JP2008502159A - 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 - Google Patents
反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 Download PDFInfo
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- JP2008502159A JP2008502159A JP2007515655A JP2007515655A JP2008502159A JP 2008502159 A JP2008502159 A JP 2008502159A JP 2007515655 A JP2007515655 A JP 2007515655A JP 2007515655 A JP2007515655 A JP 2007515655A JP 2008502159 A JP2008502159 A JP 2008502159A
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- Prior art keywords
- lead frame
- light emitting
- molded body
- lens
- die package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
Description
<装置>
<方法>
<レンズ>
Claims (15)
- 複数のリードを含むリードフレームであって、前記リードフレームは上面側と底面側とを有し、前記リードフレームの一部が取り付けパッドを画定している、リードフレームと、
前記取り付けパッドの上に搭載された少なくとも1つの発光デバイスと、
前記リードフレームの一部と一体化された成形体であって、前記成形体は前記リードフレームの前記上面側で開口を画定し、前記開口は前記取り付けパッドを取り囲み、前記成形体は、前記リードフレームの前記底面側でラッチを含む、成形体と、
前記成形体に結合されたレンズと、
を備えた発光ダイパッケージ。 - 前記成形体は成形プラスチックから構成されている、請求項1に記載の発光ダイパッケージ。
- 誘電性の接着膜を介して前記リードフレームに結合されるヒートシンクをさらに備え、
前記ヒートシンクは前記ラッチによって前記リードフレームにラッチされる、請求項1に記載の発光ダイパッケージ。 - 前記レンズは複合光学レンズである、請求項1に記載の発光ダイパッケージ。
- 発光ダイパッケージを製造する方法であって、
前記方法は、
リードフレームストリップを作製することであって、前記リードフレームストリップは、複数のリードを含み、各リードと前記リードフレームストリップとは上面側と底面側とを有し、第1リードの一部が取り付けパッドを画定することと、
前記リードフレームストリップの一部と一体化した本体を成形することであって、前記成形体は前記リードフレームストリップの前記上面側で開口を画定し、前記開口は前記取り付けパッドを取り囲み、前記成形体は前記リードフレームストリップの前記底面側でラッチを含むことと、
前記取り付けパッド上に少なくとも1つの発光デバイスを取り付けることと、
を含む、方法。 - 前記リードフレームストリップは、薄い金属から構成されている、請求項5に記載の方法。
- 前記リードフレームストリップは、金属シートから型押しされる、請求項5に記載の方法。
- 前記成形体は高温プラスチックから構成されている、請求項5に記載の方法。
- ヒートシンクを前記ラッチと係合させることによって前記リードフレームダイに前記ヒートシンクを結合することをさらに含む、請求項5に記載の方法。
- 前記発光デバイスを封止剤で封止することをさらに含む、請求項5に記載の方法。
- 前記開口の上方にレンズを結合させて、光学キャビティを画定することをさらに含む、請求項5に記載の方法。
- 前記レンズは、反射面と前記取り付けパッドの上方に配置された凹状底面とを含む複合光学レンズである、請求項11に記載の方法。
- 前記レンズは、前記光に影響を及ぼすように適合された光学材料で被膜された底面を有する、請求項11に記載の方法。
- 封止剤のない膨張空間を残しつつ、前記封止剤で前記光学キャビティを実質的に充填し、それによって、前記封止剤が膨張および収縮することを可能にすることをさらに含む、請求項11に記載の方法。
- 前記発光ダイパッケージに前記リードの外側部分を残しつつ、前記リードフレームのクロスバー部分を除去することと、
前記リードの前記外側部分を曲げることと、
をさらに含む、請求項5に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/861,929 US7456499B2 (en) | 2004-06-04 | 2004-06-04 | Power light emitting die package with reflecting lens and the method of making the same |
US10/861,929 | 2004-06-04 | ||
PCT/US2005/019719 WO2005119707A2 (en) | 2004-06-04 | 2005-06-03 | Power light emitting die package with reflecting lens and the method of making the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011095418A Division JP2011176347A (ja) | 2004-06-04 | 2011-04-21 | 反射レンズを備えたパワー発光ダイパッケージ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008502159A true JP2008502159A (ja) | 2008-01-24 |
JP2008502159A5 JP2008502159A5 (ja) | 2014-08-07 |
JP5596901B2 JP5596901B2 (ja) | 2014-09-24 |
Family
ID=35446717
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2007515655A Active JP5596901B2 (ja) | 2004-06-04 | 2005-06-03 | 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 |
JP2011095418A Pending JP2011176347A (ja) | 2004-06-04 | 2011-04-21 | 反射レンズを備えたパワー発光ダイパッケージ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011095418A Pending JP2011176347A (ja) | 2004-06-04 | 2011-04-21 | 反射レンズを備えたパワー発光ダイパッケージ |
Country Status (8)
Country | Link |
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US (3) | US7456499B2 (ja) |
EP (7) | EP2287926B1 (ja) |
JP (2) | JP5596901B2 (ja) |
AT (1) | ATE420464T1 (ja) |
DE (1) | DE602005012259D1 (ja) |
MY (1) | MY139974A (ja) |
TW (2) | TW201234644A (ja) |
WO (1) | WO2005119707A2 (ja) |
Cited By (2)
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KR101285311B1 (ko) | 2009-12-29 | 2013-07-11 | 일진엘이디(주) | 발광 다이오드 패키지 및 백라이트 유닛 |
KR101371134B1 (ko) | 2012-10-31 | 2014-03-07 | 부국전자 주식회사 | 엘이디 패키지 |
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KR101371134B1 (ko) | 2012-10-31 | 2014-03-07 | 부국전자 주식회사 | 엘이디 패키지 |
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