JPH10341035A - 半導体発光素子および半導体発光素子の製造方法 - Google Patents
半導体発光素子および半導体発光素子の製造方法Info
- Publication number
- JPH10341035A JPH10341035A JP12898798A JP12898798A JPH10341035A JP H10341035 A JPH10341035 A JP H10341035A JP 12898798 A JP12898798 A JP 12898798A JP 12898798 A JP12898798 A JP 12898798A JP H10341035 A JPH10341035 A JP H10341035A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- layer
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/868,009 US6229160B1 (en) | 1997-06-03 | 1997-06-03 | Light extraction from a semiconductor light-emitting device via chip shaping |
| US868,009 | 1997-06-03 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006031403A Division JP2006135360A (ja) | 1997-06-03 | 2006-02-08 | 半導体発光素子および半導体発光素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10341035A true JPH10341035A (ja) | 1998-12-22 |
| JPH10341035A5 JPH10341035A5 (enExample) | 2004-10-21 |
Family
ID=25350913
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12898798A Pending JPH10341035A (ja) | 1997-06-03 | 1998-05-12 | 半導体発光素子および半導体発光素子の製造方法 |
| JP2006031403A Pending JP2006135360A (ja) | 1997-06-03 | 2006-02-08 | 半導体発光素子および半導体発光素子の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006031403A Pending JP2006135360A (ja) | 1997-06-03 | 2006-02-08 | 半導体発光素子および半導体発光素子の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6229160B1 (enExample) |
| JP (2) | JPH10341035A (enExample) |
| KR (2) | KR100745229B1 (enExample) |
| DE (2) | DE19861386B4 (enExample) |
| GB (1) | GB2326023A (enExample) |
| TW (1) | TW360984B (enExample) |
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002026382A (ja) * | 2000-07-12 | 2002-01-25 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
| JP2004153277A (ja) * | 2002-10-29 | 2004-05-27 | Lumileds Lighting Us Llc | 輝度が増強された発光デバイス・スポット・エミッタ |
| JP2004200639A (ja) * | 2002-12-13 | 2004-07-15 | Ind Technol Res Inst | 発光ダイオード素子の製造方法および発光ダイオード素子 |
| JP2004214531A (ja) * | 2003-01-08 | 2004-07-29 | Toyoda Gosei Co Ltd | 発光ダイオードおよびledライト |
| JP2004281445A (ja) * | 2003-03-12 | 2004-10-07 | Sanyo Electric Co Ltd | 積層型発光ダイオード素子 |
| US7038245B2 (en) | 2002-03-14 | 2006-05-02 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device having angled side surface |
| JP2006196694A (ja) * | 2005-01-13 | 2006-07-27 | Sony Corp | 半導体発光素子 |
| JP2006310394A (ja) * | 2005-04-26 | 2006-11-09 | Sumitomo Electric Ind Ltd | 発光装置、発光装置の製造方法および窒化物半導体基板 |
| JP2007019467A (ja) * | 2005-06-10 | 2007-01-25 | Sony Corp | 発光ダイオード、発光ダイオードの製造方法、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器 |
| US7195942B2 (en) | 2000-02-15 | 2007-03-27 | Osram Gmbh | Radiation emitting semiconductor device |
| US7205578B2 (en) | 2000-02-15 | 2007-04-17 | Osram Gmbh | Semiconductor component which emits radiation, and method for producing the same |
| JP2007227980A (ja) * | 2007-06-08 | 2007-09-06 | Nichia Chem Ind Ltd | 窒化物半導体発光素子および発光素子の製造方法 |
| JP2007335731A (ja) * | 2006-06-16 | 2007-12-27 | Sony Corp | 発光ダイオード搭載基板、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器 |
| WO2008038917A1 (en) * | 2006-09-30 | 2008-04-03 | Seoul Opto Device Co., Ltd. | Method of fabricating light emitting diode chip |
| JP2008130721A (ja) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | 発光装置、半導体発光素子および半導体発光素子の製造方法 |
| CN100428513C (zh) * | 2005-05-20 | 2008-10-22 | 株式会社东芝 | 半导体发光元件 |
| US7465959B2 (en) | 2005-03-04 | 2008-12-16 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device, semiconductor light emitting apparatus, and method of manufacturing semiconductor light emitting device |
| US7488989B2 (en) | 2003-06-10 | 2009-02-10 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element, its manufacturing method and semiconductor light emitting device |
| JP2009033205A (ja) * | 2005-02-14 | 2009-02-12 | Showa Denko Kk | 窒化物半導体発光素子の製造方法 |
| JP2009515344A (ja) * | 2005-11-04 | 2009-04-09 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高い光抽出効率の発光ダイオード(led) |
| JP2010506402A (ja) * | 2006-10-02 | 2010-02-25 | イルミテックス, インコーポレイテッド | Ledのシステムおよび方法 |
| JP2010514187A (ja) * | 2006-12-21 | 2010-04-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 有形の波長変換器を有する発光装置 |
| US7791098B2 (en) | 2004-03-31 | 2010-09-07 | Nichia Corporation | Nitride semiconductor light emitting device |
| US7968897B2 (en) | 2004-03-09 | 2011-06-28 | Sanyo Electric Co., Ltd. | Light-emitting device having a support substrate and inclined sides |
| KR101063285B1 (ko) | 2009-06-17 | 2011-09-07 | (주)더리즈 | 방사각이 제어된 반도체 칩 |
| JP2011529267A (ja) * | 2008-07-24 | 2011-12-01 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 窓層及び光指向構造を含む半導体発光装置 |
| KR101143476B1 (ko) | 2009-05-21 | 2012-05-11 | (주)더리즈 | 경사단면을 갖는 반도체 칩 및 그 제조방법 |
| JP2013034010A (ja) * | 2006-02-16 | 2013-02-14 | Lg Electronics Inc | 縦型発光素子 |
| US9236529B2 (en) | 2013-07-30 | 2016-01-12 | Nichia Corporation | Semiconductor light emitting element having semiconductor structure with protrusions and/or recesses |
