JPH11330410A5 - - Google Patents
Info
- Publication number
- JPH11330410A5 JPH11330410A5 JP1998128797A JP12879798A JPH11330410A5 JP H11330410 A5 JPH11330410 A5 JP H11330410A5 JP 1998128797 A JP1998128797 A JP 1998128797A JP 12879798 A JP12879798 A JP 12879798A JP H11330410 A5 JPH11330410 A5 JP H11330410A5
- Authority
- JP
- Japan
- Prior art keywords
- pads
- region
- memory device
- semiconductor memory
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12879798A JP3996267B2 (ja) | 1998-05-12 | 1998-05-12 | 半導体記憶装置 |
| TW088106238A TW429603B (en) | 1998-05-12 | 1999-04-19 | Semiconductor apparatus |
| KR1019990015869A KR100830009B1 (ko) | 1998-05-12 | 1999-05-03 | 반도체 장치 |
| US09/310,580 US20020096694A1 (en) | 1998-05-12 | 1999-05-12 | Semiconductor device |
| US09/966,085 US20020008255A1 (en) | 1998-05-12 | 2001-10-01 | Semiconductor device |
| US09/966,084 US20020008254A1 (en) | 1998-05-12 | 2001-10-01 | Semiconductor device |
| US10/330,054 US20030089926A1 (en) | 1998-05-12 | 2002-12-30 | Semiconductor device |
| US11/196,267 US7400034B2 (en) | 1998-05-12 | 2005-08-04 | Semiconductor device |
| US12/146,654 US7638871B2 (en) | 1998-05-12 | 2008-06-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12879798A JP3996267B2 (ja) | 1998-05-12 | 1998-05-12 | 半導体記憶装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11330410A JPH11330410A (ja) | 1999-11-30 |
| JPH11330410A5 true JPH11330410A5 (enExample) | 2005-12-22 |
| JP3996267B2 JP3996267B2 (ja) | 2007-10-24 |
Family
ID=14993685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12879798A Expired - Lifetime JP3996267B2 (ja) | 1998-05-12 | 1998-05-12 | 半導体記憶装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (6) | US20020096694A1 (enExample) |
| JP (1) | JP3996267B2 (enExample) |
| KR (1) | KR100830009B1 (enExample) |
| TW (1) | TW429603B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19960558B4 (de) * | 1999-12-15 | 2008-07-24 | Qimonda Ag | Halbleiterspeicher vom wahlfreien Zugriffstyp (DRAM) |
| KR100382739B1 (ko) * | 2001-04-13 | 2003-05-09 | 삼성전자주식회사 | 비대칭 데이터 경로를 갖는 반도체 메모리 장치 |
| KR100572322B1 (ko) * | 2003-11-27 | 2006-04-19 | 삼성전자주식회사 | 반도체메모리장치의 비트라인 감지증폭블록의 레이아웃구조 |
| DE102004012553A1 (de) * | 2004-03-15 | 2005-10-13 | Infineon Technologies Ag | Speicherbauelement mit asymmetrischer Kontaktreihe |
| US8298179B2 (en) | 2004-12-22 | 2012-10-30 | Boston Scientific Scimed, Inc. | Catheter assembly with tapered joints and method of manufacture |
| DE102005049248B4 (de) * | 2005-10-14 | 2008-06-26 | Qimonda Ag | Gehäuster DRAM-Chip für Hochgeschwindigkeitsanwendungen |
| JP2010074018A (ja) * | 2008-09-22 | 2010-04-02 | Nec Electronics Corp | 半導体装置 |
| JP5710955B2 (ja) * | 2010-12-10 | 2015-04-30 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
| KR101198141B1 (ko) * | 2010-12-21 | 2012-11-12 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 |
| JP2013021528A (ja) * | 2011-07-12 | 2013-01-31 | Elpida Memory Inc | 半導体装置、及び出力バッファのインピーダンスを調整する方法 |
