JPH01245586A - フレキシブルプリント基板 - Google Patents

フレキシブルプリント基板

Info

Publication number
JPH01245586A
JPH01245586A JP63071818A JP7181888A JPH01245586A JP H01245586 A JPH01245586 A JP H01245586A JP 63071818 A JP63071818 A JP 63071818A JP 7181888 A JP7181888 A JP 7181888A JP H01245586 A JPH01245586 A JP H01245586A
Authority
JP
Japan
Prior art keywords
thermal expansion
resin layer
flexible printed
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63071818A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0522399B2 (enrdf_load_stackoverflow
Inventor
Takashi Watanabe
尚 渡辺
Haruhiko Aoi
晴彦 青井
Seiji Sato
誠治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP63071818A priority Critical patent/JPH01245586A/ja
Priority to US07/329,139 priority patent/US4937133A/en
Priority to DE68925490T priority patent/DE68925490T2/de
Priority to KR1019890003943A priority patent/KR930010058B1/ko
Priority to EP19890105469 priority patent/EP0335337B1/en
Publication of JPH01245586A publication Critical patent/JPH01245586A/ja
Publication of JPH0522399B2 publication Critical patent/JPH0522399B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP63071818A 1988-03-28 1988-03-28 フレキシブルプリント基板 Granted JPH01245586A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63071818A JPH01245586A (ja) 1988-03-28 1988-03-28 フレキシブルプリント基板
US07/329,139 US4937133A (en) 1988-03-28 1989-03-27 Flexible base materials for printed circuits
DE68925490T DE68925490T2 (de) 1988-03-28 1989-03-28 Flexible Grundmaterialen für Leiterplatten
KR1019890003943A KR930010058B1 (ko) 1988-03-28 1989-03-28 가요성 인쇄기판
EP19890105469 EP0335337B1 (en) 1988-03-28 1989-03-28 Flexible base materials for printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63071818A JPH01245586A (ja) 1988-03-28 1988-03-28 フレキシブルプリント基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7294465A Division JP2746555B2 (ja) 1995-11-13 1995-11-13 フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
JPH01245586A true JPH01245586A (ja) 1989-09-29
JPH0522399B2 JPH0522399B2 (enrdf_load_stackoverflow) 1993-03-29

Family

ID=13471515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63071818A Granted JPH01245586A (ja) 1988-03-28 1988-03-28 フレキシブルプリント基板

Country Status (1)

Country Link
JP (1) JPH01245586A (enrdf_load_stackoverflow)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02126974A (ja) * 1988-06-23 1990-05-15 Toray Ind Inc ポリイミド積層膜の製造方法
WO1992004811A1 (en) * 1990-09-04 1992-03-19 Chisso Corporation Flexible printed circuit board and its manufacturing
EP0499986A3 (enrdf_load_stackoverflow) * 1991-02-18 1995-03-08 Hitachi Ltd
JPH09148695A (ja) * 1995-11-24 1997-06-06 Mitsui Toatsu Chem Inc フレキシブルプリント回路基板及びその製造方法
WO1998008216A1 (fr) * 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication
JP2000096010A (ja) * 1998-09-22 2000-04-04 Toray Ind Inc 半導体装置用接着テープ
US6344308B1 (en) 1998-11-20 2002-02-05 Sony Chemicals Corp. Method of manufacturing a flexible circuit board
US6346298B1 (en) 1998-12-21 2002-02-12 Sony Chemicals Corp. Flexible board
JP2003080630A (ja) * 2001-09-11 2003-03-19 Mitsui Chemicals Inc ポリイミド金属箔積層体
US6658722B1 (en) 1998-12-28 2003-12-09 Sony Chemicals Corporation Process for producing magnetic head suspension
US6705007B1 (en) 1998-12-28 2004-03-16 Sony Chemicals Corp. Method for manufacturing double-sided flexible printed board
JP2005186274A (ja) * 2003-12-24 2005-07-14 Kaneka Corp フレキシブル積層板およびその製造方法
US6962726B2 (en) * 2000-06-16 2005-11-08 Unitika Ltd. Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board
JP2006051824A (ja) * 1999-10-21 2006-02-23 Nippon Steel Chem Co Ltd 積層体及びその製造方法
JP2006051800A (ja) * 2004-07-13 2006-02-23 Nippon Steel Chem Co Ltd フレキシブル積層板及びその製造方法
US7060784B2 (en) 2003-06-25 2006-06-13 Shin-Etsu Chemical Co., Ltd. Polyimide precursor resin solution composition sheet
JP2006272886A (ja) * 2005-03-30 2006-10-12 Tomoegawa Paper Co Ltd フレキシブル金属積層体およびフレキシブルプリント基板
JP2006272683A (ja) * 2005-03-29 2006-10-12 Tomoegawa Paper Co Ltd フレキシブル金属積層体およびフレキシブルプリント基板
JP2006306086A (ja) * 2005-03-31 2006-11-09 Nippon Steel Chem Co Ltd 多層積層体及びフレキシブル銅張積層基板
JP2008074084A (ja) * 2006-09-18 2008-04-03 Chang Chun Plastics Co Ltd ポリイミド複合フレキシブルシートおよびその製造方法
JP2008166554A (ja) * 2006-12-28 2008-07-17 Du Pont Toray Co Ltd フレキシブルプリント配線板
JP2009101706A (ja) * 1999-10-21 2009-05-14 Nippon Steel Chem Co Ltd ポリイミドフィルム及びその製造方法
JP2009528933A (ja) * 2006-03-06 2009-08-13 エルジー・ケム・リミテッド 金属積層板およびその製造方法
WO2009110387A1 (ja) * 2008-03-06 2009-09-11 新日鐵化学株式会社 フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
US7947332B2 (en) 2004-06-23 2011-05-24 Hitachi Chemical Company, Ltd. Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
JP2023009588A (ja) * 2021-07-07 2023-01-20 味の素株式会社 部品埋め込み基板の製造方法、液状樹脂組成物及びセット