| JP2017017110A (ja) * | 2015-06-29 | 2017-01-19 | 国立研究開発法人情報通信研究機構 | 深紫外光を放射する半導体発光素子、該半導体発光素子を備える発光モジュール、及び該半導体発光素子の製造方法 |
| JP2022037718A (ja) * | 2020-08-25 | 2022-03-09 | シャープセミコンダクターイノベーション株式会社 | 画像表示素子 |
| US11393958B2 (en) | 2016-03-30 | 2022-07-19 | Sony Corporation | Light emitting device to improve the extraction efficiency |
Families Citing this family (209)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6784463B2 (en) * | 1997-06-03 | 2004-08-31 | Lumileds Lighting U.S., Llc | III-Phospide and III-Arsenide flip chip light-emitting devices |
| DE19727233A1 (de) * | 1997-06-26 | 1999-01-07 | Siemens Ag | Strahlungsemittierendes optoelektronisches Bauelement |
| US6346771B1 (en) * | 1997-11-19 | 2002-02-12 | Unisplay S.A. | High power led lamp |
| US8587020B2 (en) | 1997-11-19 | 2013-11-19 | Epistar Corporation | LED lamps |
| US6633120B2 (en) | 1998-11-19 | 2003-10-14 | Unisplay S.A. | LED lamps |
| US6373188B1 (en) * | 1998-12-22 | 2002-04-16 | Honeywell International Inc. | Efficient solid-state light emitting device with excited phosphors for producing a visible light output |
| DE19924316B4 (de) * | 1999-05-27 | 2010-10-07 | Zumtobel Lighting Gmbh | Lumineszenzdiode |
| JP2001007380A (ja) * | 1999-06-25 | 2001-01-12 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| US6486499B1 (en) * | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
| DE19963550B4 (de) * | 1999-12-22 | 2004-05-06 | Epigap Optoelektronik Gmbh | Bipolare Beleuchtungsquelle aus einem einseitig kontaktierten, selbstbündelnden Halbleiterkörper |
| TW497277B (en) * | 2000-03-10 | 2002-08-01 | Toshiba Corp | Semiconductor light emitting device and method for manufacturing the same |
| JP3795298B2 (ja) * | 2000-03-31 | 2006-07-12 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子の製造方法 |
| DE10019665A1 (de) | 2000-04-19 | 2001-10-31 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip und Verfahren zu dessen Herstellung |
| DE10031821B4 (de) * | 2000-06-30 | 2006-06-14 | Osram Opto Semiconductors Gmbh | LED mit Auskoppelstruktur |
| DE10032838B4 (de) * | 2000-07-06 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Strahlung emittierender Halbleiterchip und Verfahren zu dessen Herstellung |
| DE10033496A1 (de) * | 2000-07-10 | 2002-01-31 | Osram Opto Semiconductors Gmbh | Halbleiterchip für die Optoelektronik |
| JP2002043633A (ja) * | 2000-07-25 | 2002-02-08 | Stanley Electric Co Ltd | 白色発光ダイオ−ド |
| US20020017652A1 (en) * | 2000-08-08 | 2002-02-14 | Stefan Illek | Semiconductor chip for optoelectronics |
| DE10059532A1 (de) * | 2000-08-08 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Halbleiterchip für die Optoelektronik |
| US7547921B2 (en) * | 2000-08-08 | 2009-06-16 | Osram Opto Semiconductors Gmbh | Semiconductor chip for optoelectronics |
| DE10038671A1 (de) | 2000-08-08 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Halbleiterchip für die Optoelektronik |
| US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| AU2002239288A1 (en) * | 2000-11-17 | 2002-05-27 | Emcore Corporation | Laser separated die with tapered sidewalls for improved light extraction |
| US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| US6794684B2 (en) | 2001-02-01 | 2004-09-21 | Cree, Inc. | Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same |
| DE10105802A1 (de) | 2001-02-07 | 2002-08-08 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Reflektorbehaftetes Halbleiterbauelement |
| DE10111501B4 (de) | 2001-03-09 | 2019-03-21 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US6417019B1 (en) * | 2001-04-04 | 2002-07-09 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting diode |
| DE10120703A1 (de) | 2001-04-27 | 2002-10-31 | Osram Opto Semiconductors Gmbh | Halbleiterchip für die Optoelektronik |
| US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
| EP1263058B1 (en) * | 2001-05-29 | 2012-04-18 | Toyoda Gosei Co., Ltd. | Light-emitting element |
| US7211833B2 (en) | 2001-07-23 | 2007-05-01 | Cree, Inc. | Light emitting diodes including barrier layers/sublayers |
| US6740906B2 (en) | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
| DE10139723A1 (de) * | 2001-08-13 | 2003-03-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Chip und strahlungsemittierendes Bauelement |
| DE10148227B4 (de) * | 2001-09-28 | 2015-03-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip, Verfahren zu dessen Herstellung und strahlungsemittierendes Bauelement |
| US6963086B2 (en) | 2001-10-10 | 2005-11-08 | Sony Corporation | Semiconductor light-emitting device image display illuminator and its manufacturing method |
| US20030090103A1 (en) * | 2001-11-09 | 2003-05-15 | Thomas Becker | Direct mailing device |
| KR20030048805A (ko) * | 2001-12-13 | 2003-06-25 | 엘지이노텍 주식회사 | 광 효율을 높이기 위한 엘이디 칩 구조 |
