JPWO2023286720A1 - - Google Patents
Info
- Publication number
- JPWO2023286720A1 JPWO2023286720A1 JP2023534783A JP2023534783A JPWO2023286720A1 JP WO2023286720 A1 JPWO2023286720 A1 JP WO2023286720A1 JP 2023534783 A JP2023534783 A JP 2023534783A JP 2023534783 A JP2023534783 A JP 2023534783A JP WO2023286720 A1 JPWO2023286720 A1 JP WO2023286720A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021115672 | 2021-07-13 | ||
| JP2021119864 | 2021-07-20 | ||
| PCT/JP2022/027186 WO2023286720A1 (ja) | 2021-07-13 | 2022-07-11 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023286720A1 true JPWO2023286720A1 (https=) | 2023-01-19 |
| JPWO2023286720A5 JPWO2023286720A5 (https=) | 2024-04-10 |
Family
ID=84919405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023534783A Pending JPWO2023286720A1 (https=) | 2021-07-13 | 2022-07-11 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240120261A1 (https=) |
| JP (1) | JPWO2023286720A1 (https=) |
| DE (1) | DE112022002409T5 (https=) |
| WO (1) | WO2023286720A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012014382A1 (ja) * | 2010-07-27 | 2013-09-09 | パナソニック株式会社 | 半導体装置 |
| JP5376540B2 (ja) * | 2011-11-08 | 2013-12-25 | Ｓｈプレシジョン株式会社 | リードフレーム及び半導体装置 |
| JP2016201447A (ja) * | 2015-04-09 | 2016-12-01 | 株式会社デンソー | モールドパッケージ |
| JP2021027116A (ja) | 2019-08-02 | 2021-02-22 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-07-11 WO PCT/JP2022/027186 patent/WO2023286720A1/ja not_active Ceased
- 2022-07-11 JP JP2023534783A patent/JPWO2023286720A1/ja active Pending
- 2022-07-11 DE DE112022002409.7T patent/DE112022002409T5/de active Pending
-
2023
- 2023-12-04 US US18/528,149 patent/US20240120261A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022002409T5 (de) | 2024-02-22 |
| US20240120261A1 (en) | 2024-04-11 |
| WO2023286720A1 (ja) | 2023-01-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231031 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250704 |