JP7226306B2 - エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 - Google Patents
エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 Download PDFInfo
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- JP7226306B2 JP7226306B2 JP2019509928A JP2019509928A JP7226306B2 JP 7226306 B2 JP7226306 B2 JP 7226306B2 JP 2019509928 A JP2019509928 A JP 2019509928A JP 2019509928 A JP2019509928 A JP 2019509928A JP 7226306 B2 JP7226306 B2 JP 7226306B2
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- 150000004867 thiadiazoles Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- ITHPEWAHFNDNIO-UHFFFAOYSA-N triphosphane Chemical compound PPP ITHPEWAHFNDNIO-UHFFFAOYSA-N 0.000 description 1
- IDXDWPWXHTXJMZ-UHFFFAOYSA-N tris(2,4,6-trimethylphenyl)phosphane Chemical compound CC1=CC(C)=CC(C)=C1P(C=1C(=CC(C)=CC=1C)C)C1=C(C)C=C(C)C=C1C IDXDWPWXHTXJMZ-UHFFFAOYSA-N 0.000 description 1
- XDHRVAHAGMMFMC-UHFFFAOYSA-N tris(2,4-dimethylphenyl)phosphane Chemical compound CC1=CC(C)=CC=C1P(C=1C(=CC(C)=CC=1)C)C1=CC=C(C)C=C1C XDHRVAHAGMMFMC-UHFFFAOYSA-N 0.000 description 1
- RERMPCBBVZEPBS-UHFFFAOYSA-N tris(2,6-dimethylphenyl)phosphane Chemical compound CC1=CC=CC(C)=C1P(C=1C(=CC=CC=1C)C)C1=C(C)C=CC=C1C RERMPCBBVZEPBS-UHFFFAOYSA-N 0.000 description 1
- CKKFLUXMIUUGAW-UHFFFAOYSA-N tris(2-propan-2-ylphenyl)phosphane Chemical compound CC(C)C1=CC=CC=C1P(C=1C(=CC=CC=1)C(C)C)C1=CC=CC=C1C(C)C CKKFLUXMIUUGAW-UHFFFAOYSA-N 0.000 description 1
- GDKAFTKCUOBEDW-UHFFFAOYSA-N tris(2-tert-butylphenyl)phosphane Chemical compound CC(C)(C)C1=CC=CC=C1P(C=1C(=CC=CC=1)C(C)(C)C)C1=CC=CC=C1C(C)(C)C GDKAFTKCUOBEDW-UHFFFAOYSA-N 0.000 description 1
- RYXYUARTMQUYKV-UHFFFAOYSA-N tris(4-butylphenyl)phosphane Chemical compound C1=CC(CCCC)=CC=C1P(C=1C=CC(CCCC)=CC=1)C1=CC=C(CCCC)C=C1 RYXYUARTMQUYKV-UHFFFAOYSA-N 0.000 description 1
- SPNVODOGUAUMCA-UHFFFAOYSA-N tris(4-ethoxy-2,6-dimethylphenyl)phosphane Chemical compound CC1=CC(OCC)=CC(C)=C1P(C=1C(=CC(OCC)=CC=1C)C)C1=C(C)C=C(OCC)C=C1C SPNVODOGUAUMCA-UHFFFAOYSA-N 0.000 description 1
- LQEKTSMTEYLBLJ-UHFFFAOYSA-N tris(4-ethoxyphenyl)phosphane Chemical compound C1=CC(OCC)=CC=C1P(C=1C=CC(OCC)=CC=1)C1=CC=C(OCC)C=C1 LQEKTSMTEYLBLJ-UHFFFAOYSA-N 0.000 description 1
- PCCAGZSOGFNURV-UHFFFAOYSA-N tris(4-ethylphenyl)phosphane Chemical compound C1=CC(CC)=CC=C1P(C=1C=CC(CC)=CC=1)C1=CC=C(CC)C=C1 PCCAGZSOGFNURV-UHFFFAOYSA-N 0.000 description 1
- UYUUAUOYLFIRJG-UHFFFAOYSA-N tris(4-methoxyphenyl)phosphane Chemical compound C1=CC(OC)=CC=C1P(C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 UYUUAUOYLFIRJG-UHFFFAOYSA-N 0.000 description 1
- JTOQWGJGVSYTTN-UHFFFAOYSA-N tris(4-propylphenyl)phosphane Chemical compound C1=CC(CCC)=CC=C1P(C=1C=CC(CCC)=CC=1)C1=CC=C(CCC)C=C1 JTOQWGJGVSYTTN-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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| JP2022063612A JP7416116B2 (ja) | 2017-03-31 | 2022-04-06 | エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 |
