JP5846185B2 - 貫通電極基板及び貫通電極基板を用いた半導体装置 - Google Patents

貫通電極基板及び貫通電極基板を用いた半導体装置 Download PDF

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Publication number
JP5846185B2
JP5846185B2 JP2013241392A JP2013241392A JP5846185B2 JP 5846185 B2 JP5846185 B2 JP 5846185B2 JP 2013241392 A JP2013241392 A JP 2013241392A JP 2013241392 A JP2013241392 A JP 2013241392A JP 5846185 B2 JP5846185 B2 JP 5846185B2
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JP
Japan
Prior art keywords
opening
hole
electrode substrate
filler
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013241392A
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English (en)
Japanese (ja)
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JP2015103586A5 (enExample
JP2015103586A (ja
Inventor
倉持　悟
悟 倉持
小岩　進雄
進雄 小岩
英範 吉岡
英範 吉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013241392A priority Critical patent/JP5846185B2/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to CN201811131924.XA priority patent/CN109616458B/zh
Priority to EP20163801.2A priority patent/EP3690933B1/en
Priority to CN201480061865.7A priority patent/CN105765712B/zh
Priority to CN201811135601.8A priority patent/CN109616459A/zh
Priority to EP22185677.6A priority patent/EP4095895A3/en
Priority to PCT/JP2014/080649 priority patent/WO2015076301A1/ja
Priority to EP14864041.0A priority patent/EP3073523B1/en
Publication of JP2015103586A publication Critical patent/JP2015103586A/ja
Publication of JP2015103586A5 publication Critical patent/JP2015103586A5/ja
Application granted granted Critical
Publication of JP5846185B2 publication Critical patent/JP5846185B2/ja
Priority to US15/159,323 priority patent/US10256176B2/en
Priority to US16/266,203 priority patent/US10580727B2/en
Priority to US16/743,145 priority patent/US10790221B2/en
Priority to US16/936,519 priority patent/US11362028B2/en
Priority to US17/725,627 priority patent/US12080637B2/en
Priority to US18/800,278 priority patent/US20240404934A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H10W20/0261—
    • H10W20/20—
    • H10W20/2125—
    • H10W70/69—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H10W70/68—
    • H10W70/692—
    • H10W72/07236—
    • H10W72/07337—
    • H10W72/252—
    • H10W72/29—
    • H10W72/354—
    • H10W72/59—
    • H10W72/879—
    • H10W90/22—
    • H10W90/722—
    • H10W90/724—
    • H10W90/725—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Photovoltaic Devices (AREA)
JP2013241392A 2013-11-21 2013-11-21 貫通電極基板及び貫通電極基板を用いた半導体装置 Active JP5846185B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2013241392A JP5846185B2 (ja) 2013-11-21 2013-11-21 貫通電極基板及び貫通電極基板を用いた半導体装置
EP20163801.2A EP3690933B1 (en) 2013-11-21 2014-11-19 Through electrode substrate
CN201480061865.7A CN105765712B (zh) 2013-11-21 2014-11-19 贯通电极基板及利用贯通电极基板的半导体装置
CN201811135601.8A CN109616459A (zh) 2013-11-21 2014-11-19 贯通电极基板及利用贯通电极基板的半导体装置
CN201811131924.XA CN109616458B (zh) 2013-11-21 2014-11-19 贯通电极基板及利用贯通电极基板的半导体装置
EP22185677.6A EP4095895A3 (en) 2013-11-21 2014-11-19 Through electrode substrate and semiconductor device using through electrode substrate
PCT/JP2014/080649 WO2015076301A1 (ja) 2013-11-21 2014-11-19 貫通電極基板及び貫通電極基板を用いた半導体装置
EP14864041.0A EP3073523B1 (en) 2013-11-21 2014-11-19 Through electrode substrate and semiconductor device using through electrode substrate
US15/159,323 US10256176B2 (en) 2013-11-21 2016-05-19 Through-hole electrode substrate and semiconductor device using through-hole electrode substrate
US16/266,203 US10580727B2 (en) 2013-11-21 2019-02-04 Through-hole electrode substrate
US16/743,145 US10790221B2 (en) 2013-11-21 2020-01-15 Through-hole electrode substrate
US16/936,519 US11362028B2 (en) 2013-11-21 2020-07-23 Through-hole electrode substrate
US17/725,627 US12080637B2 (en) 2013-11-21 2022-04-21 Through-hole electrode substrate
US18/800,278 US20240404934A1 (en) 2013-11-21 2024-08-12 Through-hole electrode substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013241392A JP5846185B2 (ja) 2013-11-21 2013-11-21 貫通電極基板及び貫通電極基板を用いた半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015227286A Division JP6044697B2 (ja) 2015-11-20 2015-11-20 貫通電極基板及び貫通電極基板を用いた半導体装置

Publications (3)

Publication Number Publication Date
JP2015103586A JP2015103586A (ja) 2015-06-04
JP2015103586A5 JP2015103586A5 (enExample) 2015-08-20
JP5846185B2 true JP5846185B2 (ja) 2016-01-20

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JP2013241392A Active JP5846185B2 (ja) 2013-11-21 2013-11-21 貫通電極基板及び貫通電極基板を用いた半導体装置

Country Status (5)

Country Link
US (6) US10256176B2 (enExample)
EP (3) EP4095895A3 (enExample)
JP (1) JP5846185B2 (enExample)
CN (3) CN109616458B (enExample)
WO (1) WO2015076301A1 (enExample)

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JP5846185B2 (ja) * 2013-11-21 2016-01-20 大日本印刷株式会社 貫通電極基板及び貫通電極基板を用いた半導体装置
CN107027238B (zh) * 2016-01-29 2020-08-18 奥特斯(中国)有限公司 包括铜填充多径激光钻孔的元件载体
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