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080056177A (ko) 2005-10-21 2008-06-20 니폰 가야꾸 가부시끼가이샤 열경화성 수지 조성물 및 그 용도
JPWO2007148666A1 (ja) * 2006-06-20 2009-11-19 日本化薬株式会社 プライマー樹脂層付銅箔及びそれを使用した積層板

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3179634A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
JPS5548473A (en) * 1978-10-02 1980-04-07 Messer Griesheim Gmbh Flame treating method of work and its device
JPS6119352A (ja) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー 可撓性多層ラミネート及びその製法
JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JPS62104840A (ja) * 1985-10-31 1987-05-15 Mitsui Toatsu Chem Inc フレキシブルプリント回路基板の製造法
JPS62140822A (ja) * 1985-12-17 1987-06-24 Ube Ind Ltd ポリイミド積層シ−トおよびその製造法
US4690999A (en) * 1983-08-01 1987-09-01 Hitachi, Ltd. Low thermal expansion resin material and composite shaped article
JPS6367145A (ja) * 1986-09-09 1988-03-25 三菱化学株式会社 積層ポリイミドフイルム
JPS6482928A (en) * 1987-09-25 1989-03-28 Mitsui Toatsu Chemicals Flexible laminated plate of metal and plastic
JPH01225540A (ja) * 1988-03-07 1989-09-08 Hitachi Ltd 新規な熱膨張係数分布型フイルム
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3179634A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
JPS5548473A (en) * 1978-10-02 1980-04-07 Messer Griesheim Gmbh Flame treating method of work and its device
US4690999A (en) * 1983-08-01 1987-09-01 Hitachi, Ltd. Low thermal expansion resin material and composite shaped article
JPS6119352A (ja) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー 可撓性多層ラミネート及びその製法
JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JPS62104840A (ja) * 1985-10-31 1987-05-15 Mitsui Toatsu Chem Inc フレキシブルプリント回路基板の製造法
JPS62140822A (ja) * 1985-12-17 1987-06-24 Ube Ind Ltd ポリイミド積層シ−トおよびその製造法
JPS6367145A (ja) * 1986-09-09 1988-03-25 三菱化学株式会社 積層ポリイミドフイルム
JPS6482928A (en) * 1987-09-25 1989-03-28 Mitsui Toatsu Chemicals Flexible laminated plate of metal and plastic
JPH01225540A (ja) * 1988-03-07 1989-09-08 Hitachi Ltd 新規な熱膨張係数分布型フイルム
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02126974A (ja) * 1988-06-23 1990-05-15 Toray Ind Inc ポリイミド積層膜の製造方法
WO1992004811A1 (en) * 1990-09-04 1992-03-19 Chisso Corporation Flexible printed circuit board and its manufacturing
EP0498898A4 (enrdf_load_stackoverflow) * 1990-09-04 1994-01-05 Chisso Corporation
EP0499986A3 (enrdf_load_stackoverflow) * 1991-02-18 1995-03-08 Hitachi Ltd
JPH09148695A (ja) * 1995-11-24 1997-06-06 Mitsui Toatsu Chem Inc フレキシブルプリント回路基板及びその製造方法
US6203918B1 (en) 1996-08-19 2001-03-20 Nippon Steel Chemical Co., Ltd. Laminate for HDD suspension and its manufacture