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| JP2017072118 | 2017-03-31 | ||
| JP2017072119 | 2017-03-31 | ||
| JP2017072119 | 2017-03-31 | ||
| JP2017072118 | 2017-03-31 | ||
| PCT/JP2018/012551 WO2018181384A1 (ja) | 2017-03-31 | 2018-03-27 | エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 |
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| JPWO2018181384A1 JPWO2018181384A1 (ja) | 2020-02-06 |
| JP7226306B2 true JP7226306B2 (ja) | 2023-02-21 |
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| JP2019509928A Active JP7226306B2 (ja) | 2017-03-31 | 2018-03-27 | エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 |
| JP2022063612A Active JP7416116B2 (ja) | 2017-03-31 | 2022-04-06 | エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 |
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Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7226306B2 (zh) |
| MY (1) | MY198033A (zh) |
| SG (2) | SG11201908910VA (zh) |
| TW (2) | TWI801371B (zh) |
| WO (1) | WO2018181384A1 (zh) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6927151B2 (ja) * | 2018-05-29 | 2021-08-25 | 味の素株式会社 | 樹脂組成物 |
| KR20230102200A (ko) * | 2021-12-30 | 2023-07-07 | 솔루스첨단소재 주식회사 | 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재 |
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| JP2005132891A (ja) | 2003-10-28 | 2005-05-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2007320974A (ja) | 2006-05-30 | 2007-12-13 | Daicel Chem Ind Ltd | 光半導体封止用樹脂組成物 |
| WO2008050879A1 (fr) | 2006-10-24 | 2008-05-02 | Nippon Steel Chemical Co., Ltd. | Composition de resine epoxy et produit durci |
| WO2010047386A1 (ja) | 2008-10-24 | 2010-04-29 | チェイル インダストリーズ インコーポレイテッド | 接着剤組成物および光学部材 |
| JP2010132849A (ja) | 2008-11-05 | 2010-06-17 | Nagoya Institute Of Technology | エポキシ樹脂組成物および硬化物の製造方法 |
| JP2012144661A (ja) | 2011-01-13 | 2012-08-02 | Shin-Etsu Chemical Co Ltd | アンダーフィル材及び半導体装置 |
| JP2016149393A (ja) | 2015-02-10 | 2016-08-18 | 昭和電工株式会社 | 半導体用接着剤並びに半導体装置及びその製造方法 |
| JP2017203121A (ja) | 2016-05-12 | 2017-11-16 | 日本化薬株式会社 | 新規（メタ）アクリル化合物及びそれを用いた樹脂組成物 |
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| JPH02156657A (ja) * | 1988-12-09 | 1990-06-15 | Matsushita Electron Corp | 半導体封止用エポキシ樹脂組成物および樹脂封止半導体装置 |
| JPH06283343A (ja) * | 1993-03-25 | 1994-10-07 | Hitachi Ltd | フライバックトランスの製造方法 |
| JPH0725986A (ja) * | 1993-07-06 | 1995-01-27 | Mitsubishi Chem Corp | 繊維強化樹脂組成物 |
| JPH07122115A (ja) * | 1993-10-25 | 1995-05-12 | Hitachi Ltd | フライバックトランス |
| JP5330633B2 (ja) | 2005-04-28 | 2013-10-30 | 日立化成株式会社 | 樹脂組成物、及びそれを用いた光学部材とその製造方法 |
