WO2008050879A1 - Composition de resine epoxy et produit durci - Google Patents

Composition de resine epoxy et produit durci Download PDF

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Publication number
WO2008050879A1
WO2008050879A1 PCT/JP2007/070968 JP2007070968W WO2008050879A1 WO 2008050879 A1 WO2008050879 A1 WO 2008050879A1 JP 2007070968 W JP2007070968 W JP 2007070968W WO 2008050879 A1 WO2008050879 A1 WO 2008050879A1
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WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
weight
parts
materials
Prior art date
Application number
PCT/JP2007/070968
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English (en)
Japanese (ja)
Inventor
Hisashi Yamada
Hideyasu Asakage
Masashi Kaji
Original Assignee
Nippon Steel Chemical Co., Ltd.
Tohto Kasei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd., Tohto Kasei Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Priority to JP2008541044A priority Critical patent/JPWO2008050879A1/ja
Publication of WO2008050879A1 publication Critical patent/WO2008050879A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Definitions

  • the present invention is an epoxy resin composition which is excellent in fluidity at the time of molding and which gives a cured product excellent in heat resistance, moisture resistance, low thermal expansion, flame retardancy and low stress (low elasticity), and the like. It is about Background art
  • epoxy resin is widely used because it is liquid at normal temperature and excellent in workability, and it is easy to mix such as a curing agent and an additive. There are problems with heat resistance and moisture resistance.
  • phenol novolak epoxy resin is known as one that has improved heat resistance, but has problems with moisture resistance, impact resistance, and flame retardancy.
  • Patent Document 1 discloses a method for producing biphenyl glycidyl ether obtained from phenylphenol and epichlorohydrin, but there is no disclosure regarding application.
  • glycidyl etherate of o-phenylphenyl is liquid at normal temperature, and compared with the glycidyl etherate of crystalline p-phenylphenylphenol, the handling property in solid state of semiconductor sealing material etc. is required.
  • heat resistance resistance
  • Patent Documents 2, 4 and 5 disclose examples in which an alkyl-type epoxy resin having a biphenyl structure is applied to a semiconductor sealing material in order to improve the moisture resistance, low thermal expansion and the like.
  • Patent Document 3 discloses an example of using a halalchil epoxy resin having a naphthenic urethane structure.
  • the epoxy resins described in Patent Documents 2 to 5 are excellent in heat resistance, moisture resistance, low linear expansion and the like, they have insufficient performance in flowability at the time of molding.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 57-3,1679
  • Patent Document 2 Japanese Patent Application Laid-Open No. 11-140 166
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2004-59792
  • Patent Document 4 Japanese Patent Application Laid-Open No. 4117383
  • Patent Document 5 JP-A-2000-129092 Disclosure of the Invention:
  • the object of the present invention is to provide an epoxy resin composition which gives a cured product which is excellent in fluidity during molding and also excellent in heat resistance, moisture resistance, low thermal expansion, flame retardancy, low stress (low elasticity), etc. And to provide a cured product thereof. .
  • an epoxy resin composition containing an epoxy resin (A :), a curing agent for epoxy resin, and a modifier, an aromatic skeleton having a carbon number of C 0 to C 2 o as a modifier component And containing 2 to 50 parts by weight of monofunctional crystalline epoxy resin (B) having a melting point of 40 to 120 ° C. per 100 parts by weight of the epoxy resin (A) Epoxy resin composition.
  • the present invention also provides : A monofunctional crystalline epoxy resin (B) comprising : an aromatic skeleton having 0 to C 2 Q carbon atoms and having a melting point of 40 to 120 ° C. '(2) or (3)
  • R 2 is selected from a hydrogen atom and a hydrocarbon group having 1 to 4 carbon atoms, and all may be the same or different.
  • G represents a glycidyl group.