| KR20030052499A (ko) * | 2001-12-21 | 2003-06-27 | 삼성전자주식회사 | 반도체 발광 소자 |
| US7638346B2 (en) * | 2001-12-24 | 2009-12-29 | Crystal Is, Inc. | Nitride semiconductor heterostructures and related methods |
| US8545629B2 (en) | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| US20060005763A1 (en) * | 2001-12-24 | 2006-01-12 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| FR2836584B1 (fr) * | 2002-02-27 | 2004-05-28 | Thomson Licensing Sa | Panneau electroluminescent dote d'elements d'extractions de lumiere |
| JP3776824B2 (ja) * | 2002-04-05 | 2006-05-17 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
| US6870311B2 (en) * | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
| US6841802B2 (en) * | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
| JP3874701B2 (ja) * | 2002-06-26 | 2007-01-31 | 株式会社東芝 | 半導体発光素子及び半導体発光装置 |
| KR20040005098A (ko) * | 2002-07-08 | 2004-01-16 | 주식회사 비첼 | 질화물계 반도체 발광 소자 및 그 제조방법 |
| DE10234977A1 (de) * | 2002-07-31 | 2004-02-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Dünnschicht-Halbleiterbauelement auf GaN-Basis |
| AU2003252359A1 (en) * | 2002-08-01 | 2004-02-23 | Nichia Corporation | Semiconductor light-emitting device, method for manufacturing same and light-emitting apparatus using same |
| US6784460B2 (en) * | 2002-10-10 | 2004-08-31 | Agilent Technologies, Inc. | Chip shaping for flip-chip light emitting diode |
| CA2863017A1 (en) * | 2002-10-10 | 2004-04-22 | Henry A. Blauvelt | Semiconductor photodetector with internal reflector |
| US6929966B2 (en) * | 2002-11-29 | 2005-08-16 | Osram Opto Semiconductors Gmbh | Method for producing a light-emitting semiconductor component |
| US7492092B2 (en) * | 2002-12-17 | 2009-02-17 | Seiko Epson Corporation | Self-emitting element, display panel, display apparatus, and method of manufacturing self-emitting element |
| GB0302580D0 (en) * | 2003-02-05 | 2003-03-12 | Univ Strathclyde | MICRO LEDs |
| JP4564234B2 (ja) * | 2003-02-17 | 2010-10-20 | 株式会社東芝 | 半導体発光素子 |
| DE10319782B4 (de) * | 2003-04-30 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement |
| US20040217702A1 (en) * | 2003-05-02 | 2004-11-04 | Garner Sean M. | Light extraction designs for organic light emitting diodes |
| US6869812B1 (en) | 2003-05-13 | 2005-03-22 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
| TWD100418S1 (zh) * | 2003-07-09 | 2004-09-21 | 松下電器產業股份有限公司 | 受光積體電路組件 |
| WO2005008792A1 (ja) * | 2003-07-18 | 2005-01-27 | Sanyo Electric Co., Ltd. | 発光ダイオード |
| WO2005011007A1 (ja) * | 2003-07-28 | 2005-02-03 | Toyoda Gosei Co., Ltd. | 発光ダイオード及びその製造方法 |
| FR2858859A1 (fr) * | 2003-08-14 | 2005-02-18 | Thomson Licensing Sa | Panneau electroluminescent dote d'elements d'extraction de lumiere |
| US7019330B2 (en) * | 2003-08-28 | 2006-03-28 | Lumileds Lighting U.S., Llc | Resonant cavity light emitting device |
| CN100499184C (zh) * | 2003-09-26 | 2009-06-10 | 奥斯兰姆奥普托半导体有限责任公司 | 发光薄膜半导体芯片 |
| TW200522397A (en) * | 2003-11-04 | 2005-07-01 | Shinetsu Handotai Kk | Light-emitting device |
| US7070301B2 (en) | 2003-11-04 | 2006-07-04 | 3M Innovative Properties Company | Side reflector for illumination using light emitting diode |
| USD505924S1 (en) | 2003-11-13 | 2005-06-07 | Sony Corporation | Semiconductor element |
| USD505923S1 (en) | 2003-11-13 | 2005-06-07 | Sony Corporation | Semiconductor element |
| US7090357B2 (en) * | 2003-12-23 | 2006-08-15 | 3M Innovative Properties Company | Combined light source for projection display |
| US7598527B2 (en) * | 2004-01-20 | 2009-10-06 | Binoptics Corporation | Monitoring photodetector for integrated photonic devices |
| US7080932B2 (en) * | 2004-01-26 | 2006-07-25 | Philips Lumileds Lighting Company, Llc | LED with an optical system to increase luminance by recycling emitted light |
| US7250635B2 (en) * | 2004-02-06 | 2007-07-31 | Dicon Fiberoptics, Inc. | Light emitting system with high extraction efficency |
| US7427146B2 (en) * | 2004-02-11 | 2008-09-23 | 3M Innovative Properties Company | Light-collecting illumination system |
| US7246923B2 (en) * | 2004-02-11 | 2007-07-24 | 3M Innovative Properties Company | Reshaping light source modules and illumination systems using the same |
| US7300177B2 (en) * | 2004-02-11 | 2007-11-27 | 3M Innovative Properties | Illumination system having a plurality of light source modules disposed in an array with a non-radially symmetrical aperture |
| TWI227063B (en) * | 2004-03-19 | 2005-01-21 | Ind Tech Res Inst | Light emitting diode and fabrication method thereof |
| US20050229102A1 (en) * | 2004-04-12 | 2005-10-13 | Microsoft Corporation | System and method for providing an interactive display |
| US8035113B2 (en) * | 2004-04-15 | 2011-10-11 | The Trustees Of Boston University | Optical devices featuring textured semiconductor layers |
