JP6115505B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP6115505B2
JP6115505B2 JP2014065942A JP2014065942A JP6115505B2 JP 6115505 B2 JP6115505 B2 JP 6115505B2 JP 2014065942 A JP2014065942 A JP 2014065942A JP 2014065942 A JP2014065942 A JP 2014065942A JP 6115505 B2 JP6115505 B2 JP 6115505B2
Authority
JP
Japan
Prior art keywords
substrate
mold resin
electronic device
mold
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014065942A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015026811A5 (https=
JP2015026811A (ja
Inventor
典久 今泉
典久 今泉
祐紀 眞田
祐紀 眞田
竹中　正幸
正幸 竹中
慎也 内堀
慎也 内堀
賢吾 岡
賢吾 岡
太助 福田
太助 福田
圭太郎 中間
圭太郎 中間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2014065942A priority Critical patent/JP6115505B2/ja
Priority to PCT/JP2014/002924 priority patent/WO2014203477A1/ja
Priority to US14/894,637 priority patent/US9941182B2/en
Publication of JP2015026811A publication Critical patent/JP2015026811A/ja
Publication of JP2015026811A5 publication Critical patent/JP2015026811A5/ja
Application granted granted Critical
Publication of JP6115505B2 publication Critical patent/JP6115505B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dicing (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
JP2014065942A 2013-06-21 2014-03-27 電子装置 Active JP6115505B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014065942A JP6115505B2 (ja) 2013-06-21 2014-03-27 電子装置
PCT/JP2014/002924 WO2014203477A1 (ja) 2013-06-21 2014-06-03 電子装置およびその製造方法
US14/894,637 US9941182B2 (en) 2013-06-21 2014-06-03 Electronic device and method for manufacturing same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013130304 2013-06-21
JP2013130304 2013-06-21
JP2014065942A JP6115505B2 (ja) 2013-06-21 2014-03-27 電子装置

Publications (3)

Publication Number Publication Date
JP2015026811A JP2015026811A (ja) 2015-02-05
JP2015026811A5 JP2015026811A5 (https=) 2015-10-15
JP6115505B2 true JP6115505B2 (ja) 2017-04-19

Family

ID=52104229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014065942A Active JP6115505B2 (ja) 2013-06-21 2014-03-27 電子装置

Country Status (3)

Country Link
US (1) US9941182B2 (https=)
JP (1) JP6115505B2 (https=)
WO (1) WO2014203477A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6194804B2 (ja) 2014-01-23 2017-09-13 株式会社デンソー モールドパッケージ
WO2018202615A1 (en) * 2017-05-02 2018-11-08 Abb Schweiz Ag Resin encapsulated power semiconductor module with exposed terminal areas
KR102825809B1 (ko) * 2020-07-10 2025-06-27 삼성전자주식회사 언더필이 구비된 반도체 패키지 및 이의 제조 방법

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01175240A (ja) 1987-12-28 1989-07-11 Sharp Corp 半導体チップの製造方法
US5834336A (en) * 1996-03-12 1998-11-10 Texas Instruments Incorporated Backside encapsulation of tape automated bonding device
JP3569386B2 (ja) 1996-05-27 2004-09-22 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法およびそれにより得られるモジュール基板ならびに電子機器
DE19640304C2 (de) * 1996-09-30 2000-10-12 Siemens Ag Chipmodul insbesondere zur Implantation in einen Chipkartenkörper
JP3859318B2 (ja) 1997-08-29 2006-12-20 シチズン電子株式会社 電子回路のパッケージ方法
JP2000040711A (ja) 1998-07-23 2000-02-08 Sony Corp 樹脂封止型半導体装置とその製造方法
JP2002110718A (ja) 2000-09-29 2002-04-12 Hitachi Ltd 半導体装置の製造方法
JP2002190565A (ja) 2000-12-20 2002-07-05 Taiyo Yuden Co Ltd ハイブリッドｉｃ及びその製造方法
JP3820991B2 (ja) * 2002-01-08 2006-09-13 日立電線株式会社 半導体装置及びその製造方法
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP4477976B2 (ja) * 2004-09-30 2010-06-09 株式会社ルネサステクノロジ 半導体装置の製造方法
WO2006129926A1 (en) 2005-06-02 2006-12-07 Tsp Co., Ltd. Mold for manufacturing semiconductor device and semiconductor device manufactred using the same
JP2007109831A (ja) 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
FR2893764B1 (fr) * 2005-11-21 2008-06-13 St Microelectronics Sa Boitier semi-conducteur empilable et procede pour sa fabrication
JP2007281207A (ja) 2006-04-07 2007-10-25 Renesas Technology Corp 半導体装置の製造方法
JP4836661B2 (ja) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び樹脂封止成形用金型
JP4376884B2 (ja) * 2006-09-20 2009-12-02 シャープ株式会社 半導体装置及び、半導体装置の製造方法
JP2008082768A (ja) 2006-09-26 2008-04-10 Kobe Steel Ltd 熱式流量センサ
TWI336502B (en) * 2006-09-27 2011-01-21 Advanced Semiconductor Eng Semiconductor package and semiconductor device and the method of making the same
JP4926869B2 (ja) 2007-07-26 2012-05-09 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5157456B2 (ja) * 2008-01-08 2013-03-06 富士通セミコンダクター株式会社 半導体装置及び半導体装置の製造方法
JP2009170476A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置および半導体装置の製造方法
DE102008052393B3 (de) 2008-10-21 2010-02-25 Continental Automotive Gmbh Massenstromsensorvorrichtung
JP2011077199A (ja) * 2009-09-29 2011-04-14 Sumitomo Bakelite Co Ltd 半導体パッケージおよび半導体装置
JP2012238725A (ja) 2011-05-12 2012-12-06 Toshiba Corp 半導体装置とその製造方法、およびそれを用いた半導体モジュール
JP5419230B2 (ja) * 2011-08-01 2014-02-19 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN102931105A (zh) * 2011-08-10 2013-02-13 飞思卡尔半导体公司 半导体器件管芯键合
JP5994613B2 (ja) * 2012-12-05 2016-09-21 株式会社デンソー 電子装置の取付構造体
CN106158778B (zh) * 2015-03-12 2020-07-17 恩智浦美国有限公司 具有侧面接触垫和底部接触垫的集成电路封装
US9443830B1 (en) * 2015-06-09 2016-09-13 Apple Inc. Printed circuits with embedded semiconductor dies

Also Published As

Publication number Publication date
US9941182B2 (en) 2018-04-10
WO2014203477A1 (ja) 2014-12-24
US20160104653A1 (en) 2016-04-14
JP2015026811A (ja) 2015-02-05

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