JP6142813B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6142813B2 JP6142813B2 JP2014023867A JP2014023867A JP6142813B2 JP 6142813 B2 JP6142813 B2 JP 6142813B2 JP 2014023867 A JP2014023867 A JP 2014023867A JP 2014023867 A JP2014023867 A JP 2014023867A JP 6142813 B2 JP6142813 B2 JP 6142813B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- diode
- igbt
- sense
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
- H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/115—Dielectric isolations, e.g. air gaps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/141—Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
- H10D62/142—Anode regions of thyristors or collector regions of gated bipolar-mode devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014023867A JP6142813B2 (ja) | 2014-02-10 | 2014-02-10 | 半導体装置 |
| CN201480075282.XA CN106030797B (zh) | 2014-02-10 | 2014-09-08 | 半导体装置 |
| PCT/JP2014/073676 WO2015118714A1 (ja) | 2014-02-10 | 2014-09-08 | 半導体装置 |
| EP14882078.0A EP3107123B1 (en) | 2014-02-10 | 2014-09-08 | Semiconductor device |
| US15/104,073 US9972707B2 (en) | 2014-02-10 | 2014-09-08 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014023867A JP6142813B2 (ja) | 2014-02-10 | 2014-02-10 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015153785A JP2015153785A (ja) | 2015-08-24 |
| JP2015153785A5 JP2015153785A5 (enExample) | 2016-04-07 |
| JP6142813B2 true JP6142813B2 (ja) | 2017-06-07 |
Family
ID=53777534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014023867A Expired - Fee Related JP6142813B2 (ja) | 2014-02-10 | 2014-02-10 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9972707B2 (enExample) |
| EP (1) | EP3107123B1 (enExample) |
| JP (1) | JP6142813B2 (enExample) |
| CN (1) | CN106030797B (enExample) |
| WO (1) | WO2015118714A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017208735A1 (ja) * | 2016-06-03 | 2017-12-07 | 富士電機株式会社 | 半導体装置 |
| JP2018129358A (ja) | 2017-02-07 | 2018-08-16 | ルネサスエレクトロニクス株式会社 | 電流検出装置、負荷駆動システム、及び、電流検出装置の製造方法 |
| JP6804379B2 (ja) * | 2017-04-24 | 2020-12-23 | 三菱電機株式会社 | 半導体装置 |
| JP7151084B2 (ja) * | 2018-01-11 | 2022-10-12 | 株式会社デンソー | 半導体装置 |
| US12068312B2 (en) | 2019-03-22 | 2024-08-20 | Hitachi Energy Ltd | Reverse conducting insulated gate power semiconductor device having low conduction losses |
| JP7363079B2 (ja) * | 2019-04-15 | 2023-10-18 | 富士電機株式会社 | 半導体装置 |
| JP7224247B2 (ja) * | 2019-07-02 | 2023-02-17 | 三菱電機株式会社 | 半導体装置 |
| JP7332543B2 (ja) * | 2020-07-07 | 2023-08-23 | 三菱電機株式会社 | 半導体装置 |
| US12426287B2 (en) * | 2020-09-16 | 2025-09-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
| CN117242580A (zh) * | 2021-04-26 | 2023-12-15 | 三菱电机株式会社 | 半导体装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5241210A (en) * | 1987-02-26 | 1993-08-31 | Kabushiki Kaisha Toshiba | High breakdown voltage semiconductor device |
| JPH10261704A (ja) * | 1997-03-18 | 1998-09-29 | Toyota Motor Corp | 半導体装置及びその製造方法 |
| JP4761644B2 (ja) * | 2001-04-18 | 2011-08-31 | 三菱電機株式会社 | 半導体装置 |
| JP3739376B2 (ja) * | 2003-12-08 | 2006-01-25 | 株式会社ルネサステクノロジ | 半導体装置 |
| EP2003694B1 (en) * | 2007-06-14 | 2011-11-23 | Denso Corporation | Semiconductor device |
| DE102008045410B4 (de) | 2007-09-05 | 2019-07-11 | Denso Corporation | Halbleitervorrichtung mit IGBT mit eingebauter Diode und Halbleitervorrichtung mit DMOS mit eingebauter Diode |
| JP4506808B2 (ja) * | 2007-10-15 | 2010-07-21 | 株式会社デンソー | 半導体装置 |
| JP4877337B2 (ja) | 2009-02-17 | 2012-02-15 | トヨタ自動車株式会社 | 半導体装置 |
| JP2011082220A (ja) * | 2009-10-02 | 2011-04-21 | Toyota Motor Corp | 半導体装置 |
| JP5499692B2 (ja) * | 2009-12-24 | 2014-05-21 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
| CN102884625B (zh) | 2010-05-07 | 2014-11-19 | 丰田自动车株式会社 | 半导体装置 |
| JP5668499B2 (ja) | 2011-01-27 | 2015-02-12 | 株式会社デンソー | 半導体装置 |
| DE102011076610A1 (de) | 2010-06-04 | 2011-12-08 | Denso Corporation | Stromsensor, inverterschaltung und diese aufweisende halbleitervorrichtung |
| JP2013201237A (ja) | 2012-03-23 | 2013-10-03 | Toshiba Corp | 半導体装置 |
-
2014
- 2014-02-10 JP JP2014023867A patent/JP6142813B2/ja not_active Expired - Fee Related
- 2014-09-08 US US15/104,073 patent/US9972707B2/en active Active
- 2014-09-08 WO PCT/JP2014/073676 patent/WO2015118714A1/ja not_active Ceased
- 2014-09-08 CN CN201480075282.XA patent/CN106030797B/zh not_active Expired - Fee Related
- 2014-09-08 EP EP14882078.0A patent/EP3107123B1/en not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| EP3107123B1 (en) | 2018-11-28 |
| CN106030797A (zh) | 2016-10-12 |
| US20160372584A1 (en) | 2016-12-22 |
| US9972707B2 (en) | 2018-05-15 |
| EP3107123A4 (en) | 2017-02-22 |
| WO2015118714A1 (ja) | 2015-08-13 |
| JP2015153785A (ja) | 2015-08-24 |
| CN106030797B (zh) | 2019-03-12 |
| EP3107123A1 (en) | 2016-12-21 |
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| LAPS | Cancellation because of no payment of annual fees |