| JP4934085B2 (ja) | 2008-03-06 | 2012-05-16 | 電気化学工業株式会社 | エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体 |
| WO2010007859A1 (ja) | 2008-07-18 | 2010-01-21 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、硬化物の製造方法、光半導体封止材、及び光半導体装置 |
| SG10201706103VA (en) | 2012-07-26 | 2017-09-28 | Denki Kagaku Kogyo Kk | Resin composition |
| WO2014109212A1 (ja) * | 2013-01-09 | 2014-07-17 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
| JP6340762B2 (ja) | 2013-07-31 | 2018-06-13 | 日立化成株式会社 | アンダーフィル材を用いた電子部品装置の製造方法、アンダーフィル材、及び電子部品装置 |
| JP6405867B2 (ja) * | 2013-12-16 | 2018-10-17 | 日立化成株式会社 | 樹脂ペースト組成物及び半導体装置 |
| KR20160111377A (ko) * | 2014-01-23 | 2016-09-26 | 덴카 주식회사 | 수지 조성물 |
| JP6656792B2 (ja) | 2014-03-28 | 2020-03-04 | 日立化成株式会社 | 電子部品用液状樹脂組成物及び電子部品装置 |
| JP6857837B2 (ja) | 2015-04-15 | 2021-04-14 | パナソニックＩｐマネジメント株式会社 | 封止用熱硬化性樹脂組成物、半導体装置の製造方法及び半導体装置 |
| TWI695059B (zh) * | 2015-04-17 | 2020-06-01 | 日商積水化學工業股份有限公司 | 電子裝置用密封劑及電子裝置之製造方法 |
| JP6819067B2 (ja) | 2016-03-31 | 2021-01-27 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置 |
-
2018
- 2018-03-27 JP JP2019509928A patent/JP7226306B2/ja active Active
- 2018-03-27 MY MYPI2019005627A patent/MY198033A/en unknown
- 2018-03-27 SG SG11201908910V patent/SG11201908910VA/en unknown
- 2018-03-27 SG SG10202101445YA patent/SG10202101445YA/en unknown
- 2018-03-27 WO PCT/JP2018/012551 patent/WO2018181384A1/ja active Application Filing
- 2018-03-29 TW TW107110829A patent/TWI801371B/zh active
- 2018-03-29 TW TW111112606A patent/TWI824463B/zh active
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005132891A (ja) | 2003-10-28 | 2005-05-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2007320974A (ja) | 2006-05-30 | 2007-12-13 | Daicel Chem Ind Ltd | 光半導体封止用樹脂組成物 |
| WO2008050879A1 (fr) | 2006-10-24 | 2008-05-02 | Nippon Steel Chemical Co., Ltd. | Composition de resine epoxy et produit durci |
| WO2010047386A1 (ja) | 2008-10-24 | 2010-04-29 | チェイル インダストリーズ インコーポレイテッド | 接着剤組成物および光学部材 |
| JP2010132849A (ja) | 2008-11-05 | 2010-06-17 | Nagoya Institute Of Technology | エポキシ樹脂組成物および硬化物の製造方法 |
| JP2012144661A (ja) | 2011-01-13 | 2012-08-02 | Shin-Etsu Chemical Co Ltd | アンダーフィル材及び半導体装置 |
| JP2016149393A (ja) | 2015-02-10 | 2016-08-18 | 昭和電工株式会社 | 半導体用接着剤並びに半導体装置及びその製造方法 |
| JP2017203121A (ja) | 2016-05-12 | 2017-11-16 | 日本化薬株式会社 | 新規（メタ）アクリル化合物及びそれを用いた樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018181384A1 (ja) | 2020-02-06 |
| TW202229391A (zh) | 2022-08-01 |
| TW201839023A (zh) | 2018-11-01 |
| WO2018181384A1 (ja) | 2018-10-04 |
| MY198033A (en) | 2023-07-27 |
| TWI824463B (zh) | 2023-12-01 |
| TWI801371B (zh) | 2023-05-11 |
| SG10202101445YA (en) | 2021-03-30 |
| SG11201908910VA (en) | 2019-11-28 |
| JP7416116B2 (ja) | 2024-01-17 |
| JP2022101587A (ja) | 2022-07-06 |
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