JP5587595B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP5587595B2
JP5587595B2 JP2009281725A JP2009281725A JP5587595B2 JP 5587595 B2 JP5587595 B2 JP 5587595B2 JP 2009281725 A JP2009281725 A JP 2009281725A JP 2009281725 A JP2009281725 A JP 2009281725A JP 5587595 B2 JP5587595 B2 JP 5587595B2
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JP
Japan
Prior art keywords
laser beam
dust
opening
condenser
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009281725A
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English (en)
Japanese (ja)
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JP2011121099A (ja
Inventor
健太郎 小田中
龍吾 大庭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2009281725A priority Critical patent/JP5587595B2/ja
Priority to TW099136734A priority patent/TWI495529B/zh
Priority to KR1020100112188A priority patent/KR101650206B1/ko
Priority to CN201010582722.4A priority patent/CN102091869B/zh
Publication of JP2011121099A publication Critical patent/JP2011121099A/ja
Application granted granted Critical
Publication of JP5587595B2 publication Critical patent/JP5587595B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0461—Welding tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2009281725A 2009-12-11 2009-12-11 レーザー加工装置 Active JP5587595B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009281725A JP5587595B2 (ja) 2009-12-11 2009-12-11 レーザー加工装置
TW099136734A TWI495529B (zh) 2009-12-11 2010-10-27 Laser processing device
KR1020100112188A KR101650206B1 (ko) 2009-12-11 2010-11-11 레이저 가공 장치
CN201010582722.4A CN102091869B (zh) 2009-12-11 2010-12-10 激光加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009281725A JP5587595B2 (ja) 2009-12-11 2009-12-11 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2011121099A JP2011121099A (ja) 2011-06-23
JP5587595B2 true JP5587595B2 (ja) 2014-09-10

Family

ID=44125236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009281725A Active JP5587595B2 (ja) 2009-12-11 2009-12-11 レーザー加工装置

Country Status (4)

Country Link
JP (1) JP5587595B2 (ko)
KR (1) KR101650206B1 (ko)
CN (1) CN102091869B (ko)
TW (1) TWI495529B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11565351B2 (en) 2018-04-09 2023-01-31 Samsung Display Co., Ltd. Substrate processing apparatus and substrate processing method

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013006200A (ja) * 2011-06-27 2013-01-10 Disco Corp レーザ加工装置
JP2013128950A (ja) * 2011-12-21 2013-07-04 Disco Corp レーザー加工装置
JP2013163216A (ja) * 2012-02-13 2013-08-22 Disco Corp レーザー加工装置
CN102581493A (zh) * 2012-02-28 2012-07-18 武汉金运激光股份有限公司 一种带有高度可调式抽风装置的激光切割头
JP2013184177A (ja) * 2012-03-06 2013-09-19 Disco Corp レーザー加工装置
WO2013136695A1 (ja) * 2012-03-16 2013-09-19 パナソニック株式会社 レーザ加工装置およびレーザ加工方法
TW201338902A (zh) * 2012-03-29 2013-10-01 Mitsuboshi Diamond Ind Co Ltd 雷射加工裝置
JP6222903B2 (ja) 2012-08-17 2017-11-01 株式会社ディスコ レーザ加工装置
KR102096048B1 (ko) * 2012-10-10 2020-04-02 삼성디스플레이 주식회사 레이저 가공장치
JP6004933B2 (ja) * 2012-12-21 2016-10-12 株式会社ディスコ レーザー加工装置
JP2014124648A (ja) * 2012-12-25 2014-07-07 Disco Abrasive Syst Ltd レーザー加工装置
KR101438782B1 (ko) * 2013-03-18 2014-09-17 주식회사 포스코 레이저 용접 장치
JP6196059B2 (ja) * 2013-04-10 2017-09-13 株式会社ディスコ レーザー加工装置
JP6104025B2 (ja) 2013-04-11 2017-03-29 株式会社ディスコ レーザー加工装置及びレーザー加工方法
CN103358021B (zh) * 2013-06-28 2015-06-03 深圳市吉阳自动化科技有限公司 激光切割机
CN103658984B (zh) * 2013-12-04 2016-04-13 上海交通大学 激光焊接等离子体侧吸负压装置及激光焊接系统
JP6328522B2 (ja) * 2014-08-21 2018-05-23 株式会社ディスコ 保護膜被覆方法および保護膜被覆装置
JP6483404B2 (ja) 2014-11-04 2019-03-13 株式会社ディスコ レーザー加工装置
JP6516624B2 (ja) * 2015-08-11 2019-05-22 株式会社ディスコ レーザ加工装置
JP6647829B2 (ja) * 2015-10-20 2020-02-14 株式会社ディスコ レーザ加工装置
TWI613028B (zh) * 2016-09-09 2018-02-01 財團法人工業技術研究院 雷射加工裝置及雷射加工排屑裝置
JP6450784B2 (ja) 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工機
JP6450783B2 (ja) 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工ヘッド用ノズル
KR101995889B1 (ko) * 2017-02-03 2019-10-01 (주)제이케이씨코리아 가공 정밀도가 향상된 레이저 가공 장치
JP7004381B2 (ja) * 2017-03-22 2022-01-21 株式会社Ｓｃｒｅｅｎホールディングス 描画装置、及び描画装置の汚染防止方法
CN107398642A (zh) * 2017-09-21 2017-11-28 浙江中捷缝纫科技有限公司 一种激光切割机构
CN108500454A (zh) * 2018-04-27 2018-09-07 深圳市振华兴科技有限公司 吸烟吸尘装置及激光生产设备
CN108788495B (zh) * 2018-08-28 2020-09-15 山东北易车业有限公司 一种数控激光切割机快速割圆方法
JP7503233B2 (ja) 2020-01-07 2024-06-20 株式会社東京精密 集光レンズユニット及びレーザ加工装置
KR102249667B1 (ko) * 2020-02-10 2021-05-11 주식회사 제이스텍 디스플레이 보호필름을 레이저 컷팅하여 발생되는 흄을 차단하는 렌즈 및 글라스 오염방지 장치
CN113949010B (zh) * 2020-07-16 2023-10-20 绵阳伟成科技有限公司 一种激光破皮机及破皮方法
KR102182608B1 (ko) * 2020-08-24 2020-11-24 ㈜ 엘에이티 레이저 커팅시스템
JP7473429B2 (ja) 2020-09-10 2024-04-23 株式会社ディスコ レーザー加工装置
CN113333944A (zh) * 2021-06-22 2021-09-03 深圳市镭硕光电科技有限公司 一种散热及保护效果好的激光雕刻模组
KR102697938B1 (ko) * 2021-11-18 2024-08-23 세메스 주식회사 조사 모듈 및 이를 포함하는 기판 처리 장치
CN115008004B (zh) * 2022-05-20 2023-06-27 深圳市韵腾激光科技有限公司 一种激光同轴加工气体辅助系统
AT526975A1 (de) * 2023-03-14 2024-09-15 Trotec Laser Gmbh Schutztrichter für eine Laservorrichtung und Verfahren hierfür