| ATE527571T1 (de) * | 2004-04-15 | 2011-10-15 | Univ Boston | Optische bauelemente mit texturierten halbleiterschichten |
| US20060255349A1 (en) * | 2004-05-11 | 2006-11-16 | Heng Liu | High power AllnGaN based multi-chip light emitting diode |
| US7101050B2 (en) | 2004-05-14 | 2006-09-05 | 3M Innovative Properties Company | Illumination system with non-radially symmetrical aperture |
| US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| US7280288B2 (en) * | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
| US7372886B2 (en) * | 2004-06-07 | 2008-05-13 | Avago Technologies Fiber Ip Pte Ltd | High thermal conductivity vertical cavity surface emitting laser (VCSEL) |
| US7390097B2 (en) | 2004-08-23 | 2008-06-24 | 3M Innovative Properties Company | Multiple channel illumination system |
| US20060104061A1 (en) * | 2004-11-16 | 2006-05-18 | Scott Lerner | Display with planar light source |
| KR20060077801A (ko) * | 2004-12-31 | 2006-07-05 | 엘지전자 주식회사 | 고출력 발광 다이오드 및 그의 제조 방법 |
| DE102005020908A1 (de) * | 2005-02-28 | 2006-08-31 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
| US7341878B2 (en) * | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
| US7804100B2 (en) * | 2005-03-14 | 2010-09-28 | Philips Lumileds Lighting Company, Llc | Polarization-reversed III-nitride light emitting device |
| KR100593933B1 (ko) * | 2005-03-18 | 2006-06-30 | 삼성전기주식회사 | 산란 영역을 갖는 측면 방출형 발광다이오드 패키지 및이를 포함하는 백라이트 장치 |
| US20060237735A1 (en) * | 2005-04-22 | 2006-10-26 | Jean-Yves Naulin | High-efficiency light extraction structures and methods for solid-state lighting |
| TW200638559A (en) * | 2005-04-29 | 2006-11-01 | Hon Hai Prec Ind Co Ltd | Light emitting chip and light emitting diode |
| US7952112B2 (en) * | 2005-04-29 | 2011-05-31 | Philips Lumileds Lighting Company Llc | RGB thermal isolation substrate |
| KR100682877B1 (ko) * | 2005-07-12 | 2007-02-15 | 삼성전기주식회사 | 발광다이오드 및 그 제조방법 |
| US20070034882A1 (en) * | 2005-08-15 | 2007-02-15 | Takayoshi Fujii | Semiconductor light-emitting device |
| TWI316772B (en) * | 2005-09-20 | 2009-11-01 | Showa Denko Kk | Group iii nitride semiconductor light-emitting device |
| EP1935036A1 (de) * | 2005-10-14 | 2008-06-25 | Lucea AG | Flache led - lichtquelle mit effizienter lichtauskopplung |
| US20070096120A1 (en) * | 2005-10-27 | 2007-05-03 | Gelcore Llc | Lateral current GaN flip chip LED with shaped transparent substrate |
| WO2007065018A2 (en) | 2005-12-02 | 2007-06-07 | Crystal Is, Inc. | Doped aluminum nitride crystals and methods of making them |
| EP1969647A4 (en) * | 2005-12-08 | 2012-08-01 | Univ California | LIGHTING DIODE (LED) WITH HIGH EFFICIENCY |
| JP5270088B2 (ja) * | 2005-12-15 | 2013-08-21 | エルジー エレクトロニクス インコーポレイティド | 垂直型発光素子及びその製造方法 |
| US7772604B2 (en) | 2006-01-05 | 2010-08-10 | Illumitex | Separate optical device for directing light from an LED |
| WO2007083829A1 (en) * | 2006-01-23 | 2007-07-26 | Showa Denko K.K. | Light-emitting diode and method for fabrication thereof |
| US8269236B2 (en) * | 2006-02-08 | 2012-09-18 | Showa Denko K.K. | Light-emitting diode and fabrication method thereof |
| KR101294518B1 (ko) * | 2006-02-14 | 2013-08-07 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조 방법 |
| WO2007123735A1 (en) * | 2006-03-30 | 2007-11-01 | Crystal Is, Inc. | Methods for controllable doping of aluminum nitride bulk crystals |
| US9034103B2 (en) | 2006-03-30 | 2015-05-19 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them |
| KR100732191B1 (ko) * | 2006-04-21 | 2007-06-27 | 한국과학기술원 | 다층 반사기 구조의 고효율 발광다이오드 및 그의 제조방법 |
| KR100778820B1 (ko) * | 2006-04-25 | 2007-11-22 | 포항공과대학교 산학협력단 | 금속 전극 형성 방법 및 반도체 발광 소자의 제조 방법 및질화물계 화합물 반도체 발광 소자 |
| JP4863203B2 (ja) * | 2006-04-28 | 2012-01-25 | スタンレー電気株式会社 | 半導体発光装置 |
| US8174025B2 (en) * | 2006-06-09 | 2012-05-08 | Philips Lumileds Lighting Company, Llc | Semiconductor light emitting device including porous layer |
| KR100812648B1 (ko) * | 2006-06-15 | 2008-03-13 | 한국광기술원 | 경사식각된 발광다이오드 및 그 제조방법 |
| JP2008004587A (ja) * | 2006-06-20 | 2008-01-10 | Sharp Corp | 半導体発光素子及びその製造方法並びに化合物半導体発光ダイオード |
| JP4282693B2 (ja) * | 2006-07-04 | 2009-06-24 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| KR20080028292A (ko) * | 2006-09-20 | 2008-03-31 | 재단법인서울대학교산학협력재단 | 경사진 측벽 반사면을 갖는 ⅲ―니트라이드계 led 구조및 그 제조방법 |
| KR101262386B1 (ko) | 2006-09-25 | 2013-05-08 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자의 제조 방법 |
| US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
| US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
| US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
| US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
| US7952262B2 (en) * | 2006-09-30 | 2011-05-31 | Ruud Lighting, Inc. | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
| US20090275157A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device shaping |
