NL2018051A - Lithographic apparatus, method for unloading a substrate and method for loading a substrate - Google Patents
Lithographic apparatus, method for unloading a substrate and method for loading a substrate Download PDFInfo
- Publication number
- NL2018051A NL2018051A NL2018051A NL2018051A NL2018051A NL 2018051 A NL2018051 A NL 2018051A NL 2018051 A NL2018051 A NL 2018051A NL 2018051 A NL2018051 A NL 2018051A NL 2018051 A NL2018051 A NL 2018051A
- Authority
- NL
- Netherlands
- Prior art keywords
- region
- substrate
- gas flow
- gas
- support table
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 307
- 238000000034 method Methods 0.000 title abstract description 73
- 230000005855 radiation Effects 0.000 claims description 36
- 238000000059 patterning Methods 0.000 claims description 24
- 238000001459 lithography Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 551
- 239000007788 liquid Substances 0.000 description 76
- 239000012530 fluid Substances 0.000 description 60
- 238000007654 immersion Methods 0.000 description 18
- 238000005286 illumination Methods 0.000 description 13
- 238000004891 communication Methods 0.000 description 12
- 238000011084 recovery Methods 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000003809 water extraction Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16154599 | 2016-02-08 | ||
| EP16172678 | 2016-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL2018051A true NL2018051A (en) | 2017-08-11 |
Family
ID=57609912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL2018051A NL2018051A (en) | 2016-02-08 | 2016-12-22 | Lithographic apparatus, method for unloading a substrate and method for loading a substrate |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11664264B2 (enExample) |
| JP (4) | JP6788678B2 (enExample) |
| CN (2) | CN108604066B (enExample) |
| NL (1) | NL2018051A (enExample) |
| TW (1) | TWI623824B (enExample) |
| WO (1) | WO2017137129A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10388548B2 (en) * | 2016-05-27 | 2019-08-20 | Texas Instruments Incorporated | Apparatus and method for operating machinery under uniformly distributed mechanical pressure |
| CN110741319B (zh) | 2017-06-06 | 2024-04-16 | Asml荷兰有限公司 | 从支撑台卸载物体的方法 |
| CN111406235B (zh) * | 2017-11-20 | 2025-01-21 | Asml荷兰有限公司 | 衬底保持器、衬底支撑件和将衬底夹持至夹持系统的方法 |
| CN108037638A (zh) * | 2017-12-12 | 2018-05-15 | 中国科学院光电技术研究所 | 基于柔性铰链结构的超分辨光刻方法和装置 |
| KR102580723B1 (ko) * | 2017-12-13 | 2023-09-21 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치에서 사용하기 위한 기판 홀더 |
| TWI892652B (zh) * | 2018-01-17 | 2025-08-01 | 日商東京威力科創股份有限公司 | 接合裝置及接合方法 |
| KR102041044B1 (ko) * | 2018-04-30 | 2019-11-05 | 피에스케이홀딩스 주식회사 | 기판 지지 유닛 |
| KR20240152963A (ko) * | 2019-01-23 | 2024-10-22 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치에 사용되는 기판 홀더 및 디바이스 제조 방법 |
| CN114270270A (zh) | 2019-08-20 | 2022-04-01 | Asml荷兰有限公司 | 衬底保持器、光刻设备和方法 |
| CN110571168A (zh) * | 2019-08-22 | 2019-12-13 | 长江存储科技有限责任公司 | 晶圆吸附盘、晶圆吸附系统以及晶圆键合设备 |
| DE102019128667B3 (de) * | 2019-10-23 | 2020-09-10 | Semikron Elektronik Gmbh & Co. Kg | Sinterpresse und Drucksinterverfahren zur Herstellung einer Sinterverbindung mittels der Sinterpresse |
| CN113075865B (zh) * | 2020-01-06 | 2022-11-08 | 夏泰鑫半导体(青岛)有限公司 | 一种用于处理半导体衬底的装置和方法 |
| CN116325113A (zh) | 2020-10-16 | 2023-06-23 | Asml荷兰有限公司 | 载物台、台式设备、保持方法和光刻设备 |