  • the epoxy resin composition as described above which is at least one selected from the group consisting of
  • the present invention is the epoxy resin composition as described above, wherein the content of the inorganic filler is 80 to 95% by weight in the whole, and an epoxy resin cured product obtained by curing the epoxy resin composition.
  • the epoxy resin composition of the present invention comprises an epoxy resin component, a curing agent component for an epoxy resin, and a modifier as essential components, and these essential components as main components.
  • the modifier component used in the present invention is a monofunctional crystalline epoxy resin (B) containing an aromatic skeleton of carbon number Q to C 2 D and having a melting point of 40 to 120 ° C.,
  • the content is preferably 2 to 5 parts by weight, more preferably 3 to 30 parts by weight, per 100 parts by weight of the epoxy resin (A). If it is more than 50 parts by weight, the heat resistance is lowered, and if it is less than 2 parts by weight, the flowability at the time of molding which is the object of the present invention is not sufficiently expressed.
  • the modifier component used in the present invention is preferably a crystalline monofunctional epoxy resin. In applications such as semiconductor encapsulation materials, powder mixing is carried out in the solid state, and then roll kneading etc.
  • the modifier component used in the present invention is most preferably a crystalline monofunctional epoxy resin.
  • the melting point of the monofunctional crystalline epoxy resin (B) is 40 to 120 ° C., preferably 50 to 100 ° C. If the melting point exceeds 120 ° C., the low viscosity can not be realized unless the molding processing temperature is high, which is disadvantageous in energy cost. Also, if the melting point is lower than 40 ° C., some crystals melt at room temperature, causing fusion and handling problems.
  • the melt viscosity of the above monofunctional crystalline epoxy resin (B) at 120 ° C. is 0.010 to 0.05 Pa's, preferably 0.001 to 0.03 Pa's. If the melt viscosity is lower than 0.001 P ⁇ s, crystallization tends to be difficult, which is industrially disadvantageous for production. On the other hand, if it is higher than 0.05 Pa ⁇ s, it will be disadvantageous in increasing the filling rate of the inorganic filler, and improvement in performance such as moisture resistance, low linear expansion and flame retardancy can not be expected.
  • Examples thereof include epoxy resins having a skeleton, a force rubazole skeleton, a dibenzofuran skeleton, a dibenzothiophen skeleton and the like.
  • the monofunctional crystalline epoxy resin (B) may be used alone or in combination of two or more.
  • these epoxy resins particularly from the viewpoints of handleability, flowability, heat resistance, low linear expansion and flame retardancy, biphenyl-type monoepoxy resin, naphthalene-type monoepoxy resin and force rubazoyl It is preferred to use a type monoepoxy resin.
  • the monofunctional crystalline epoxy resin (B) as described above can be synthesized by reacting a compound having a phenolic hydroxyl group with epichlorohydrin.
  • This anti The reaction can be carried out in the same manner as a conventional epoxidation reaction.
  • a monophenol compound is dissolved in excess epichlorohydrin, and then in the presence of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide at 50 to 150 ° C., preferably 60 to 50 ° C.
  • the reaction may be carried out at 120 ° C. for 1 to 10 hours.
  • the usage-amount of an alkali metal hydroxide is 0.8-2 mol with respect to 1 mol of hydroxyl groups of a monophenol compound, Preferably 0.9-1.2 mol.
  • excess epichlorohydrin is distilled off, and the residue is dissolved in a solvent such as toluene or methyl isopyl ketone, filtered, washed with water to remove inorganic salts, and then the solvent is distilled off.
  • the desired epoxy resin can be used.
  • quaternary ammonium salts etc. can be added during the reaction.
  • quaternary ammonium salts include tetramethyl ammonium chloride, tetrabutyl ammonium chloride, benzyl triethyl ammonium chloride and the like, and the addition amount thereof is 0.1 based on the monohydroxy compound. A weight of up to 2.0% is preferred. If the amount is less than this range, the effect of quaternary ammonium salt addition is small, and if it is more than this range, the formation of poorly hydrolyzable chlorine increases and it becomes difficult to achieve high purification. Furthermore, polar solvents such as dimethylsulfoxide and diglyme may be used, and the amount of addition thereof is preferably 10 to 20% by weight with respect to the aromatic nitrogen-based resin.
