TWI623824B - 微影設備、卸載基板的方法及裝載基板的方法 - Google Patents

微影設備、卸載基板的方法及裝載基板的方法 Download PDF

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Publication number
TWI623824B
TWI623824B TW106100929A TW106100929A TWI623824B TW I623824 B TWI623824 B TW I623824B TW 106100929 A TW106100929 A TW 106100929A TW 106100929 A TW106100929 A TW 106100929A TW I623824 B TWI623824 B TW I623824B
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TW
Taiwan
Prior art keywords
region
gas
substrate
support table
airflow
Prior art date
Application number
TW106100929A
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English (en)
Chinese (zh)
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TW201740209A (zh
Inventor
安德烈 伯納德斯 裘寧克
羅比 法蘭西斯科斯 喬瑟夫司 馬汀斯
佛絲 葉瑟芙 卡倫 馬莉雅 丹
朵斯特 雷哥 彼德斯 康納利斯 凡
柏格 傑哈德 艾伯特 譚
德爾克 杰洛米 安德烈 珊登
寇音 修伯特 邁修斯 柏提斯
賈斯汀 裘漢斯 赫馬努斯 傑利森
吉而摩 馬修斯 卡敏加
伊芙琳 瓦莉斯 帕西提
湯瑪士 波伊茲
艾利 可尼利斯 西柏利奇
伯特 德克 史古登
安卓列 史卡德
雅伯罕 亞歷山卓 索薩德
塞弗烈德 亞歷山德 特洛普
迪 威弗 尤里 喬哈奈 賈瑞爾 凡
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Ａｓｍｌ荷蘭公司
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Publication of TW201740209A publication Critical patent/TW201740209A/zh
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Publication of TWI623824B publication Critical patent/TWI623824B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106100929A 2016-02-08 2017-01-12 微影設備、卸載基板的方法及裝載基板的方法 TWI623824B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP16154599 2016-02-08
??16154599.1 2016-02-08
??16172678.1 2016-06-02
EP16172678 2016-06-02

Publications (2)

Publication Number Publication Date
TW201740209A TW201740209A (zh) 2017-11-16
TWI623824B true TWI623824B (zh) 2018-05-11

Family

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Family Applications (1)

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TW106100929A TWI623824B (zh) 2016-02-08 2017-01-12 微影設備、卸載基板的方法及裝載基板的方法

Country Status (6)

Country Link
US (2) US11664264B2 (enExample)
JP (4) JP6788678B2 (enExample)
CN (2) CN113376974A (enExample)
NL (1) NL2018051A (enExample)
TW (1) TWI623824B (enExample)
WO (1) WO2017137129A1 (enExample)

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CN108037638A (zh) * 2017-12-12 2018-05-15 中国科学院光电技术研究所 基于柔性铰链结构的超分辨光刻方法和装置
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KR102041044B1 (ko) * 2018-04-30 2019-11-05 피에스케이홀딩스 주식회사 기판 지지 유닛
CN113348543A (zh) * 2019-01-23 2021-09-03 Asml荷兰有限公司 用于光刻设备中的衬底保持器和器件制造方法
CN114270270A (zh) 2019-08-20 2022-04-01 Asml荷兰有限公司 衬底保持器、光刻设备和方法
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JP2025521408A (ja) * 2022-07-07 2025-07-10 エーエスエムエル ネザーランズ ビー．ブイ． 基板保持システムおよびリソグラフィ装置
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WO2024235535A1 (en) 2023-05-12 2024-11-21 Asml Netherlands B.V. Substrate support
WO2025021372A1 (en) 2023-07-25 2025-01-30 Asml Netherlands B.V. Substrate support
JP2025043935A (ja) 2023-09-19 2025-04-01 キヤノン株式会社 情報処理装置、情報処理方法、およびプログラム
JP7762258B2 (ja) * 2023-09-19 2025-10-29 キヤノン株式会社 基板保持装置、基板処理装置、分離方法、および物品製造方法
KR20250042075A (ko) 2023-09-19 2025-03-26 캐논 가부시끼가이샤 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법
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US11187998B2 (en) 2017-11-20 2021-11-30 Asml Netherlands B.V. Substrate holder, substrate support and method of clamping a substrate to a clamping system
US12158704B2 (en) 2017-11-20 2024-12-03 Asml Netherlands B.V. Method of clamping a substrate to a clamping system, a substrate holder and a substrate support

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US20190043749A1 (en) 2019-02-07
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JP6788678B2 (ja) 2020-11-25
CN108604066A (zh) 2018-09-28
WO2017137129A1 (en) 2017-08-17
JP2025041598A (ja) 2025-03-26
CN108604066B (zh) 2021-06-29
JP2021043450A (ja) 2021-03-18
US11664264B2 (en) 2023-05-30
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TW201740209A (zh) 2017-11-16
NL2018051A (en) 2017-08-11

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