| EP2081238A1 (en) * | 2006-11-08 | 2009-07-22 | C. I. Kasei Company, Limited | Light emitting device and method for manufacturing the same |
| EP2843716A3 (en) | 2006-11-15 | 2015-04-29 | The Regents of The University of California | Textured phosphor conversion layer light emitting diode |
| KR20090082923A (ko) * | 2006-11-15 | 2009-07-31 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 다중 추출기를 통하여 광을 고효율로 추출하는 발광 다이오드 |
| TW201448263A (zh) | 2006-12-11 | 2014-12-16 | 美國加利福尼亞大學董事會 | 透明發光二極體 |
| US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| WO2008088838A1 (en) * | 2007-01-17 | 2008-07-24 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| WO2008091837A2 (en) | 2007-01-22 | 2008-07-31 | Cree Led Lighting Solutions, Inc. | Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters |
| US8080833B2 (en) | 2007-01-26 | 2011-12-20 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
| CN101652832B (zh) * | 2007-01-26 | 2011-06-22 | 晶体公司 | 厚的赝晶氮化物外延层 |
| GB2447091B8 (en) | 2007-03-02 | 2010-01-13 | Photonstar Led Ltd | Vertical light emitting diodes |
| US7618163B2 (en) * | 2007-04-02 | 2009-11-17 | Ruud Lighting, Inc. | Light-directing LED apparatus |
| EP2149920A1 (en) | 2007-05-17 | 2010-02-03 | Showa Denko K.K. | Semiconductor light-emitting device |
| US8088220B2 (en) | 2007-05-24 | 2012-01-03 | Crystal Is, Inc. | Deep-eutectic melt growth of nitride crystals |
| US20090050905A1 (en) * | 2007-08-20 | 2009-02-26 | Abu-Ageel Nayef M | Highly Efficient Light-Emitting Diode |
| CN100592539C (zh) * | 2007-09-12 | 2010-02-24 | 泰谷光电科技股份有限公司 | 发光二极管元件的制造方法 |
| GB0722054D0 (en) * | 2007-11-09 | 2007-12-19 | Photonstar Led Ltd | LED with enhanced light extraction |
| JP4974867B2 (ja) * | 2007-12-12 | 2012-07-11 | 昭和電工株式会社 | 発光ダイオード及びその製造方法 |
| US20090173956A1 (en) * | 2007-12-14 | 2009-07-09 | Philips Lumileds Lighting Company, Llc | Contact for a semiconductor light emitting device |
| US8101447B2 (en) * | 2007-12-20 | 2012-01-24 | Tekcore Co., Ltd. | Light emitting diode element and method for fabricating the same |
| US7579202B2 (en) * | 2007-12-21 | 2009-08-25 | Tekcore Co., Ltd. | Method for fabricating light emitting diode element |
| JP5315070B2 (ja) * | 2008-02-07 | 2013-10-16 | 昭和電工株式会社 | 化合物半導体発光ダイオード |
| KR20100122485A (ko) | 2008-02-08 | 2010-11-22 | 일루미텍스, 인크. | 발광체층 쉐이핑을 위한 시스템 및 방법 |
| US8592800B2 (en) * | 2008-03-07 | 2013-11-26 | Trustees Of Boston University | Optical devices featuring nonpolar textured semiconductor layers |
| DE102009018603B9 (de) | 2008-04-25 | 2021-01-14 | Samsung Electronics Co., Ltd. | Leuchtvorrichtung und Herstellungsverfahren derselben |
| US9423096B2 (en) | 2008-05-23 | 2016-08-23 | Cree, Inc. | LED lighting apparatus |
| US8348475B2 (en) | 2008-05-23 | 2013-01-08 | Ruud Lighting, Inc. | Lens with controlled backlight management |
| US8388193B2 (en) * | 2008-05-23 | 2013-03-05 | Ruud Lighting, Inc. | Lens with TIR for off-axial light distribution |
| US7841750B2 (en) | 2008-08-01 | 2010-11-30 | Ruud Lighting, Inc. | Light-directing lensing member with improved angled light distribution |
| TW201017863A (en) * | 2008-10-03 | 2010-05-01 | Versitech Ltd | Semiconductor color-tunable broadband light sources and full-color microdisplays |
| TWI370563B (en) * | 2008-10-27 | 2012-08-11 | Epistar Corp | Vertical ac led |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| TWI398967B (zh) * | 2009-02-20 | 2013-06-11 | Lite On Electronics Guangzhou | 發光二極體晶片及其製法 |
| US9255686B2 (en) | 2009-05-29 | 2016-02-09 | Cree, Inc. | Multi-lens LED-array optic system |
| US20100314551A1 (en) * | 2009-06-11 | 2010-12-16 | Bettles Timothy J | In-line Fluid Treatment by UV Radiation |
| EP2460191A2 (en) | 2009-07-30 | 2012-06-06 | 3M Innovative Properties Company | Pixelated led |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| US8283676B2 (en) * | 2010-01-21 | 2012-10-09 | Siphoton Inc. | Manufacturing process for solid state lighting device on a conductive substrate |
| US20110188054A1 (en) * | 2010-02-02 | 2011-08-04 | Primesense Ltd | Integrated photonics module for optical projection |
| JP5343018B2 (ja) | 2010-02-08 | 2013-11-13 | 昭和電工株式会社 | 発光ダイオード及びその製造方法、並びに発光ダイオードランプ |
| CN101807647A (zh) * | 2010-03-19 | 2010-08-18 | 厦门市三安光电科技有限公司 | 具有倾斜侧面的铝镓铟磷系发光二极管的制作工艺 |
| KR101729263B1 (ko) * | 2010-05-24 | 2017-04-21 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자의 제조방법 및 발광 소자 패키지 |
| CN103038400B (zh) | 2010-06-30 | 2016-06-22 | 晶体公司 | 使用热梯度控制的大块氮化铝单晶的生长 |
| US8723201B2 (en) | 2010-08-20 | 2014-05-13 | Invenlux Corporation | Light-emitting devices with substrate coated with optically denser material |
| KR101274651B1 (ko) | 2010-11-30 | 2013-06-12 | 엘지디스플레이 주식회사 | 발광 다이오드 및 이의 제조 방법 |
| CN102646773B (zh) * | 2011-02-17 | 2015-02-04 | 展晶科技(深圳)有限公司 | Led封装结构及制程 |
| JP5754173B2 (ja) * | 2011-03-01 | 2015-07-29 | ソニー株式会社 | 発光ユニットおよび表示装置 |