  • the monofunctional crystalline epoxy resin (B) thus obtained may contain a small amount of an impurity derived from the reaction raw material and an impurity derived from the reaction by-product, but 20% by weight or less of them. Preferably, it should be 10% by weight or less. Also, the monofunctional crystalline epoxy resin (B) may contain an oligomerized epoxy group in the resin as an ether bond.
  • Hydrolysable salt of epoxy resin and monofunctional crystalline epoxy resin (B) used in the present invention The amount is preferably small from the viewpoint of improving the reliability of the electronic component to be sealed. Although it does not specifically limit, 1 000 ppm or less is preferable, More preferably, it is 500 ppm or less.
  • the hydrolyzable chlorine referred to in the present invention means a value measured by the following method.
  • the epoxy resin (A) used in the present invention may be an epoxy resin known in the art, for example, bisphenol A, bisphenol F, bisphenol S, fluorenbisphenol, 2, 2, biphenyl, 3, Epoxides of divalent phenols such as 3,5,5,5-tetramethyl-4,4-dihydroxybiphenyl, resorcinol, naphthalene diols, etc., tris- (1-hydroxyphenyl) methane, 1,, Epoxides of trihydric or higher phenolic compounds such as 1, 2 and 2-tetrakis (4-hydroxyphenyl) ethane, pheno novolak, o-cresol novolak, and co-condensation of dicyclopentadiene and phenols Epoxides of resins, phenols and epoxy-based phenolic alkyl resins synthesized from paraxylylene chloride etc.
  • Epoxides of biphenylaralkyl-type phenyl resins which are synthesized from sulfides, phenols and 'bischloromethyl biphenyl, etc., and naphthalalalkyl resins which are synthesized from naphthols and paraxylylene dichloride, etc. And the like. These epoxy resins may be used alone or in combination of two or more.
  • More preferable epoxy resins (A) are crystalline epoxy resins obtained from 2, 2, 2-biphenyl, 3, 3, 5, 5, 5-tetramethyldi 4, 4, 4-dihydrobiphenol, etc., phenol novolac, o single cresol Solid epoxy resins which are solid at room temperature, such as epoxy resins obtained from polyfunctional resins such as epoxy resins, epoxy resins obtained from naftoallalkyl resins, and the like.
  • a curing agent for epoxy resin used in the epoxy resin composition of the present invention all compounds commonly used as curing agents for ordinary epoxy resins can be used.
  • Aliphatic amines such as triethylenetetramine, aromatic amines such as methaphenidiamine, aromatic amines such as diaminodiphenylmethane, diaminodiphenyl sulfone, phenol novolak resin, ortho cresol novolak resin, naphtho novolak resin, Aromatic hydrocarbon-formaldehyde resins such as pheno-l-ralkyl resins, and modified products thereof, acid anhydrides such as hydrofluoric anhydride, maleic anhydride, hexahydrin anhydride, pyromellitic anhydride, etc.
  • Examples include latent curing agents such as system curing agents, dicyandiamide, imidazole, BF 3 -amine complex, and guanidin derivatives.
  • Specific examples of phenol-based curing agents suitable for semiconductor sealing materials include bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4, 4′-biphenol Dihydric phenols such as 2, 2, 2-biphenylol, hydroquinone, resorcin, catechol, naphthalendiols, tris (4-hydroxyphenyl) methane, 1, 1, 2, 2-tetrakis (4 -Hydroxyl phenyl) ethane, phenyl novolac, o-cresol novolak, naphthol novolak, trivalent phenols represented by polyvinyl phenol and the like, and further phenols, naphthols or bisphenol A, bisphenol F, Bisphenol S, Fluorene Bisphenol, 4, 4, 1 Biphenol, 2, 2, Bi Di
  • the softening point range of the phenol-based curing agent is preferably 40 to 150 ° C., more preferably 50 to 120 ° C. If it is lower than 40 ° C., there is a problem of blocking during storage, and if it is higher than 150 ° C., there are problems in the kneadability and moldability at the time of preparation of the epoxy resin composition.