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027137A (en) * 1975-09-17 1977-05-31 International Business Machines Corporation Laser drilling nozzle
JPS5916692A (ja) * 1982-07-20 1984-01-27 Matsushita Electric Ind Co Ltd レ−ザ溶接装置
JPS62199285A (ja) * 1986-02-28 1987-09-02 Anritsu Corp レーザ加工機
EP0268301B1 (en) * 1986-11-20 1993-09-15 Nec Corporation Method and apparatus for writing a line on a patterned substrate
JPH09168877A (ja) * 1995-12-21 1997-06-30 Mitsubishi Electric Corp 配線基板の加工方法および加工装置
CN1199759A (zh) * 1997-05-21 1998-11-25 刘金生 高效防水装饰涂料
JPH11145148A (ja) * 1997-11-06 1999-05-28 Tdk Corp 熱プラズマアニール装置およびアニール方法
US6580054B1 (en) 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
JP4205486B2 (ja) * 2003-05-16 2009-01-07 株式会社ディスコ レーザ加工装置
JP2005303322A (ja) * 2005-05-12 2005-10-27 Mitsubishi Electric Corp 配線基板の加工方法、加工装置およびレーザ加工用ヘッド
JP4896457B2 (ja) * 2005-07-12 2012-03-14 エンシュウ株式会社 レーザ加工機のレーザ照射用ノズル装置及びこの照射用ノズルによるブロー方法。
JP4993886B2 (ja) * 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
JP2007142000A (ja) * 2005-11-16 2007-06-07 Denso Corp レーザ加工装置およびレーザ加工方法
JP2007175721A (ja) * 2005-12-27 2007-07-12 Miyachi Technos Corp レーザ穴あけ加工方法及び装置
JP2007216290A (ja) * 2006-02-20 2007-08-30 Daihen Corp レーザトーチ
JP4682872B2 (ja) * 2006-02-27 2011-05-11 株式会社デンソー レーザ加工における飛散物の除去装置
JP5165203B2 (ja) * 2006-03-07 2013-03-21 ソニー株式会社 レーザ加工装置及びレーザ加工方法
JP4850625B2 (ja) * 2006-08-22 2012-01-11 日東電工株式会社 レーザ加工用粘着シート
JP5198142B2 (ja) * 2008-05-14 2013-05-15 シャープ株式会社 電子素子モジュールの製造方法
TWM344932U (en) * 2008-06-16 2008-11-21 Tong Tai Machine And Tool Co Ltd Air cap type dust collecting device of laser drilling machine
TWI498008B (zh) * 2009-12-30 2015-08-21 Altek Corp Method of Adjusting Camera Parameters of Whole - week Images

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11565351B2 (en) 2018-04-09 2023-01-31 Samsung Display Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
CN102091869A (zh) 2011-06-15
CN102091869B (zh) 2014-11-05
KR20110066846A (ko) 2011-06-17
TWI495529B (zh) 2015-08-11
JP2011121099A (ja) 2011-06-23
KR101650206B1 (ko) 2016-08-22
TW201127531A (en) 2011-08-16

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