JP6557899B2 - 結晶性積層構造体、半導体装置 - Google Patents

結晶性積層構造体、半導体装置 Download PDF

Info

Publication number
JP6557899B2
JP6557899B2 JP2015095288A JP2015095288A JP6557899B2 JP 6557899 B2 JP6557899 B2 JP 6557899B2 JP 2015095288 A JP2015095288 A JP 2015095288A JP 2015095288 A JP2015095288 A JP 2015095288A JP 6557899 B2 JP6557899 B2 JP 6557899B2
Authority
JP
Japan
Prior art keywords
thin film
oxide semiconductor
semiconductor layer
type semiconductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015095288A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015228495A (ja
JP2015228495A5 (enExample
Inventor
俊実 人羅
俊実 人羅
真也 織田
真也 織田
章夫 高塚
章夫 高塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flosfia Inc
Original Assignee
Flosfia Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flosfia Inc filed Critical Flosfia Inc
Priority to JP2015095288A priority Critical patent/JP6557899B2/ja
Publication of JP2015228495A publication Critical patent/JP2015228495A/ja
Publication of JP2015228495A5 publication Critical patent/JP2015228495A5/ja
Priority to JP2019053236A priority patent/JP6893625B2/ja
Application granted granted Critical
Publication of JP6557899B2 publication Critical patent/JP6557899B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/86—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/202—FETs having static field-induced regions, e.g. static-induction transistors [SIT] or permeable base transistors [PBT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/63—Vertical IGFETs
    • H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/83—FETs having PN junction gate electrodes
    • H10D30/831—Vertical FETs having PN junction gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/343—Gate regions of field-effect devices having PN junction gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/01—Manufacture or treatment
    • H10D8/051—Manufacture or treatment of Schottky diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2921—Materials being crystalline insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3446—Transition metal elements; Rare earth elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
    • H10P14/3426—Oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Led Devices (AREA)
  • Thin Film Transistor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2015095288A 2014-05-08 2015-05-07 結晶性積層構造体、半導体装置 Active JP6557899B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015095288A JP6557899B2 (ja) 2014-05-08 2015-05-07 結晶性積層構造体、半導体装置
JP2019053236A JP6893625B2 (ja) 2014-05-08 2019-03-20 結晶性積層構造体、半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014097244 2014-05-08
JP2014097244 2014-05-08
JP2015095288A JP6557899B2 (ja) 2014-05-08 2015-05-07 結晶性積層構造体、半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019053236A Division JP6893625B2 (ja) 2014-05-08 2019-03-20 結晶性積層構造体、半導体装置

Publications (3)

Publication Number Publication Date
JP2015228495A JP2015228495A (ja) 2015-12-17
JP2015228495A5 JP2015228495A5 (enExample) 2018-06-14
JP6557899B2 true JP6557899B2 (ja) 2019-08-14

Family

ID=52146230

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015095288A Active JP6557899B2 (ja) 2014-05-08 2015-05-07 結晶性積層構造体、半導体装置
JP2019053236A Active JP6893625B2 (ja) 2014-05-08 2019-03-20 結晶性積層構造体、半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019053236A Active JP6893625B2 (ja) 2014-05-08 2019-03-20 結晶性積層構造体、半導体装置

Country Status (5)

Country Link
US (1) US9379190B2 (enExample)
EP (1) EP2942803B1 (enExample)
JP (2) JP6557899B2 (enExample)
CN (3) CN110047907B (enExample)
TW (1) TWI607511B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019142764A (ja) * 2014-05-08 2019-08-29 株式会社Flosfia 結晶性積層構造体、半導体装置
US11088242B2 (en) 2019-03-29 2021-08-10 Flosfia Inc. Crystal, crystalline oxide semiconductor, semiconductor film containing crystalline oxide semiconductor, semiconductor device including crystal and/or semiconductor film and system including semiconductor device

