JP5777302B2 - セラミック電子部品の製造方法、セラミック電子部品及び配線基板 - Google Patents
セラミック電子部品の製造方法、セラミック電子部品及び配線基板 Download PDFInfo
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- JP5777302B2 JP5777302B2 JP2010164112A JP2010164112A JP5777302B2 JP 5777302 B2 JP5777302 B2 JP 5777302B2 JP 2010164112 A JP2010164112 A JP 2010164112A JP 2010164112 A JP2010164112 A JP 2010164112A JP 5777302 B2 JP5777302 B2 JP 5777302B2
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- 239000000919 ceramic Substances 0.000 title claims description 139
- 238000000034 method Methods 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000003985 ceramic capacitor Substances 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 13
- 230000003746 surface roughness Effects 0.000 claims description 13
- 238000006116 polymerization reaction Methods 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 58
- 229910010293 ceramic material Inorganic materials 0.000 description 20
- 239000000758 substrate Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000002585 base Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000011162 core material Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- -1 rare earth compounds Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49002—Electrical device making
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- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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Description
以下、本発明の好ましい実施形態について、図1に示すセラミック電子部品1を例に挙げて説明する。但し、セラミック電子部品1は、単なる例示である。本発明は、以下に示すセラミック電子部品1及びその製造方法に何ら限定されない。
図17は、第2の実施形態に係るセラミック電子部品の略図的断面図である。
下記の表1に示すようにバインダーの重合度を種々異ならせて、上記第1の実施形態のセラミック電子部品1と同様の構成を有する、セラミックコンデンサとしてのセラミック電子部品を、上記第1の実施形態に記載の製造方法で10000個ずつ作製し、配線基板に実装した。そして、実装に際して、マウント機の吸着ヘッドに吸着されなかったものの数量(吸着不良数量)をカウントした。また、マウント時に割れや欠けが発生したものの数量(割れ欠け数量)をカウントした。結果を下記の表1に示す。
セラミック層の厚み(焼成後):4μm
バインダー:ポリビニルブチラール
セラミック材料:BaTiO3
内部電極の数量:23枚
設計容量:100pF
セラミック電子部品の寸法:長さ1mm、幅0.5mm、厚み0.14mm
第2の導電層:Cuめっき層2層の積層体(全体厚:7.5μm)
焼成最高温度:1200℃
焼成最高温度でのキープ時間:2時間
第2の導電性ペースト層形成後のマザー積層体のプレス圧:77.2MPa
コア材の厚み:0.15mm
ベース基板の厚み:25μm
ビアホールの長さ:25μm
ビアホール形成時に照射したレーザー光:CO2レーザー
レーザー光の照射条件:2mjで16μ秒間照射
実験例6〜10では、実験例3と同様の条件で、下記の表2に示すように、第2の導電性ペースト層形成後のマザー積層体のプレス圧を種々異ならせてセラミックコンデンサとしてのセラミック電子部品を各30個作製した。作製した各30個のセラミック電子部品のそれぞれについて、第1の外部電極の第1の部分の形状をレーザー変位計を用いて測定し、表面粗さ(Ra)を計測した。結果を下記の表2に示す。