| TWI467805B (zh) | 2011-03-08 | 2015-01-01 | 光磊科技股份有限公司 | 具寬視角的發光二極體及其製造方法 |
| US8962359B2 (en) | 2011-07-19 | 2015-02-24 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
| US9046241B2 (en) | 2011-11-12 | 2015-06-02 | Jingqun Xi | High efficiency directional light source using lens optics |
| US20130187179A1 (en) | 2012-01-23 | 2013-07-25 | Sharp Kabushiki Kaisha | Light emitting diode with improved directionality |
| GB201202222D0 (en) * | 2012-02-09 | 2012-03-28 | Mled Ltd | Enhanced light extraction |
| US9157790B2 (en) | 2012-02-15 | 2015-10-13 | Apple Inc. | Integrated optoelectronic modules with transmitter, receiver and beam-combining optics for aligning a beam axis with a collection axis |
| US9541258B2 (en) | 2012-02-29 | 2017-01-10 | Cree, Inc. | Lens for wide lateral-angle distribution |
| US9541257B2 (en) | 2012-02-29 | 2017-01-10 | Cree, Inc. | Lens for primarily-elongate light distribution |
| US10408429B2 (en) | 2012-02-29 | 2019-09-10 | Ideal Industries Lighting Llc | Lens for preferential-side distribution |
| US9595636B2 (en) | 2012-03-28 | 2017-03-14 | Sensor Electronic Technology, Inc. | Light emitting device substrate with inclined sidewalls |
| US10096742B2 (en) | 2012-03-28 | 2018-10-09 | Sensor Electronic Technology, Inc. | Light emitting device substrate with inclined sidewalls |
| USD697664S1 (en) | 2012-05-07 | 2014-01-14 | Cree, Inc. | LED lens |
| JP5995563B2 (ja) * | 2012-07-11 | 2016-09-21 | 株式会社ディスコ | 光デバイスの加工方法 |
| US9151664B2 (en) | 2012-08-03 | 2015-10-06 | Hoya Corporation Usa | Submount for optoelectronic, optical, or photonic components |
| US9958510B2 (en) * | 2012-09-14 | 2018-05-01 | California Institute Of Technology | Integrated magnetic spectrometer for multiplexed biosensing |
| WO2014051620A1 (en) | 2012-09-28 | 2014-04-03 | Empire Technology Development Llc | Lighting device and methods of making the same |
| USD718490S1 (en) | 2013-03-15 | 2014-11-25 | Cree, Inc. | LED lens |
| CN105144345B (zh) | 2013-03-15 | 2018-05-08 | 晶体公司 | 与赝配电子和光电器件的平面接触 |
| JP6680670B2 (ja) * | 2013-04-11 | 2020-04-15 | ルミレッズ ホールディング ベーフェー | トップエミッション型半導体発光デバイス |
| KR20140140399A (ko) | 2013-05-29 | 2014-12-09 | 서울바이오시스 주식회사 | 복수개의 발광 요소들을 갖는 발광다이오드 및 그것을 제조하는 방법 |
| US9523479B2 (en) | 2014-01-03 | 2016-12-20 | Cree, Inc. | LED lens |
| CN105977348B (zh) * | 2016-05-17 | 2018-04-13 | 太原理工大学 | 基于3d打印铁磁层增强led发光效率的方法 |
| WO2018063389A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Micro light emitting diodes with angled or curved geometries for improved power efficiency |
| CN106848029B (zh) * | 2016-12-07 | 2019-06-11 | 华灿光电(浙江)有限公司 | 一种高亮发光二极管的芯片及其制作方法 |
| JP7046834B2 (ja) * | 2016-12-20 | 2022-04-04 | スタンレー電気株式会社 | Iii族窒化物発光素子及び該発光素子の製造方法 |
| US10409080B2 (en) * | 2017-02-01 | 2019-09-10 | Facebook Technologies, Llc | Spherical display using flexible substrates |
| US10468566B2 (en) | 2017-04-10 | 2019-11-05 | Ideal Industries Lighting Llc | Hybrid lens for controlled light distribution |
| US10707374B2 (en) | 2017-09-15 | 2020-07-07 | Glo Ab | Etendue enhancement for light emitting diode subpixels |
| US10908383B1 (en) | 2017-11-19 | 2021-02-02 | Apple Inc. | Local control loop for projection system focus adjustment |
| CN109192833B (zh) * | 2018-08-22 | 2020-09-15 | 大连德豪光电科技有限公司 | 发光二极管芯片及其制备方法 |
| US11178392B2 (en) | 2018-09-12 | 2021-11-16 | Apple Inc. | Integrated optical emitters and applications thereof |
| US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
| DE102020112969B4 (de) | 2020-05-13 | 2024-02-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender halbleiterchip, rücklicht für ein kraftfahrzeug und kraftfahrzeug |
| US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
| DE102020125892A1 (de) | 2020-10-02 | 2022-04-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische vorrichtung und verfahren zum erzeugen einer optoelektronischen vorrichtung |
| US11784287B2 (en) * | 2021-05-26 | 2023-10-10 | Meta Platforms Technologies, Llc | Surface potential barrier for surface loss reduction at mesa sidewalls of micro-LEDs |
| US12495657B1 (en) | 2022-12-09 | 2025-12-09 | Meta Platforms Technologies, Llc | Micro-LED with field-effect isolation |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2416098A1 (de) * | 1974-04-03 | 1975-10-09 | Siemens Ag | Optische halbleiterstrahlungsquelle mit domfoermig ausgebildeter oberflaeche |
| FR2406896A1 (fr) | 1977-10-18 | 1979-05-18 | Thomson Csf | Diode emettrice et receptrice en lumiere notamment pour telecommunications optiques |
| US4276098A (en) * | 1980-03-31 | 1981-06-30 | Bell Telephone Laboratories, Incorporated | Batch processing of semiconductor devices |
| FR2493047A1 (fr) | 1980-10-28 | 1982-04-30 | Thomson Csf | Transistor emetteur-recepteur de lumiere pour telecommunications a l'alternat sur fibre optique |
| JPS63152179A (ja) * | 1986-12-16 | 1988-06-24 | Nec Corp | 半導体発光素子 |