  • the melt viscosity at 150 ° C. is preferably 1 Pa ⁇ s or less, more preferably 0.5 P. a 's or less. If it is higher than 1 Pa ⁇ s, there are problems in the kneadability and moldability at the time of preparation of the epoxy resin composition.
  • the inorganic filler for example, silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon carbide, silicon nitride, boron nitride, zirconium, forsterite, steatite, spinel, mullite
  • fused silica as the main component, and examples of its form include broken or spherical ones.
  • silica is used in combination with one having several types of particle size distribution.
  • the range of the average particle size of the silica to be combined is preferably 0.5 to 100 ⁇ m.
  • the content of the inorganic filler is preferably 80 to 95% by weight, more preferably 83 to 90% by weight. If the amount is less than 80% by weight, the content of the organic component becomes high, and the moisture resistance and low linear expansion are not sufficiently vaporized. On the other hand, if it is more than 95% by weight, the fluidity of the molded product becomes difficult to exhibit.
  • an oligomer or a polymer compound such as polyester, polyamide, polyimide, polyester, polyurethane, petroleum resin, indencumarone resin, phenoxy resin, etc. is appropriately used. It can be blended, and additives such as pigments, flame retardants, soot modifiers, coupling agents, flow improvers, etc. can be blended.
  • the pigment include organic or inorganic extender pigments and scale-like pigments.
  • the wax-modified additive include silicone-based, castor oil-based, aliphatic amide wax, oxidized polyethylene wax, organic bentonite-based, and the like.
  • the resin composition of the present invention may be a mold release agent such as carnauba wax, P.sub.x, a lubricant such as aglycidoxyprovir trimethysilane, or a colorant such as carbon black.
  • a flame retardant such as antimony trioxide, a stress reducing agent such as silicone, a lubricant such as calcium stearate, etc. can be blended.
  • the cured product of the present invention can be obtained by curing the above epoxy resin composition by a molding method such as casting, compression molding, transfer molding and the like.
  • the temperature at which a cured product is produced is usually 120 ° C. to 220 ° C.
  • the epoxy resin composition of the present invention exhibits excellent flowability at the time of molding by using a monofunctional crystalline epoxy resin (B) excellent in low viscosity as a modifier. Furthermore, due to the polynuclear aromatic structure and monofunctionality of monofunctional crystalline epoxy resin (B), excellent heat resistance, moisture resistance, low thermal expansion, flame retardancy and low stress (low elasticity) Is demonstrated. In addition, since the elastic modulus is low without lowering the heat resistance of the cured product, the reduction of stress can be achieved, and a cured product excellent in stress resistance can be obtained.
  • the resin obtained had a melting point of 79 ° C. and a melt viscosity at 100 ° C. of 0.000 Pa ⁇ s , and an epoxy equivalent of 25 g / eq.
  • Synthesis example 2 Using 450 parts by weight of 2-naphthol, 1443 parts by weight of epichlorohydrin, and 6 parts by weight of diethylene glycol diglycol dimethyl ether, 200 parts by weight of a 48% aqueous solution of hydroxylated sodium hydroxide is added dropwise. Then, 575 parts by weight of a monofunctional crystalline epoxy resin was obtained (Modifier B). The melting point of the obtained resin was 61 ° C., 10 (the melt viscosity in TC was 0.005 P ⁇ , and the epoxy equivalent was 221 g / eq.
  • epoxy resin a 0-cresone novolac type epoxy resin (epoxy equivalent 200 g / e q., Softening point 65 ° C.)