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110676303A (zh) * 2014-07-22 2020-01-10 株式会社Flosfia 结晶性半导体膜和板状体以及半导体装置
JP6916426B2 (ja) 2014-09-02 2021-08-11 株式会社Flosfia 積層構造体およびその製造方法、半導体装置ならびに結晶膜
CN107068773B (zh) * 2015-12-18 2021-06-01 株式会社Flosfia 半导体装置
JP6906217B2 (ja) * 2015-12-18 2021-07-21 株式会社Flosfia 半導体装置
JP2017128492A (ja) * 2016-01-15 2017-07-27 株式会社Flosfia 結晶性酸化物膜
US10158029B2 (en) * 2016-02-23 2018-12-18 Analog Devices, Inc. Apparatus and methods for robust overstress protection in compound semiconductor circuit applications
JP6705962B2 (ja) * 2016-06-03 2020-06-03 株式会社タムラ製作所 Ga2O3系結晶膜の成長方法及び結晶積層構造体
US10483110B2 (en) * 2016-07-26 2019-11-19 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing semiconductor device
JP6932904B2 (ja) * 2016-08-24 2021-09-08 株式会社Flosfia 半導体装置
US10804362B2 (en) 2016-08-31 2020-10-13 Flosfia Inc. Crystalline oxide semiconductor film, crystalline oxide semiconductor device, and crystalline oxide semiconductor system
US11152208B2 (en) 2016-09-15 2021-10-19 Flosfia Inc. Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of doping
US20180097073A1 (en) * 2016-10-03 2018-04-05 Flosfia Inc. Semiconductor device and semiconductor system including semiconductor device
JP2018067672A (ja) * 2016-10-21 2018-04-26 株式会社ブイ・テクノロジー 酸化物半導体装置及びその製造方法
KR102564830B1 (ko) * 2016-11-07 2023-08-07 가부시키가이샤 플로스피아 결정성 산화물 반도체막 및 반도체 장치
JP7116409B2 (ja) * 2017-02-27 2022-08-10 株式会社タムラ製作所 トレンチmos型ショットキーダイオード
JP6967238B2 (ja) * 2017-02-28 2021-11-17 株式会社タムラ製作所 ショットキーバリアダイオード
JP2019007048A (ja) * 2017-06-23 2019-01-17 トヨタ自動車株式会社 成膜装置
CN107293511B (zh) * 2017-07-05 2019-11-12 京东方科技集团股份有限公司 一种膜层退火设备及退火方法
CN107464844A (zh) * 2017-07-20 2017-12-12 中国电子科技集团公司第十三研究所 氧化镓场效应晶体管的制备方法
JP7166522B2 (ja) * 2017-08-21 2022-11-08 株式会社Flosfia 結晶膜の製造方法
JP7065440B2 (ja) * 2017-09-04 2022-05-12 株式会社Flosfia 半導体装置の製造方法および半導体装置
GB2569196B (en) * 2017-12-11 2022-04-20 Pragmatic Printing Ltd Schottky diode
GB2601276B (en) * 2017-12-11 2022-09-28 Pragmatic Printing Ltd Schottky diode
CN108493234A (zh) * 2018-05-10 2018-09-04 广东省半导体产业技术研究院 一种鳍式沟道的氧化镓基垂直场效应晶体管及其制备方法
WO2020013262A1 (ja) * 2018-07-12 2020-01-16 株式会社Flosfia 半導体装置および半導体装置を含む半導体システム
TW202006945A (zh) * 2018-07-12 2020-02-01 日商Flosfia股份有限公司 半導體裝置和半導體系統
TWI897850B (zh) * 2018-07-12 2025-09-21 日商Flosfia股份有限公司 半導體裝置和半導體系統
TWI879736B (zh) * 2018-07-12 2025-04-11 日商Flosfia股份有限公司 半導體裝置和半導體系統
JP2020011858A (ja) * 2018-07-17 2020-01-23 トヨタ自動車株式会社 成膜方法、及び、半導体装置の製造方法
JP2020011859A (ja) * 2018-07-17 2020-01-23 トヨタ自動車株式会社 成膜方法、及び、半導体装置の製造方法
KR102598375B1 (ko) * 2018-08-01 2023-11-06 이데미쓰 고산 가부시키가이샤 결정 구조 화합물, 산화물 소결체, 스퍼터링 타깃, 결정질 산화물 박막, 아모르퍼스 산화물 박막, 박막 트랜지스터, 및 전자 기기
JP6857641B2 (ja) 2018-12-19 2021-04-14 信越化学工業株式会社 成膜方法及び成膜装置
JP7315136B2 (ja) * 2018-12-26 2023-07-26 株式会社Flosfia 結晶性酸化物半導体
DE112019007009B4 (de) * 2019-03-13 2023-04-27 Mitsubishi Electric Corporation Halbleitereinheit
CN113646905A (zh) 2019-04-18 2021-11-12 株式会社半导体能源研究所 固态继电器以及半导体装置
JP7409790B2 (ja) * 2019-06-20 2024-01-09 信越化学工業株式会社 酸化物半導体膜及び半導体装置
CN114402437A (zh) * 2019-07-16 2022-04-26 株式会社Flosfia 层叠结构体和半导体装置
CN110571152A (zh) * 2019-08-14 2019-12-13 青岛佳恩半导体有限公司 一种igbt背面电极缓冲层的制备方法
WO2021039010A1 (ja) 2019-08-27 2021-03-04 信越化学工業株式会社 積層構造体及び積層構造体の製造方法
KR102849602B1 (ko) * 2019-09-30 2025-08-21 가부시키가이샤 플로스피아 적층 구조체 및 반도체 장치
CN110752159B (zh) * 2019-10-28 2023-08-29 中国科学技术大学 对氧化镓材料退火的方法
CN111106167A (zh) * 2019-11-27 2020-05-05 太原理工大学 一种择优取向的Ga2O3和SnO2混相膜基传感器的制备方法
KR102999306B1 (ko) * 2019-11-29 2026-07-31 가부시키가이샤 플로스피아 반도체 장치 및 반도체 시스템
WO2021106811A1 (ja) * 2019-11-29 2021-06-03 株式会社Flosfia 半導体装置および半導体システム
KR102812668B1 (ko) * 2020-01-10 2025-05-23 가부시키가이샤 플로스피아 도전성 금속 산화막, 반도체 소자 및 반도체 장치
JP7478334B2 (ja) * 2020-01-10 2024-05-07 株式会社Flosfia 半導体素子および半導体装置
TWI879858B (zh) * 2020-01-10 2025-04-11 日商Flosfia股份有限公司 半導體裝置及半導體系統
JP7530615B2 (ja) 2020-01-10 2024-08-08 株式会社Flosfia 結晶、半導体素子および半導体装置
CN115053355A (zh) * 2020-02-07 2022-09-13 株式会社Flosfia 半导体元件和半导体装置
KR20230029676A (ko) * 2020-06-29 2023-03-03 신에쓰 가가꾸 고교 가부시끼가이샤 성막용 도핑원료용액의 제조방법, 적층체의 제조방법, 성막용 도핑원료용액 및 반도체막
CN115836468A (zh) * 2020-07-10 2023-03-21 株式会社Flosfia 功率转换电路以及功率转换系统
US12247285B2 (en) * 2020-08-20 2025-03-11 Shin-Etsu Chemical Co., Ltd. Film-forming method and raw material solution
CN112103175A (zh) * 2020-08-28 2020-12-18 上海大学 n型氧化镓薄膜的掺杂工艺制备的钒掺杂n型氧化镓薄膜
JP7469201B2 (ja) * 2020-09-18 2024-04-16 株式会社デンソー 半導体装置とその製造方法
KR102394975B1 (ko) * 2020-10-22 2022-05-09 경북대학교 산학협력단 반도체 소자의 제조 방법 및 이에 의해 제조된 반도체 소자
TWI915548B (zh) * 2021-04-26 2026-02-21 日商Flosfia股份有限公司 半導體裝置、電力轉換裝置及控制系統
JP7572685B2 (ja) * 2021-07-07 2024-10-24 株式会社Tmeic エッチング方法
US12532530B2 (en) * 2021-09-09 2026-01-20 The Regents Of The University Of Michigan Doped aluminum-alloyed gallium oxide and ohmic contacts