| US5187547A (en) | 1988-05-18 | 1993-02-16 | Sanyo Electric Co., Ltd. | Light emitting diode device and method for producing same |
| JP2650744B2 (ja) | 1988-12-28 | 1997-09-03 | シャープ株式会社 | 発光ダイオード |
| EP0397911A1 (de) * | 1989-05-19 | 1990-11-22 | Siemens Aktiengesellschaft | Optoelektronisches Halbleiterbauelement |
| US5087949A (en) | 1989-06-27 | 1992-02-11 | Hewlett-Packard Company | Light-emitting diode with diagonal faces |
| EP0405757A3 (en) * | 1989-06-27 | 1991-01-30 | Hewlett-Packard Company | High efficiency light-emitting diode |
| FR2649537B1 (fr) * | 1989-07-04 | 1991-10-11 | Philips Electronique Lab | Dispositif optoelectronique integre incluant une diode photoluminescente |
| JPH04343484A (ja) * | 1991-05-21 | 1992-11-30 | Eastman Kodak Japan Kk | 発光ダイオードアレイ |
| US5233204A (en) * | 1992-01-10 | 1993-08-03 | Hewlett-Packard Company | Light-emitting diode with a thick transparent layer |
| JP2964822B2 (ja) | 1993-02-19 | 1999-10-18 | 日亜化学工業株式会社 | 発光ダイオードの製造方法 |
| US5376580A (en) | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
| JPH08139360A (ja) | 1994-09-12 | 1996-05-31 | Showa Denko Kk | 半導体ヘテロ接合材料 |
| JPH08102551A (ja) * | 1994-09-30 | 1996-04-16 | Kyocera Corp | 半導体発光装置およびその製造方法 |
| US5517039A (en) | 1994-11-14 | 1996-05-14 | Hewlett-Packard Company | Semiconductor devices fabricated with passivated high aluminum-content III-V material |
| DE19629920B4 (de) | 1995-08-10 | 2006-02-02 | LumiLeds Lighting, U.S., LLC, San Jose | Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor |
| DE19536438A1 (de) | 1995-09-29 | 1997-04-03 | Siemens Ag | Halbleiterbauelement und Herstellverfahren |
| JP3035568B2 (ja) | 1995-11-08 | 2000-04-24 | 株式会社共立物流システム | インキ等の粘稠物用の内蓋付きタンク |
| US5705834A (en) | 1996-04-23 | 1998-01-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Increased efficiency LED |
| JP3255220B2 (ja) * | 1996-09-11 | 2002-02-12 | サンケン電気株式会社 | 半導体発光素子 |
| JPH1093136A (ja) * | 1996-09-11 | 1998-04-10 | Sanken Electric Co Ltd | 半導体発光素子 |
| WO1998031055A1 (en) * | 1997-01-09 | 1998-07-16 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
| JP3559680B2 (ja) * | 1997-04-25 | 2004-09-02 | キヤノン株式会社 | リング共振器型面発光半導体レーザ及びその製造法 |
-
1997
- 1997-06-03 US US08/868,009 patent/US6229160B1/en not_active Expired - Lifetime
- 1997-12-30 TW TW086119974A patent/TW360984B/zh not_active IP Right Cessation
-
1998
- 1998-02-24 DE DE19861386.5A patent/DE19861386B4/de not_active Expired - Lifetime
- 1998-02-24 DE DE19807758A patent/DE19807758B4/de not_active Expired - Lifetime
- 1998-05-12 JP JP12898798A patent/JPH10341035A/ja active Pending
- 1998-05-22 GB GB9811180A patent/GB2326023A/en not_active Withdrawn
- 1998-06-02 KR KR1019980020379A patent/KR100745229B1/ko not_active Expired - Lifetime
-
2000
- 2000-12-06 US US09/732,459 patent/US6323063B2/en not_active Expired - Lifetime
- 2000-12-06 US US09/732,326 patent/US6570190B2/en not_active Expired - Lifetime
-
2006
- 2006-02-08 JP JP2006031403A patent/JP2006135360A/ja active Pending
-
2007
- 2007-03-05 KR KR1020070021537A patent/KR100753710B1/ko not_active Expired - Lifetime
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7195942B2 (en) | 2000-02-15 | 2007-03-27 | Osram Gmbh | Radiation emitting semiconductor device |
| US7205578B2 (en) | 2000-02-15 | 2007-04-17 | Osram Gmbh | Semiconductor component which emits radiation, and method for producing the same |
| JP2002026382A (ja) * | 2000-07-12 | 2002-01-25 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
| US10312422B2 (en) | 2000-09-12 | 2019-06-04 | Lumileds Llc | Light emitting devices with optical elements and bonding layers |
| US9583683B2 (en) | 2000-09-12 | 2017-02-28 | Lumileds Llc | Light emitting devices with optical elements and bonding layers |
| US7329903B2 (en) | 2002-03-14 | 2008-02-12 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate |
| US7038245B2 (en) | 2002-03-14 | 2006-05-02 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device having angled side surface |
| JP2004153277A (ja) * | 2002-10-29 | 2004-05-27 | Lumileds Lighting Us Llc | 輝度が増強された発光デバイス・スポット・エミッタ |
| JP2004200639A (ja) * | 2002-12-13 | 2004-07-15 | Ind Technol Res Inst | 発光ダイオード素子の製造方法および発光ダイオード素子 |
| JP2004214531A (ja) * | 2003-01-08 | 2004-07-29 | Toyoda Gosei Co Ltd | 発光ダイオードおよびledライト |
| JP2004281445A (ja) * | 2003-03-12 | 2004-10-07 | Sanyo Electric Co Ltd | 積層型発光ダイオード素子 |
| US7488989B2 (en) | 2003-06-10 | 2009-02-10 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element, its manufacturing method and semiconductor light emitting device |
| US7968897B2 (en) | 2004-03-09 | 2011-06-28 | Sanyo Electric Co., Ltd. | Light-emitting device having a support substrate and inclined sides |
| US7791098B2 (en) | 2004-03-31 | 2010-09-07 | Nichia Corporation | Nitride semiconductor light emitting device |
| JP2006196694A (ja) * | 2005-01-13 | 2006-07-27 | Sony Corp | 半導体発光素子 |
