MY198033A - Epoxy resin composition, curable resin composition and electronic component device - Google Patents

Epoxy resin composition, curable resin composition and electronic component device

Info

Publication number
MY198033A
MY198033A MYPI2019005627A MYPI2019005627A MY198033A MY 198033 A MY198033 A MY 198033A MY PI2019005627 A MYPI2019005627 A MY PI2019005627A MY PI2019005627 A MYPI2019005627 A MY PI2019005627A MY 198033 A MY198033 A MY 198033A
Authority
MY
Malaysia
Prior art keywords
resin composition
epoxy
electronic component
component device
curable resin
Prior art date
Application number
MYPI2019005627A
Other languages
English (en)
Inventor
Yoshinori Endo
Akemi Yamaguchi
Takahiro Nakada
Shinya Nakamura
Tsuyoshi Ohshita
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of MY198033A publication Critical patent/MY198033A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
MYPI2019005627A 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device MY198033A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017072118 2017-03-31
JP2017072119 2017-03-31
PCT/JP2018/012551 WO2018181384A1 (ja) 2017-03-31 2018-03-27 エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置

Publications (1)

Publication Number Publication Date
MY198033A true MY198033A (en) 2023-07-27

Family

ID=63676022

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019005627A MY198033A (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device

Country Status (5)

Country Link
JP (2) JP7226306B2 (zh)
MY (1) MY198033A (zh)
SG (2) SG11201908910VA (zh)
TW (2) TWI801371B (zh)
WO (1) WO2018181384A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927151B2 (ja) * 2018-05-29 2021-08-25 味の素株式会社 樹脂組成物
KR20230102200A (ko) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156657A (ja) * 1988-12-09 1990-06-15 Matsushita Electron Corp 半導体封止用エポキシ樹脂組成物および樹脂封止半導体装置
JPH06283343A (ja) * 1993-03-25 1994-10-07 Hitachi Ltd フライバックトランスの製造方法
JPH0725986A (ja) * 1993-07-06 1995-01-27 Mitsubishi Chem Corp 繊維強化樹脂組成物
JPH07122115A (ja) * 1993-10-25 1995-05-12 Hitachi Ltd フライバックトランス
JP2005132891A (ja) 2003-10-28 2005-05-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP5330633B2 (ja) 2005-04-28 2013-10-30 日立化成株式会社 樹脂組成物、及びそれを用いた光学部材とその製造方法
JP2007320974A (ja) 2006-05-30 2007-12-13 Daicel Chem Ind Ltd 光半導体封止用樹脂組成物
TW200823244A (en) * 2006-10-24 2008-06-01 Nippon Steel Chemical Co Epoxy resin composition and cured product
JP4934085B2 (ja) 2008-03-06 2012-05-16 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
WO2010007859A1 (ja) 2008-07-18 2010-01-21 Dic株式会社 エポキシ樹脂組成物、その硬化物、硬化物の製造方法、光半導体封止材、及び光半導体装置
EP2348081B1 (en) 2008-10-24 2017-03-01 Cheil Industries Inc. Adhesive composition and optical member
JP2010132849A (ja) 2008-11-05 2010-06-17 Nagoya Institute Of Technology エポキシ樹脂組成物および硬化物の製造方法
JP5354753B2 (ja) * 2011-01-13 2013-11-27 信越化学工業株式会社 アンダーフィル材及び半導体装置
SG10201706103VA (en) 2012-07-26 2017-09-28 Denki Kagaku Kogyo Kk Resin composition
WO2014109212A1 (ja) * 2013-01-09 2014-07-17 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP6340762B2 (ja) 2013-07-31 2018-06-13 日立化成株式会社 アンダーフィル材を用いた電子部品装置の製造方法、アンダーフィル材、及び電子部品装置
JP6405867B2 (ja) * 2013-12-16 2018-10-17 日立化成株式会社 樹脂ペースト組成物及び半導体装置
KR20160111377A (ko) * 2014-01-23 2016-09-26 덴카 주식회사 수지 조성물
JP6656792B2 (ja) 2014-03-28 2020-03-04 日立化成株式会社 電子部品用液状樹脂組成物及び電子部品装置
JP2016149393A (ja) 2015-02-10 2016-08-18 昭和電工株式会社 半導体用接着剤並びに半導体装置及びその製造方法
JP6857837B2 (ja) 2015-04-15 2021-04-14 パナソニックＩｐマネジメント株式会社 封止用熱硬化性樹脂組成物、半導体装置の製造方法及び半導体装置
TWI695059B (zh) * 2015-04-17 2020-06-01 日商積水化學工業股份有限公司 電子裝置用密封劑及電子裝置之製造方法
JP6819067B2 (ja) 2016-03-31 2021-01-27 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
JP6643949B2 (ja) 2016-05-12 2020-02-12 日本化薬株式会社 新規（メタ）アクリル化合物及びそれを用いた樹脂組成物

Also Published As

Publication number Publication date
JPWO2018181384A1 (ja) 2020-02-06
TW202229391A (zh) 2022-08-01
TW201839023A (zh) 2018-11-01
WO2018181384A1 (ja) 2018-10-04
TWI824463B (zh) 2023-12-01
TWI801371B (zh) 2023-05-11
SG10202101445YA (en) 2021-03-30
JP7226306B2 (ja) 2023-02-21
SG11201908910VA (en) 2019-11-28
JP7416116B2 (ja) 2024-01-17
JP2022101587A (ja) 2022-07-06

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