| WO2016208685A1 (ja) * | 2015-06-26 | 2016-12-29 | オリンパス株式会社 | 内視鏡電源供給システム |
| KR102571550B1 (ko) * | 2018-02-14 | 2023-08-28 | 삼성전자주식회사 | 메모리 장치, 메모리 시스템 및 전자 장치 |
| US11631465B2 (en) | 2018-07-03 | 2023-04-18 | Samsung Electronics Co., Ltd. | Non-volatile memory device |
| US11164638B2 (en) | 2018-07-03 | 2021-11-02 | Samsung Electronics Co., Ltd. | Non-volatile memory device |
| KR102601213B1 (ko) * | 2018-07-03 | 2023-11-10 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 비휘발성 메모리 장치의 제조 방법 |
| JP2021047960A (ja) * | 2019-09-19 | 2021-03-25 | キオクシア株式会社 | 半導体記憶装置 |
| TWI792683B (zh) * | 2021-11-17 | 2023-02-11 | 旺宏電子股份有限公司 | 積體電路 |
| US11903194B2 (en) | 2021-11-17 | 2024-02-13 | Macronix International Co., Ltd. | Integrated circuit |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5262999A (en) * | 1988-06-17 | 1993-11-16 | Hitachi, Ltd. | Large scale integrated circuit for low voltage operation |
| US5579256A (en) * | 1988-11-01 | 1996-11-26 | Hitachi, Ltd. | Semiconductor memory device and defect remedying method thereof |
| KR0141495B1 (ko) * | 1988-11-01 | 1998-07-15 | 미다 가쓰시게 | 반도체 기억장치 및 그 결함구제방법 |
| JP2937363B2 (ja) * | 1989-09-29 | 1999-08-23 | 株式会社日立製作所 | 半導体記憶装置 |
| US5579258A (en) * | 1991-11-28 | 1996-11-26 | Olympus Optical Co., Ltd. | Ferroelectric memory |
| US5567655A (en) * | 1993-05-05 | 1996-10-22 | Lsi Logic Corporation | Method for forming interior bond pads having zig-zag linear arrangement |
| JP3299342B2 (ja) * | 1993-06-11 | 2002-07-08 | 株式会社日立製作所 | 半導体メモリモジュール |
| JPH0785655A (ja) * | 1993-09-16 | 1995-03-31 | Mitsubishi Electric Corp | 半導体記憶装置 |
| JP2647023B2 (ja) * | 1994-10-27 | 1997-08-27 | 日本電気株式会社 | 半導体記憶装置 |
| JP3160480B2 (ja) * | 1994-11-10 | 2001-04-25 | 株式会社東芝 | 半導体記憶装置 |
| US5661686A (en) * | 1994-11-11 | 1997-08-26 | Nkk Corporation | Nonvolatile semiconductor memory |
| KR100197570B1 (ko) * | 1995-08-31 | 1999-06-15 | 윤종용 | 고성능 동기 반도체 메모리 장치의 클럭 패드 배치 구조 |
| JP3406127B2 (ja) * | 1995-09-04 | 2003-05-12 | 三菱電機株式会社 | 半導体装置 |
| JPH09139184A (ja) * | 1995-11-15 | 1997-05-27 | Nikon Corp | 静電偏向器の製造方法 |
| JP3434398B2 (ja) * | 1995-11-28 | 2003-08-04 | 三菱電機株式会社 | 半導体装置 |
| KR0172426B1 (ko) * | 1995-12-21 | 1999-03-30 | 김광호 | 반도체 메모리장치 |
| JP3796317B2 (ja) * | 1996-06-12 | 2006-07-12 | キヤノン株式会社 | 電子ビーム露光方法及びそれを用いたデバイス製造方法 |
| JP3927620B2 (ja) * | 1996-06-12 | 2007-06-13 | キヤノン株式会社 | 電子ビーム露光方法及びそれを用いたデバイス製造方法 |
| US5929454A (en) * | 1996-06-12 | 1999-07-27 | Canon Kabushiki Kaisha | Position detection apparatus, electron beam exposure apparatus, and methods associated with them |
| JP3728015B2 (ja) * | 1996-06-12 | 2005-12-21 | キヤノン株式会社 | 電子ビーム露光システム及びそれを用いたデバイス製造方法 |
| US5981954A (en) * | 1997-01-16 | 1999-11-09 | Canon Kabushiki Kaisha | Electron beam exposure apparatus |
| JP3689516B2 (ja) * | 1997-01-29 | 2005-08-31 | キヤノン株式会社 | 電子ビーム露光装置 |
| JPH10214779A (ja) * | 1997-01-31 | 1998-08-11 | Canon Inc | 電子ビーム露光方法及び該方法を用いたデバイス製造方法 |