WO1998008216A1 (fr) * 1996-08-19 1998-02-26 Nippon Steel Chemical Co., Ltd. Stratifie pour suspension d'entrainement de disques durs et sa fabrication
JP2000096010A (ja) * 1998-09-22 2000-04-04 Toray Ind Inc 半導体装置用接着テープ
US6344308B1 (en) 1998-11-20 2002-02-05 Sony Chemicals Corp. Method of manufacturing a flexible circuit board
US6346298B1 (en) 1998-12-21 2002-02-12 Sony Chemicals Corp. Flexible board
US7213334B2 (en) 1998-12-28 2007-05-08 Sony Corporation Method for manufacturing double-sided flexible printed board
US6658722B1 (en) 1998-12-28 2003-12-09 Sony Chemicals Corporation Process for producing magnetic head suspension
US6705007B1 (en) 1998-12-28 2004-03-16 Sony Chemicals Corp. Method for manufacturing double-sided flexible printed board
JP2006051824A (ja) * 1999-10-21 2006-02-23 Nippon Steel Chem Co Ltd 積層体及びその製造方法
JP2009101706A (ja) * 1999-10-21 2009-05-14 Nippon Steel Chem Co Ltd ポリイミドフィルム及びその製造方法
US6962726B2 (en) * 2000-06-16 2005-11-08 Unitika Ltd. Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board
KR100820221B1 (ko) * 2000-06-16 2008-04-07 유니티카 가부시끼가이샤 플렉시블프린트 배선판용 기판의 제조방법 및플렉시블프린트 배선판용 기판
JP2003080630A (ja) * 2001-09-11 2003-03-19 Mitsui Chemicals Inc ポリイミド金属箔積層体
US7060784B2 (en) 2003-06-25 2006-06-13 Shin-Etsu Chemical Co., Ltd. Polyimide precursor resin solution composition sheet
JP2005186274A (ja) * 2003-12-24 2005-07-14 Kaneka Corp フレキシブル積層板およびその製造方法
US7947332B2 (en) 2004-06-23 2011-05-24 Hitachi Chemical Company, Ltd. Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
JP2006051800A (ja) * 2004-07-13 2006-02-23 Nippon Steel Chem Co Ltd フレキシブル積層板及びその製造方法
JP2006272683A (ja) * 2005-03-29 2006-10-12 Tomoegawa Paper Co Ltd フレキシブル金属積層体およびフレキシブルプリント基板
JP2006272886A (ja) * 2005-03-30 2006-10-12 Tomoegawa Paper Co Ltd フレキシブル金属積層体およびフレキシブルプリント基板
JP2006306086A (ja) * 2005-03-31 2006-11-09 Nippon Steel Chem Co Ltd 多層積層体及びフレキシブル銅張積層基板
JP2009528933A (ja) * 2006-03-06 2009-08-13 エルジー・ケム・リミテッド 金属積層板およびその製造方法
US8221842B2 (en) 2006-03-06 2012-07-17 Lg Chem, Ltd. Metallic laminate and method for preparing the same
US8426029B2 (en) 2006-03-06 2013-04-23 Lg Chem, Ltd. Metallic laminate and method for preparing the same
JP2008074084A (ja) * 2006-09-18 2008-04-03 Chang Chun Plastics Co Ltd ポリイミド複合フレキシブルシートおよびその製造方法
JP2008166554A (ja) * 2006-12-28 2008-07-17 Du Pont Toray Co Ltd フレキシブルプリント配線板
WO2009110387A1 (ja) * 2008-03-06 2009-09-11 新日鐵化学株式会社 フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
JP2023009588A (ja) * 2021-07-07 2023-01-20 味の素株式会社 部品埋め込み基板の製造方法、液状樹脂組成物及びセット

Also Published As

Publication number Publication date
JPH0522399B2 (enrdf_load_stackoverflow) 1993-03-29

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