JPS6482928A - Flexible laminated plate of metal and plastic - Google Patents

Flexible laminated plate of metal and plastic

Info

Publication number
JPS6482928A
JPS6482928A JP23887087A JP23887087A JPS6482928A JP S6482928 A JPS6482928 A JP S6482928A JP 23887087 A JP23887087 A JP 23887087A JP 23887087 A JP23887087 A JP 23887087A JP S6482928 A JPS6482928 A JP S6482928A
Authority
JP
Japan
Prior art keywords
plastic
thin film
metallic foil
plastic thin
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23887087A
Other languages
Japanese (ja)
Other versions
JP2621880B2 (en
Inventor
Takushi Sato
Moriji Morita
Hidesuke Yamanaka
Shunji Yoshida
Kenji Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP62238870A priority Critical patent/JP2621880B2/en
Publication of JPS6482928A publication Critical patent/JPS6482928A/en
Application granted granted Critical
Publication of JP2621880B2 publication Critical patent/JP2621880B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To improve flexibility and workability, by a method wherein the shrinkage factor of a plastic thin film as well as the content of solvent in plastic are made smaller than specified values when the whole of a metallic foil is removed while a bonding strength between the metallic foil and the plastic thin film is made larger than a specified value. CONSTITUTION:The shrinkage factor of a plastic thin film is made smaller than + or -0.3% by a method wherein compression and/or orientation plastic defor mation is caused in a FMCL having the plastic thin film, consisting of at least one layer directly formed on the metallic foil without employing any adhesive agent and having less than 0.2% of the content of solvent. A plastic film layer consisting of at least two layers, whose solvent content of the whole of the plastic thin film layer is smaller than 0.2%, average thermal linear expansion coefficient is larger than the same of the metal in the range of -1.0-+0.4X10<-5>/ deg.C, tensile elasticity modulus of the plastic contacting with the metallic foil in a room temperature is at least 100-400kg/mm<2> and 90 deg. peel bonding strength is 0.7kg/cm, is provided.
JP62238870A 1987-09-25 1987-09-25 Flexible metal plastic laminate Expired - Lifetime JP2621880B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62238870A JP2621880B2 (en) 1987-09-25 1987-09-25 Flexible metal plastic laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62238870A JP2621880B2 (en) 1987-09-25 1987-09-25 Flexible metal plastic laminate

Publications (2)

Publication Number Publication Date
JPS6482928A true JPS6482928A (en) 1989-03-28
JP2621880B2 JP2621880B2 (en) 1997-06-18

Family

ID=17036481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62238870A Expired - Lifetime JP2621880B2 (en) 1987-09-25 1987-09-25 Flexible metal plastic laminate

Country Status (1)

Country Link
JP (1) JP2621880B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245586A (en) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd Flexible printed board
JPH02180682A (en) * 1988-12-29 1990-07-13 Nippon Steel Chem Co Ltd Preparation of board for flexible printed wiring
US5300364A (en) * 1990-09-04 1994-04-05 Chisso Corporation Metal-clad laminates and method for producing same
JP2001105530A (en) * 1999-08-04 2001-04-17 Toyobo Co Ltd Flexible metal laminate and production method therefor
WO2006082887A2 (en) * 2005-02-04 2006-08-10 Zeon Corp Multilayer film, laminate using same, and method for producing laminate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108272A (en) * 1978-02-13 1979-08-24 Kanegafuchi Chemical Ind Flexible printed circuit board
JPS55160489A (en) * 1979-05-31 1980-12-13 Kanegafuchi Chemical Ind Flexible printed circuit board and method of fabricating same
JPS6044338A (en) * 1983-08-19 1985-03-09 株式会社日立製作所 Composite molding
JPS6119352A (en) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー Flexible multilayer laminate and manufacture thereof
JPS61111359A (en) * 1984-11-06 1986-05-29 Ube Ind Ltd Polyamic acid solution composition and polyimide film
JPS61157286A (en) * 1984-12-28 1986-07-16 Rohm Co Ltd Electronic governor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108272A (en) * 1978-02-13 1979-08-24 Kanegafuchi Chemical Ind Flexible printed circuit board
JPS55160489A (en) * 1979-05-31 1980-12-13 Kanegafuchi Chemical Ind Flexible printed circuit board and method of fabricating same
JPS6044338A (en) * 1983-08-19 1985-03-09 株式会社日立製作所 Composite molding
JPS6119352A (en) * 1984-06-30 1986-01-28 アクゾ・エヌ・ヴエー Flexible multilayer laminate and manufacture thereof
JPS61111359A (en) * 1984-11-06 1986-05-29 Ube Ind Ltd Polyamic acid solution composition and polyimide film
JPS61157286A (en) * 1984-12-28 1986-07-16 Rohm Co Ltd Electronic governor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245586A (en) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd Flexible printed board
JPH02180682A (en) * 1988-12-29 1990-07-13 Nippon Steel Chem Co Ltd Preparation of board for flexible printed wiring
US5300364A (en) * 1990-09-04 1994-04-05 Chisso Corporation Metal-clad laminates and method for producing same
JP2001105530A (en) * 1999-08-04 2001-04-17 Toyobo Co Ltd Flexible metal laminate and production method therefor
WO2006082887A2 (en) * 2005-02-04 2006-08-10 Zeon Corp Multilayer film, laminate using same, and method for producing laminate
WO2006082887A3 (en) * 2005-02-04 2007-01-18 Zeon Corp Multilayer film, laminate using same, and method for producing laminate
US7527857B2 (en) 2005-02-04 2009-05-05 Zeon Corporation Multilayer film, laminate using the same, and method for producing the laminate

Also Published As

Publication number Publication date
JP2621880B2 (en) 1997-06-18

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