JPWO2022264980A1 - - Google Patents
Info
- Publication number
- JPWO2022264980A1 JPWO2022264980A1 JP2023529871A JP2023529871A JPWO2022264980A1 JP WO2022264980 A1 JPWO2022264980 A1 JP WO2022264980A1 JP 2023529871 A JP2023529871 A JP 2023529871A JP 2023529871 A JP2023529871 A JP 2023529871A JP WO2022264980 A1 JPWO2022264980 A1 JP WO2022264980A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021098852 | 2021-06-14 | ||
| PCT/JP2022/023700 WO2022264980A1 (ja) | 2021-06-14 | 2022-06-14 | 絶縁モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264980A1 true JPWO2022264980A1 (https=) | 2022-12-22 |
| JPWO2022264980A5 JPWO2022264980A5 (https=) | 2024-03-18 |
Family
ID=84526500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529871A Pending JPWO2022264980A1 (https=) | 2021-06-14 | 2022-06-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240113238A1 (https=) |
| JP (1) | JPWO2022264980A1 (https=) |
| CN (1) | CN117529821A (https=) |
| DE (1) | DE112022003053T5 (https=) |
| WO (1) | WO2022264980A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12543601B2 (en) * | 2021-12-23 | 2026-02-03 | Intematix Corporation | Semiconductor optocoupler |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629455A (ja) * | 1992-07-13 | 1994-02-04 | Oki Electric Ind Co Ltd | 半導体パッケージ |
| JP3437709B2 (ja) * | 1996-04-16 | 2003-08-18 | 株式会社東芝 | 立体配線型光結合装置及び反射型光結合装置 |
| JP3418664B2 (ja) * | 1996-11-29 | 2003-06-23 | シャープ株式会社 | 複数型光結合素子及びその製造方法 |
| JP3745174B2 (ja) * | 1999-10-04 | 2006-02-15 | シャープ株式会社 | 光結合素子およびその製造方法 |
| JP5381280B2 (ja) * | 2009-04-23 | 2014-01-08 | オムロン株式会社 | 光結合装置 |
| JP2011181647A (ja) * | 2010-03-01 | 2011-09-15 | Omron Corp | 光結合装置及びその製造方法 |
| JP2013065717A (ja) * | 2011-09-16 | 2013-04-11 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP2013120940A (ja) | 2011-12-07 | 2013-06-17 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | オプトカプラ |
| JP2013179226A (ja) * | 2012-02-29 | 2013-09-09 | Toshiba Corp | 光結合装置 |
| JP2015060869A (ja) * | 2013-09-17 | 2015-03-30 | パナソニック株式会社 | 光結合装置 |
| TWI645585B (zh) * | 2017-03-03 | 2018-12-21 | 光感動股份有限公司 | 光半導體裝置與光半導體裝置的封裝件 |
| JP2019012713A (ja) * | 2017-06-29 | 2019-01-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| TWI680321B (zh) * | 2018-12-24 | 2019-12-21 | 兆龍國際股份有限公司 | 光耦合器 |
-
2022
- 2022-06-14 CN CN202280041888.6A patent/CN117529821A/zh active Pending
- 2022-06-14 WO PCT/JP2022/023700 patent/WO2022264980A1/ja not_active Ceased
- 2022-06-14 DE DE112022003053.4T patent/DE112022003053T5/de not_active Withdrawn
- 2022-06-14 JP JP2023529871A patent/JPWO2022264980A1/ja active Pending
-
2023
- 2023-12-12 US US18/537,258 patent/US20240113238A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240113238A1 (en) | 2024-04-04 |
| DE112022003053T5 (de) | 2024-04-04 |
| WO2022264980A1 (ja) | 2022-12-22 |
| CN117529821A (zh) | 2024-02-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231124 |