  • epoxy resin b 3, 3 ', 5, 5, tetramethyl- Epoxide of 4,4 'dihydroxybiphenyl (epoxy equivalent weight 1 9 5 g / e q., Melting point 1 05 ° C, melt viscosity at 150 ° C 0. 0 1 1 P a ⁇ s)
  • epoxy resin c biphenylaralkyl type epoxy resin (epoxy equivalent 274 g / e q., softening point 57 ° (, melt viscosity at 150 ° C.
  • epoxy resin d 2
  • a 1-naphthallalkyl-type epoxy resin (ESN-1 75; epoxy equivalent 253 g / eq. Manufactured by Toto Kasei Co., Ltd .; softening point 69 ° C., melt viscosity at 150 ° C .: 0.15 Pa ⁇ s) was used.
  • phenoallardyl resin (PA; manufactured by Meiwa Kasei, MEH-78 00 SS; H equivalent 175, softening point 67 ° C.) was used.
  • spherical fused silica FB-60 manufactured by Denki Kagaku Kogyo Co., Ltd. (average particle size 2 l ⁇ m) and FB- 3 5 (average particle size 12 m), spherical fused silica SO-C 3 (average particle size 0.9 m) and SO- C 2 (average particle size) manufactured by Admatex Co., Ltd. I used .5 ⁇ m).
  • the spiral flow and gel time of the obtained epoxy resin composition were measured.
  • injection pressure 15 OKgf / cm 2
  • injection pressure 15 OKgf / cm 2
  • gel time pour the epoxy resin composition into the recess of the gelation tester (Nisshin Scientific Co., Ltd.), which has been preheated to 1 75 ° C, and use a Teflon rod for 2 seconds per second. Stirring was performed at a rotational speed, and the gelation time required for the epoxy resin composition to cure was examined.
  • these epoxy resin compositions were molded at 175 ° C. and subjected to boiling for 12 hours at 175 ° C. to obtain cured test pieces, which were then used for measurement of various physical properties.
  • the glass transition temperature was determined by a thermomechanical measurement device under the conditions of a temperature rise rate of 7 ° C./min.
  • the bending test was conducted by using three-point bending method for bending strength and bending elastic modulus.
  • the adhesive strength was determined by molding a 25 mm x 1 2.5 mm x 0.5 mm molded article between two sheets of 42 or 1 94 alloy sheets at 175 ° C using a compression molding machine, and post curing at 125 ° C for 12 hours. After that, it was evaluated by determining the tensile shear strength.
  • the water absorption rate is obtained by forming a disk 50 mm in diameter and 3 mm in thickness using this epoxy resin composition, and absorbing moisture for 100 hours under conditions of 85 ° C and 85% RH after post curing. Ru.
  • Tables 1 to 3 The results are summarized in Tables 1 to 3.
  • the epoxy resin composition of the present invention has good flowability at the time of moldability, and cures excellent in heat resistance, moisture resistance, low thermal expansion, flame retardancy, low stress (low elasticity), etc. I know that I give things. Industrial Applicability
  • the epoxy resin composition containing (B) a polycyclic aromatic structure and a monofunctional but containing an appropriate amount of this has a low elastic modulus without lowering the Tg of the cured product, which results in low stress and is a flow during moldability. It is excellent in heat resistance, moisture resistance, low thermal expansion, flame retardancy and low stress (low elasticity), etc. It is particularly suitable as a semiconductor encapsulation material. .