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030019613A (ko) * 2000-07-28 2003-03-06 동경 엘렉트론 주식회사 성막방법
CN101558504A (zh) * 2006-10-17 2009-10-14 住友化学株式会社 热电转换材料、其制造方法、热电转换元件以及提高热电转换材料强度的方法
JP5142257B2 (ja) 2007-09-27 2013-02-13 独立行政法人産業技術総合研究所 不純物イオン注入層の電気的活性化方法
WO2010067525A1 (ja) * 2008-12-08 2010-06-17 住友化学株式会社 半導体装置、半導体装置の製造方法、半導体基板、および半導体基板の製造方法
KR101932576B1 (ko) * 2010-09-13 2018-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR101895398B1 (ko) * 2011-04-28 2018-10-25 삼성전자 주식회사 산화물 층의 형성 방법 및 이를 포함하는 반도체 소자의 제조 방법
KR101952570B1 (ko) * 2011-05-13 2019-02-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
JP6013685B2 (ja) * 2011-07-22 2016-10-25 株式会社半導体エネルギー研究所 半導体装置
JP5793732B2 (ja) 2011-07-27 2015-10-14 高知県公立大学法人 ドーパントを添加した結晶性の高い導電性α型酸化ガリウム薄膜およびその生成方法
JP5948581B2 (ja) 2011-09-08 2016-07-06 株式会社Flosfia Ga2O3系半導体素子
JP6142358B2 (ja) 2011-09-08 2017-06-07 株式会社タムラ製作所 Ga2O3系半導体素子
WO2013069729A1 (ja) * 2011-11-09 2013-05-16 株式会社タムラ製作所 半導体素子及びその製造方法
EP2862206A4 (en) * 2012-06-14 2015-12-30 Tivra Corp MULTILAYER SUBSTRATE STRUCTURE AND METHOD AND SYSTEM FOR PRODUCING THEREOF
JP5972065B2 (ja) * 2012-06-20 2016-08-17 富士フイルム株式会社 薄膜トランジスタの製造方法
JP5965338B2 (ja) * 2012-07-17 2016-08-03 出光興産株式会社 スパッタリングターゲット、酸化物半導体薄膜及びそれらの製造方法
SG11201505225TA (en) * 2012-08-03 2015-08-28 Semiconductor Energy Lab Oxide semiconductor stacked film and semiconductor device
JP5343224B1 (ja) 2012-09-28 2013-11-13 Roca株式会社 半導体装置および結晶
CN103117226B (zh) * 2013-02-04 2015-07-01 青岛大学 一种合金氧化物薄膜晶体管的制备方法
JP5397794B1 (ja) * 2013-06-04 2014-01-22 Roca株式会社 酸化物結晶薄膜の製造方法
JP5397795B1 (ja) * 2013-06-21 2014-01-22 Roca株式会社 半導体装置及びその製造方法、結晶及びその製造方法
EP2927934B1 (en) * 2014-03-31 2017-07-05 Flosfia Inc. Crystalline multilayer structure and semiconductor device
EP2942803B1 (en) * 2014-05-08 2019-08-21 Flosfia Inc. Crystalline multilayer structure and semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019142764A (ja) * 2014-05-08 2019-08-29 株式会社Flosfia 結晶性積層構造体、半導体装置
US11088242B2 (en) 2019-03-29 2021-08-10 Flosfia Inc. Crystal, crystalline oxide semiconductor, semiconductor film containing crystalline oxide semiconductor, semiconductor device including crystal and/or semiconductor film and system including semiconductor device