| WO2023241893A1 (en) * | 2022-06-15 | 2023-12-21 | Asml Netherlands B.V. | Substrate support and lithographic apparatus |
| WO2024008359A1 (en) * | 2022-07-07 | 2024-01-11 | Asml Netherlands B.V. | Substrate holding system and lithographic apparatus |
| JP2025524325A (ja) | 2022-07-11 | 2025-07-30 | エーエスエムエル ネザーランズ ビー．ブイ． | 基板ホルダ、リソグラフィ装置、コンピュータプログラム及び方法 |
| WO2024217800A1 (en) | 2023-04-20 | 2024-10-24 | Asml Netherlands B.V. | Method for evaluating the flatness of a substrate support |
| WO2024235535A1 (en) | 2023-05-12 | 2024-11-21 | Asml Netherlands B.V. | Substrate support |
| WO2025021372A1 (en) | 2023-07-25 | 2025-01-30 | Asml Netherlands B.V. | Substrate support |
| JP7762258B2 (ja) * | 2023-09-19 | 2025-10-29 | キヤノン株式会社 | 基板保持装置、基板処理装置、分離方法、および物品製造方法 |
| KR20250042075A (ko) | 2023-09-19 | 2025-03-26 | 캐논 가부시끼가이샤 | 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법 |
| JP2025043935A (ja) | 2023-09-19 | 2025-04-01 | キヤノン株式会社 | 情報処理装置、情報処理方法、およびプログラム |
| WO2025098681A1 (en) | 2023-11-07 | 2025-05-15 | Asml Netherlands B.V. | Substrate support, substrate support system and method to clamp a substrate on a substrate support |
| WO2025119563A2 (en) | 2023-12-05 | 2025-06-12 | Asml Netherlands B.V. | Method of substrate support repair |
| JP7773576B2 (ja) * | 2024-02-29 | 2025-11-19 | キヤノン株式会社 | 保持装置、基板処理装置及び物品の製造方法 |
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| CN103367217B (zh) | 2012-04-11 | 2016-08-24 | 上海微电子装备有限公司 | 一种硅片吸附装置及其吸附方法 |
| US9022392B2 (en) | 2012-08-31 | 2015-05-05 | United Microelectronics Corporation | Chuck and semiconductor process using the same |
| JP6001675B2 (ja) * | 2012-11-28 | 2016-10-05 | 京セラ株式会社 | 載置用部材およびその製造方法 |
| JP6108803B2 (ja) * | 2012-12-07 | 2017-04-05 | 日本特殊陶業株式会社 | 基板保持部材 |
| CN103904013B (zh) | 2012-12-28 | 2016-12-28 | 上海微电子装备有限公司 | 一种真空吸附装置及吸附测校方法 |
| JP2015018927A (ja) | 2013-07-10 | 2015-01-29 | 株式会社ニコン | 基板保持方法及び装置、並びに露光方法及び装置 |
| JP6376871B2 (ja) * | 2013-07-18 | 2018-08-22 | 株式会社ブイ・テクノロジー | 密着露光装置 |
| WO2015043638A1 (en) | 2013-09-26 | 2015-04-02 | Süss Microtec Lithography Gmbh | Chuck for suction and holding a wafer |
| JP6317825B2 (ja) * | 2014-04-30 | 2018-04-25 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置のためのサポートテーブル、リソグラフィ装置及びデバイス製造方法 |
| CN106255924B (zh) | 2014-05-06 | 2019-12-10 | Asml荷兰有限公司 | 衬底支座、用于在衬底支撑位置上加载衬底的方法、光刻设备和器件制造方法 |
| JP6650275B2 (ja) * | 2016-01-20 | 2020-02-19 | 日本特殊陶業株式会社 | 基板保持装置 |
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2016
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- 2016-12-22 NL NL2018051A patent/NL2018051A/en unknown
- 2016-12-22 JP JP2018536098A patent/JP6788678B2/ja active Active
- 2016-12-22 WO PCT/EP2016/082484 patent/WO2017137129A1/en not_active Ceased
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| CN108604066A (zh) | 2018-09-28 |
| JP2021043450A (ja) | 2021-03-18 |
| CN108604066B (zh) | 2021-06-29 |
| TWI623824B (zh) | 2018-05-11 |
| TW201740209A (zh) | 2017-11-16 |
| JP2025041598A (ja) | 2025-03-26 |
| WO2017137129A1 (en) | 2017-08-17 |
| CN113376974A (zh) | 2021-09-10 |
| US20190043749A1 (en) | 2019-02-07 |
| JP6788678B2 (ja) | 2020-11-25 |
| JP2019505841A (ja) | 2019-02-28 |
| US11664264B2 (en) | 2023-05-30 |
| JP2022177165A (ja) | 2022-11-30 |
| US20230260820A1 (en) | 2023-08-17 |
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