| JP2009033205A (ja) * | 2005-02-14 | 2009-02-12 | Showa Denko Kk | 窒化物半導体発光素子の製造方法 |
| US7465959B2 (en) | 2005-03-04 | 2008-12-16 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device, semiconductor light emitting apparatus, and method of manufacturing semiconductor light emitting device |
| JP2006310394A (ja) * | 2005-04-26 | 2006-11-09 | Sumitomo Electric Ind Ltd | 発光装置、発光装置の製造方法および窒化物半導体基板 |
| US7560740B2 (en) | 2005-04-26 | 2009-07-14 | Sumitomo Electric Industries, Ltd. | Light-emitting device |
| CN100428513C (zh) * | 2005-05-20 | 2008-10-22 | 株式会社东芝 | 半导体发光元件 |
| JP2007019467A (ja) * | 2005-06-10 | 2007-01-25 | Sony Corp | 発光ダイオード、発光ダイオードの製造方法、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器 |
| JP2009515344A (ja) * | 2005-11-04 | 2009-04-09 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高い光抽出効率の発光ダイオード(led) |
| JP2013034010A (ja) * | 2006-02-16 | 2013-02-14 | Lg Electronics Inc | 縦型発光素子 |
| JP2007335731A (ja) * | 2006-06-16 | 2007-12-27 | Sony Corp | 発光ダイオード搭載基板、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器 |
| US7951630B2 (en) | 2006-09-30 | 2011-05-31 | Seoul Opto Device Co., Ltd. | Method of fabricating light emitting diode chip |
| WO2008038917A1 (en) * | 2006-09-30 | 2008-04-03 | Seoul Opto Device Co., Ltd. | Method of fabricating light emitting diode chip |
| US8481352B2 (en) | 2006-09-30 | 2013-07-09 | Seoul Opto Device Co., Ltd. | Method of fabricating light emitting diode chip |
| JP2010506402A (ja) * | 2006-10-02 | 2010-02-25 | イルミテックス, インコーポレイテッド | Ledのシステムおよび方法 |
| JP2008130721A (ja) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | 発光装置、半導体発光素子および半導体発光素子の製造方法 |
| JP2010514187A (ja) * | 2006-12-21 | 2010-04-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 有形の波長変換器を有する発光装置 |
| JP2007227980A (ja) * | 2007-06-08 | 2007-09-06 | Nichia Chem Ind Ltd | 窒化物半導体発光素子および発光素子の製造方法 |
| JP2011529267A (ja) * | 2008-07-24 | 2011-12-01 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 窓層及び光指向構造を含む半導体発光装置 |
| KR101143476B1 (ko) | 2009-05-21 | 2012-05-11 | (주)더리즈 | 경사단면을 갖는 반도체 칩 및 그 제조방법 |
| KR101063285B1 (ko) | 2009-06-17 | 2011-09-07 | (주)더리즈 | 방사각이 제어된 반도체 칩 |
| US9236529B2 (en) | 2013-07-30 | 2016-01-12 | Nichia Corporation | Semiconductor light emitting element having semiconductor structure with protrusions and/or recesses |
| JP2017017110A (ja) * | 2015-06-29 | 2017-01-19 | 国立研究開発法人情報通信研究機構 | 深紫外光を放射する半導体発光素子、該半導体発光素子を備える発光モジュール、及び該半導体発光素子の製造方法 |
| US11393958B2 (en) | 2016-03-30 | 2022-07-19 | Sony Corporation | Light emitting device to improve the extraction efficiency |
| JP2022037718A (ja) * | 2020-08-25 | 2022-03-09 | シャープセミコンダクターイノベーション株式会社 | 画像表示素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19807758A1 (de) | 1998-12-10 |
| JP2006135360A (ja) | 2006-05-25 |
| DE19861386B4 (de) | 2014-10-30 |
| US20010000209A1 (en) | 2001-04-12 |
| US20010000410A1 (en) | 2001-04-26 |
| KR100753710B1 (ko) | 2007-08-30 |
| KR100745229B1 (ko) | 2007-10-16 |
| US6570190B2 (en) | 2003-05-27 |
| US6323063B2 (en) | 2001-11-27 |
| GB9811180D0 (en) | 1998-07-22 |
| KR20070042938A (ko) | 2007-04-24 |
| DE19807758B4 (de) | 2008-08-14 |
| GB2326023A (en) | 1998-12-09 |
| TW360984B (en) | 1999-06-11 |
| US6229160B1 (en) | 2001-05-08 |
| KR19990006588A (ko) | 1999-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10341035A (ja) | 半導体発光素子および半導体発光素子の製造方法 | |
| US7268371B2 (en) | Light extraction from a semiconductor light emitting device via chip shaping | |
| US7026659B2 (en) | Light emitting diodes including pedestals | |
| JP4230219B2 (ja) | 発光半導体チップおよびその製造方法 | |
| US7015054B2 (en) | Semiconductor light emitting device and method | |
| JP6150998B2 (ja) | 内部および外部光学要素による光取出しを向上させた発光ダイオード | |
| US7294862B2 (en) | Photonic crystal light emitting device | |
| US20050035355A1 (en) | Semiconductor light emitting diode and semiconductor light emitting device | |
| CN113851563B (zh) | 一种薄膜型半导体芯片结构及应用其的光电器件 | |
| KR20030026090A (ko) | 반도체 발광 칩 및 그의 제조방법과 반도체 발광소자 및그의 제조방법 | |
| US20220190222A1 (en) | Optoelectronic semiconductor device comprising a dielectric layer and a transparent conductive layer and method for manufacturing the optoelectronic semiconductor device | |
| JPS62137879A (ja) | 接合型半導体発光素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050802 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050808 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20051108 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20051111 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060208 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060227 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060623 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060809 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20060816 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20060915 |