| US6107636A (en) * | 1997-02-07 | 2000-08-22 | Canon Kabushiki Kaisha | Electron beam exposure apparatus and its control method |
| US6104035A (en) * | 1997-06-02 | 2000-08-15 | Canon Kabushiki Kaisha | Electron-beam exposure apparatus and method |
| JP3787417B2 (ja) * | 1997-06-11 | 2006-06-21 | キヤノン株式会社 | 電子ビーム露光方法及び電子ビーム露光装置 |
| JP3048963B2 (ja) * | 1997-06-23 | 2000-06-05 | 日本電気アイシーマイコンシステム株式会社 | 半導体メモリ装置 |
| US6552353B1 (en) * | 1998-01-05 | 2003-04-22 | Canon Kabushiki Kaisha | Multi-electron beam exposure method and apparatus and device manufacturing method |
| US6255155B1 (en) * | 1998-04-23 | 2001-07-03 | Hyundai Electronics Industries Co., Ltd. | Nonvolatile memory and method for fabricating the same |
| JP2000049071A (ja) * | 1998-07-28 | 2000-02-18 | Canon Inc | 電子ビーム露光装置及び方法、ならびにデバイス製造方法 |
| JP4454706B2 (ja) * | 1998-07-28 | 2010-04-21 | キヤノン株式会社 | 電子ビーム露光方法及び装置、ならびにデバイス製造方法 |
| US6559456B1 (en) * | 1998-10-23 | 2003-05-06 | Canon Kabushiki Kaisha | Charged particle beam exposure method and apparatus |
| JP4100799B2 (ja) * | 1999-01-25 | 2008-06-11 | キヤノン株式会社 | マスクパターン転写方法、マスクパターン転写装置、デバイス製造方法及び転写マスク |
| JP2000232053A (ja) * | 1999-02-09 | 2000-08-22 | Canon Inc | マスクパターン転写方法、該マスクパターン転写方法を用いたマスクパターン転写装置及びデバイス製造方法 |
| US6465783B1 (en) * | 1999-06-24 | 2002-10-15 | Nikon Corporation | High-throughput specimen-inspection apparatus and methods utilizing multiple parallel charged particle beams and an array of multiple secondary-electron-detectors |
| JP4427847B2 (ja) * | 1999-11-04 | 2010-03-10 | エルピーダメモリ株式会社 | ダイナミック型ramと半導体装置 |
| US6566664B2 (en) * | 2000-03-17 | 2003-05-20 | Canon Kabushiki Kaisha | Charged-particle beam exposure apparatus and device manufacturing method |
| JP4947841B2 (ja) * | 2000-03-31 | 2012-06-06 | キヤノン株式会社 | 荷電粒子線露光装置 |
| JP4647820B2 (ja) * | 2001-04-23 | 2011-03-09 | キヤノン株式会社 | 荷電粒子線描画装置、および、デバイスの製造方法 |
| JP2003031172A (ja) * | 2001-07-16 | 2003-01-31 | Nikon Corp | 偏向器とその製造方法、及び荷電粒子露光装置 |
| US6873535B1 (en) * | 2004-02-04 | 2005-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple width and/or thickness write line in MRAM |
| JP4997872B2 (ja) * | 2006-08-22 | 2012-08-08 | ソニー株式会社 | 不揮発性半導体メモリデバイスおよびその製造方法 |
-
1998
- 1998-05-12 JP JP12879798A patent/JP3996267B2/ja not_active Expired - Lifetime
-
1999
- 1999-04-19 TW TW088106238A patent/TW429603B/zh active
- 1999-05-03 KR KR1019990015869A patent/KR100830009B1/ko not_active Expired - Lifetime
- 1999-05-12 US US09/310,580 patent/US20020096694A1/en not_active Abandoned
-
2001
- 2001-10-01 US US09/966,084 patent/US20020008254A1/en not_active Abandoned
- 2001-10-01 US US09/966,085 patent/US20020008255A1/en not_active Abandoned
-
2002
- 2002-12-30 US US10/330,054 patent/US20030089926A1/en not_active Abandoned
-
2005
- 2005-08-04 US US11/196,267 patent/US7400034B2/en not_active Expired - Fee Related
-
2008
- 2008-06-26 US US12/146,654 patent/US7638871B2/en not_active Expired - Fee Related
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