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de résine époxy contenant une résine époxy, un durcisseur pour résines époxy et un agent modificateur. Cette composition de résine époxy est caractérisée en ce qu'une résine époxy cristalline monofonctionnelle (B) contenant une structure aromatique en C10 à C20 et présentant un point de fusion compris allant de 40 à 120˚C est contenue en tant que composant d'agent modificateur dans une quantité comprise entre 2 et 50 parties en poids pour 100 parties en poids d'une résine époxy (A). Par conséquent, la composition de résine époxy présente d'excellentes propriétés de fluidité, de résistance à la chaleur, de résistance à l'humidité, de faible dilatation thermique, de résistance à la flamme et de faible contrainte (faible élasticité), et est par conséquent utile pour des matériaux d'enrobage semi-conducteurs, des matériaux de moulage, des matériaux laminés, des matériaux de revêtement en poudre et des matériaux adhésifs.
PCT/JP2007/070968 2006-10-24 2007-10-22 Composition de resine epoxy et produit durci WO2008050879A1 (fr)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054726A (ja) * 2009-09-01 2011-03-17 Kyocera Chemical Corp 電気二重層キャパシタ
WO2011088950A1 (fr) * 2009-12-24 2011-07-28 Henkel Ag & Co. Kgaa Composition de résine époxy et son application
JP2017155127A (ja) * 2016-03-01 2017-09-07 三菱ケミカル株式会社 硬化性エポキシ樹脂組成物、その硬化物及び電気・電子部品
WO2018181384A1 (fr) * 2017-03-31 2018-10-04 日立化成株式会社 Composition de résine époxy, composition de résine durcissable et dispositif à composants électroniques
WO2019142646A1 (fr) * 2018-01-16 2019-07-25 日立化成株式会社 Composition de résine durcissable, dispositif à semi-conducteur, et procédé de production de dispositif à semi-conducteur

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
JP5679248B1 (ja) * 2013-06-26 2015-03-04 Dic株式会社 エポキシ化合物、エポキシ樹脂、硬化性組成物、その硬化物、半導体封止材料、及びプリント配線基板
CN113461909B (zh) * 2021-07-21 2022-04-19 中国科学院兰州化学物理研究所 一种智能润滑材料及其制备方法和应用

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JPH10147631A (ja) * 1996-11-15 1998-06-02 Nippon Kayaku Co Ltd エポキシ化合物、エポキシ樹脂組成物及びその硬化物
JP2001055482A (ja) * 1999-08-17 2001-02-27 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2002294030A (ja) * 2001-03-29 2002-10-09 Toray Ind Inc 半導体封止用エポキシ樹脂組成物および半導体装置

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JPS59159819A (ja) * 1983-03-02 1984-09-10 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPS6183217A (ja) * 1984-09-29 1986-04-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH06145298A (ja) * 1992-11-09 1994-05-24 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び硬化物
JPH10147631A (ja) * 1996-11-15 1998-06-02 Nippon Kayaku Co Ltd エポキシ化合物、エポキシ樹脂組成物及びその硬化物
JP2001055482A (ja) * 1999-08-17 2001-02-27 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2002294030A (ja) * 2001-03-29 2002-10-09 Toray Ind Inc 半導体封止用エポキシ樹脂組成物および半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054726A (ja) * 2009-09-01 2011-03-17 Kyocera Chemical Corp 電気二重層キャパシタ
WO2011088950A1 (fr) * 2009-12-24 2011-07-28 Henkel Ag & Co. Kgaa Composition de résine époxy et son application
JP2017155127A (ja) * 2016-03-01 2017-09-07 三菱ケミカル株式会社 硬化性エポキシ樹脂組成物、その硬化物及び電気・電子部品
WO2018181384A1 (fr) * 2017-03-31 2018-10-04 日立化成株式会社 Composition de résine époxy, composition de résine durcissable et dispositif à composants électroniques
JPWO2018181384A1 (ja) * 2017-03-31 2020-02-06 日立化成株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置
JP7226306B2 (ja) 2017-03-31 2023-02-21 株式会社レゾナック エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置
WO2019142646A1 (fr) * 2018-01-16 2019-07-25 日立化成株式会社 Composition de résine durcissable, dispositif à semi-conducteur, et procédé de production de dispositif à semi-conducteur

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