DE112022003053T5 - Isolationsmodul - Google Patents

Isolationsmodul Download PDF

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Publication number
DE112022003053T5
DE112022003053T5 DE112022003053.4T DE112022003053T DE112022003053T5 DE 112022003053 T5 DE112022003053 T5 DE 112022003053T5 DE 112022003053 T DE112022003053 T DE 112022003053T DE 112022003053 T5 DE112022003053 T5 DE 112022003053T5
Authority
DE
Germany
Prior art keywords
light
die pad
plastic
emitting element
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112022003053.4T
Other languages
German (de)
English (en)
Inventor
Masahiko ARIMURA
Tomoichiro Toyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022003053T5 publication Critical patent/DE112022003053T5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
DE112022003053.4T 2021-06-14 2022-06-14 Isolationsmodul Withdrawn DE112022003053T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021098852 2021-06-14
JP2021-098852 2021-06-14
PCT/JP2022/023700 WO2022264980A1 (ja) 2021-06-14 2022-06-14 絶縁モジュール

Publications (1)

Publication Number Publication Date
DE112022003053T5 true DE112022003053T5 (de) 2024-04-04

Family

ID=84526500

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022003053.4T Withdrawn DE112022003053T5 (de) 2021-06-14 2022-06-14 Isolationsmodul

Country Status (5)

Country Link
US (1) US20240113238A1 (https=)
JP (1) JPWO2022264980A1 (https=)
CN (1) CN117529821A (https=)
DE (1) DE112022003053T5 (https=)
WO (1) WO2022264980A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12543601B2 (en) * 2021-12-23 2026-02-03 Intematix Corporation Semiconductor optocoupler

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013120940A (ja) 2011-12-07 2013-06-17 Avago Technologies Ecbu Ip (Singapore) Pte Ltd オプトカプラ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629455A (ja) * 1992-07-13 1994-02-04 Oki Electric Ind Co Ltd 半導体パッケージ
JP3437709B2 (ja) * 1996-04-16 2003-08-18 株式会社東芝 立体配線型光結合装置及び反射型光結合装置
JP3418664B2 (ja) * 1996-11-29 2003-06-23 シャープ株式会社 複数型光結合素子及びその製造方法
JP3745174B2 (ja) * 1999-10-04 2006-02-15 シャープ株式会社 光結合素子およびその製造方法
JP5381280B2 (ja) * 2009-04-23 2014-01-08 オムロン株式会社 光結合装置
JP2011181647A (ja) * 2010-03-01 2011-09-15 Omron Corp 光結合装置及びその製造方法
JP2013065717A (ja) * 2011-09-16 2013-04-11 Toshiba Corp 半導体装置およびその製造方法
JP2013179226A (ja) * 2012-02-29 2013-09-09 Toshiba Corp 光結合装置
JP2015060869A (ja) * 2013-09-17 2015-03-30 パナソニック株式会社 光結合装置
TWI645585B (zh) * 2017-03-03 2018-12-21 光感動股份有限公司 光半導體裝置與光半導體裝置的封裝件
JP2019012713A (ja) * 2017-06-29 2019-01-24 ルネサスエレクトロニクス株式会社 半導体装置
TWI680321B (zh) * 2018-12-24 2019-12-21 兆龍國際股份有限公司 光耦合器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013120940A (ja) 2011-12-07 2013-06-17 Avago Technologies Ecbu Ip (Singapore) Pte Ltd オプトカプラ

Also Published As

Publication number Publication date
US20240113238A1 (en) 2024-04-04
WO2022264980A1 (ja) 2022-12-22
JPWO2022264980A1 (https=) 2022-12-22
CN117529821A (zh) 2024-02-06

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0031120000

Ipc: H10F0055000000

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee