JP5596901B2 - 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 - Google Patents

反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 Download PDF

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Publication number
JP5596901B2
JP5596901B2 JP2007515655A JP2007515655A JP5596901B2 JP 5596901 B2 JP5596901 B2 JP 5596901B2 JP 2007515655 A JP2007515655 A JP 2007515655A JP 2007515655 A JP2007515655 A JP 2007515655A JP 5596901 B2 JP5596901 B2 JP 5596901B2
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Japan
Prior art keywords
lead frame
light emitting
molded body
lens
die package
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Expired - Lifetime
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JP2007515655A
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Japanese (ja)
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JP2008502159A (ja
JP2008502159A5 (enExample
Inventor
ピー． ロー，バン，
ネグリー，ジェラルド，エイチ．
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Wolfspeed Inc
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Cree Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
JP2007515655A 2004-06-04 2005-06-03 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 Expired - Lifetime JP5596901B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/861,929 US7456499B2 (en) 2004-06-04 2004-06-04 Power light emitting die package with reflecting lens and the method of making the same
US10/861,929 2004-06-04
PCT/US2005/019719 WO2005119707A2 (en) 2004-06-04 2005-06-03 Power light emitting die package with reflecting lens and the method of making the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011095418A Division JP2011176347A (ja) 2004-06-04 2011-04-21 反射レンズを備えたパワー発光ダイパッケージ

Publications (3)

Publication Number Publication Date
JP2008502159A JP2008502159A (ja) 2008-01-24
JP2008502159A5 JP2008502159A5 (enExample) 2014-08-07
JP5596901B2 true JP5596901B2 (ja) 2014-09-24

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JP2007515655A Expired - Lifetime JP5596901B2 (ja) 2004-06-04 2005-06-03 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法
JP2011095418A Pending JP2011176347A (ja) 2004-06-04 2011-04-21 反射レンズを備えたパワー発光ダイパッケージ

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JP2011095418A Pending JP2011176347A (ja) 2004-06-04 2011-04-21 反射レンズを備えたパワー発光ダイパッケージ

Country Status (8)

Country Link
US (3) US7456499B2 (enExample)
EP (7) EP2287926B1 (enExample)
JP (2) JP5596901B2 (enExample)
AT (1) ATE420464T1 (enExample)
DE (1) DE602005012259D1 (enExample)
MY (1) MY139974A (enExample)
TW (2) TW201234644A (enExample)
WO (1) WO2005119707A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932886B2 (en) 2004-06-04 2015-01-13 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same

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* Cited by examiner, † Cited by third party
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TWI382561B (zh) 2013-01-11
EP2287926A2 (en) 2011-02-23
EP2075856B1 (en) 2015-05-13
ATE420464T1 (de) 2009-01-15
EP2075856A3 (en) 2009-07-08
EP2287929A2 (en) 2011-02-23
EP2290713A1 (en) 2011-03-02
EP2287928B1 (en) 2019-10-02
DE602005012259D1 (de) 2009-02-26
EP2290713B1 (en) 2017-11-01
US20080283861A1 (en) 2008-11-20
JP2008502159A (ja) 2008-01-24
EP2287929A3 (en) 2011-03-02
EP2075856A2 (en) 2009-07-01
EP2287927B1 (en) 2017-07-26
EP1756879B1 (en) 2009-01-07
EP2287929B1 (en) 2015-05-06
EP2287928A3 (en) 2011-03-02
US7456499B2 (en) 2008-11-25
WO2005119707A3 (en) 2006-06-01
MY139974A (en) 2009-11-30
EP2287926B1 (en) 2017-07-26
US20050269587A1 (en) 2005-12-08
US8446004B2 (en) 2013-05-21
JP2011176347A (ja) 2011-09-08
WO2005119707A2 (en) 2005-12-15
US20130323865A1 (en) 2013-12-05
TW200625678A (en) 2006-07-16
EP1756879A2 (en) 2007-02-28
TW201234644A (en) 2012-08-16
EP2287926A3 (en) 2011-03-09
EP2287928A2 (en) 2011-02-23
US8932886B2 (en) 2015-01-13
EP2287927A3 (en) 2011-03-02

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