JP6788678B2 - リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法 - Google Patents

リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法 Download PDF

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Publication number
JP6788678B2
JP6788678B2 JP2018536098A JP2018536098A JP6788678B2 JP 6788678 B2 JP6788678 B2 JP 6788678B2 JP 2018536098 A JP2018536098 A JP 2018536098A JP 2018536098 A JP2018536098 A JP 2018536098A JP 6788678 B2 JP6788678 B2 JP 6788678B2
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Japan
Prior art keywords
gas flow
region
support table
substrate
gas
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JP2018536098A
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English (en)
Japanese (ja)
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JP2019505841A (ja
JP2019505841A5 (enExample
Inventor
ジェウニンク，アンドレ，ベルナルダス
マーテンズ，ロビー，フランシスカス，ヨセフス
ヴォス，ヨーゼフ，カレル，マリア デ
ヴォス，ヨーゼフ，カレル，マリア デ
ドルスト，リンゴ，ペトルス，コーネリス ヴァン
ドルスト，リンゴ，ペトルス，コーネリス ヴァン
ブリンケ，ゲルハルト，アルベルト テン
ブリンケ，ゲルハルト，アルベルト テン
センデン，ディルク，ジュローム，アンドレ
バルティス，コーエン，フーベルトゥス，マテウス
ゲリッツェン，ジャスティン，ヨハネス，ヘルマヌス
カミンガ，ジェルマー，マテウス
パシッティ，エブリン，ウォーリス
ポイスズ，トーマス
シャイベルリッチ，アリー，コーネリス
スホルテン，バート，ディルク
スフリューデル，アンドレ
ソエトウト，アブラハム，アレキサンダー
トロンプ，ジークフリート，アレキサンダー
デ ファイフェル，ユリ，ヨハネス，ガブリエル ヴァン
デ ファイフェル，ユリ，ヨハネス，ガブリエル ヴァン
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ASML Netherlands BV
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ASML Netherlands BV
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Publication of JP2019505841A5 publication Critical patent/JP2019505841A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2018536098A 2016-02-08 2016-12-22 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法 Active JP6788678B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP16154599 2016-02-08
EP16154599.1 2016-02-08
EP16172678.1 2016-06-02
EP16172678 2016-06-02
PCT/EP2016/082484 WO2017137129A1 (en) 2016-02-08 2016-12-22 Lithographic apparatus, method for unloading a substrate and method for loading a substrate

Related Child Applications (1)

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JP2020182045A Division JP2021043450A (ja) 2016-02-08 2020-10-30 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法

Publications (3)

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JP2019505841A JP2019505841A (ja) 2019-02-28
JP2019505841A5 JP2019505841A5 (enExample) 2019-09-12
JP6788678B2 true JP6788678B2 (ja) 2020-11-25

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JP2018536098A Active JP6788678B2 (ja) 2016-02-08 2016-12-22 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
JP2020182045A Pending JP2021043450A (ja) 2016-02-08 2020-10-30 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
JP2022147269A Pending JP2022177165A (ja) 2016-02-08 2022-09-15 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
JP2024203624A Pending JP2025041598A (ja) 2016-02-08 2024-11-22 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法

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JP2020182045A Pending JP2021043450A (ja) 2016-02-08 2020-10-30 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
JP2022147269A Pending JP2022177165A (ja) 2016-02-08 2022-09-15 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
JP2024203624A Pending JP2025041598A (ja) 2016-02-08 2024-11-22 リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法

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US (2) US11664264B2 (enExample)
JP (4) JP6788678B2 (enExample)
CN (2) CN113376974A (enExample)
NL (1) NL2018051A (enExample)
TW (1) TWI623824B (enExample)
WO (1) WO2017137129A1 (enExample)

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