10…セラミック素体
10A…有効部
10a…第1の主面
10b…第2の主面
10c…第1の側面
10d…第2の側面
10e…第1の端面
10f…第2の端面
10g…セラミック層
11…第1の内部電極
12…第2の内部電極
13…第1の外部電極
13a…第1の部分
13b…第2の部分
13c…第3の部分
14…第2の外部電極
14a…第1の部分
14b…第2の部分
14c…第3の部分
15…第1の導電層
16…第2の導電層
20…セラミックグリーンシート
21…第1の導電性ペースト層
22…マザー積層体
23…第2の導電性ペースト層
24a、24b…弾性体
25a、25b…ビアホール電極
30…ベース基板
31…接着剤
32…接着剤
33…コア材
34…シート
35…配線基板本体
36…Cu層
37…配線基板
39…ビアホール
40…レーザー光
Claims (6)
- 長さ方向及び幅方向に沿って延びており、互いに対向する第1及び第2の主面と、長さ方向及び厚み方向に沿って延びており、互いに対向する第1及び第2の側面と、幅方向及び厚み方向に沿って延びており、互いに対向する第1及び第2の端面とを有し、長さ寸法をL、幅寸法をW、厚み寸法をTとしたときに、T<W<L、1/5W≦T≦1/2W、T≦0.3mmを満たす直方体状のセラミック素体と、
前記セラミック素体の内部において、少なくとも一部同士が厚み方向に対向するように形成されている第1及び第2の内部電極と、
前記第1の主面上の長さ方向の一方側端部に形成されており、前記第1の内部電極に電気的に接続されている第1の外部電極と、
前記第1の主面上の長さ方向の他方側端部に形成されており、前記第2の内部電極に電気的に接続されている第2の外部電極と、
を備えるセラミックコンデンサの製造方法であって、
重合度が1000〜1500である有機バインダーを含むセラミックグリーンシートを用意する工程と、
前記セラミックグリーンシートの表面に、導電性ペーストを塗布することにより、前記第1または第2の内部電極形成用の第1の導電性ペースト層を形成する工程と、
前記セラミックグリーンシートを積層することにより、内部に前記第1の導電性ペースト層が形成されている生のセラミック積層体を形成する工程と、
前記生のセラミック積層体の表面に、導電性ペーストを塗布することにより前記第1及び第2の外部電極形成用の第2の導電性ペースト層を形成する工程と、
前記第2の導電性ペースト層が形成された前記生のセラミック積層体を焼成する工程と、
前記第2の導電性ペースト層が形成された前記生のセラミック積層体を、前記焼成の前にプレスするプレス工程と、
を備え、
前記プレス工程において、厚みが0.05〜0.15mmの弾性体を介して、前記生のセラミック積層体を厚み方向にプレスする、セラミックコンデンサの製造方法。 - 前記焼成された第2の導電性ペースト層の上に、Cuめっきを施す工程をさらに備える、請求項1に記載のセラミックコンデンサの製造方法。
- 前記有機バインダーとして、重合度が1000〜1500のポリビニルブチラールを用いる、請求項1または2に記載のセラミックコンデンサの製造方法。
- 長さ方向及び幅方向に沿って延びており、互いに対向する第1及び第2の主面と、長さ方向及び厚み方向に沿って延びており、互いに対向する第1及び第2の側面と、幅方向及び厚み方向に沿って延びており、互いに対向する第1及び第2の端面とを有し、長さ寸法をL、幅寸法をW、厚み寸法をTとしたときに、T<W<L、1/5W≦T≦1/2W、T≦0.3mmを満たす直方体状のセラミック素体と、
前記セラミック素体の内部において、少なくとも一部同士が厚み方向に対向するように形成されている第1及び第2の内部電極と、
前記第1の主面上の長さ方向の一方側端部に形成されており、前記第1の内部電極に電気的に接続されている第1の外部電極と、
前記第1の主面上の長さ方向の他方側端部に形成されており、前記第2の内部電極に電気的に接続されている第2の外部電極と、
を備えるセラミックコンデンサであって、
前記第1の主面の前記第1の外部電極の長さ方向の一方側の端部が位置している部分と、前記第1の主面の前記第2の外部電極の長さ方向の他方側の端部が位置している部分とを通過する平面と、前記第1の主面のうちの前記平面と最も離れた部分との間の距離が4.9μm以下であり、かつ0μmよりも大きく、
前記第1及び第2の外部電極のそれぞれの表面の表面粗さ(Ra)が1.55μm以下である、セラミックコンデンサ。 - 請求項4に記載のセラミックコンデンサと、
前記セラミックコンデンサが埋め込まれている配線基板本体と、
を備える、配線基板。 - 前記配線基板本体には、前記セラミックコンデンサの前記第1,第2の外部電極に向かって開口する貫通孔が形成されている、請求項5に記載の配線基板。
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