Also Published As

Publication number Publication date
US9379190B2 (en) 2016-06-28
JP2015228495A (ja) 2015-12-17
CN105097957A (zh) 2015-11-25
CN110047907A (zh) 2019-07-23
EP2942803B1 (en) 2019-08-21
CN110620145A (zh) 2019-12-27
TWI607511B (zh) 2017-12-01
EP2942803A1 (en) 2015-11-11
CN110620145B (zh) 2024-07-26
JP6893625B2 (ja) 2021-06-23
US20150325659A1 (en) 2015-11-12
CN110047907B (zh) 2024-03-15
TW201543581A (zh) 2015-11-16
JP2019142764A (ja) 2019-08-29

Similar Documents

Publication Publication Date Title
JP6893625B2 (ja) 結晶性積層構造体、半導体装置
JP6936982B2 (ja) 半導体装置
JP6349592B2 (ja) 半導体装置
JP6916426B2 (ja) 積層構造体およびその製造方法、半導体装置ならびに結晶膜
JP6627138B2 (ja) 半導体装置
JP6230196B2 (ja) 結晶性半導体膜および半導体装置
JP6478425B2 (ja) 結晶性半導体膜および半導体装置
JP2017010967A (ja) 成膜方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180424

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180424

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190320

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190618

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190625

R150 Certificate of patent or registration of utility model

Ref document number: 6557899

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250