 2012-02-24 | 2013-09-05 | Toshiba Corp | 光結合装置 |
| JP2015035439A (ja) * | 2013-08-07 | 2015-02-19 | ルネサスエレクトロニクス株式会社 | 光結合装置及び光結合装置の製造方法 |
| JP5956968B2 (ja) * | 2013-09-13 | 2016-07-27 | 株式会社東芝 | 受光素子および光結合型信号絶縁装置 |
| JP2017147364A (ja) * | 2016-02-18 | 2017-08-24 | 株式会社東芝 | 半導体モジュール |
| DE102016109901A1 (de) * | 2016-05-30 | 2017-11-30 | Osram Opto Semiconductors Gmbh | Lichtquelle |
| JP6222325B2 (ja) * | 2016-10-06 | 2017-11-01 | 日亜化学工業株式会社 | 発光装置 |
| JP2019012713A (ja) * | 2017-06-29 | 2019-01-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2022
- 2022-06-14 WO PCT/JP2022/023702 patent/WO2022264982A1/ja not_active Ceased
- 2022-06-14 CN CN202280041890.3A patent/CN117501459A/zh active Pending
- 2022-06-14 DE DE112022003051.8T patent/DE112022003051T5/de not_active Withdrawn
- 2022-06-14 JP JP2023529873A patent/JPWO2022264982A1/ja active Pending
-
2023
- 2023-12-12 US US18/537,297 patent/US20240113239A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN117501459A (zh) | 2024-02-02 |
| DE112022003051T5 (de) | 2024-04-04 |
| WO2022264982A1 (ja) | 2022-12-22 |
| US20240113239A1 (en) | 2024-04-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231130 |