JP5512292B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5512292B2
JP5512292B2 JP2010002957A JP2010002957A JP5512292B2 JP 5512292 B2 JP5512292 B2 JP 5512292B2 JP 2010002957 A JP2010002957 A JP 2010002957A JP 2010002957 A JP2010002957 A JP 2010002957A JP 5512292 B2 JP5512292 B2 JP 5512292B2
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Japan
Prior art keywords
chip
semiconductor chip
semiconductor
bonding pads
bonding
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JP2010002957A
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English (en)
Japanese (ja)
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JP2011142264A (ja
JP2011142264A5 (https=
Inventor
修康 武藤
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Renesas Electronics Corp
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Renesas Electronics Corp
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Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2010002957A priority Critical patent/JP5512292B2/ja
Priority to TW099143837A priority patent/TWI493610B/zh
Priority to CN201410547244.1A priority patent/CN104362101B/zh
Priority to CN201110002450.0A priority patent/CN102142398B/zh
Priority to US12/987,090 priority patent/US8283210B2/en
Publication of JP2011142264A publication Critical patent/JP2011142264A/ja
Priority to US13/611,222 priority patent/US8796074B2/en
Publication of JP2011142264A5 publication Critical patent/JP2011142264A5/ja
Priority to US14/150,972 priority patent/US9177936B2/en
Application granted granted Critical
Publication of JP5512292B2 publication Critical patent/JP5512292B2/ja
Priority to HK15103686.6A priority patent/HK1203244B/xx
Priority to US14/929,326 priority patent/US9397072B2/en
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    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
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  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010002957A 2010-01-08 2010-01-08 半導体装置の製造方法 Active JP5512292B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2010002957A JP5512292B2 (ja) 2010-01-08 2010-01-08 半導体装置の製造方法
TW099143837A TWI493610B (zh) 2010-01-08 2010-12-14 Manufacturing method of semiconductor device
CN201410547244.1A CN104362101B (zh) 2010-01-08 2011-01-07 制造半导体器件的方法
CN201110002450.0A CN102142398B (zh) 2010-01-08 2011-01-07 制造半导体器件的方法
US12/987,090 US8283210B2 (en) 2010-01-08 2011-01-08 Method of manufacturing semiconductor device
US13/611,222 US8796074B2 (en) 2010-01-08 2012-09-12 Method of manufacturing semiconductor device
US14/150,972 US9177936B2 (en) 2010-01-08 2014-01-09 Method of manufacturing semiconductor device
HK15103686.6A HK1203244B (en) 2010-01-08 2015-04-15 Method of manufacturing semiconductor device
US14/929,326 US9397072B2 (en) 2010-01-08 2015-10-31 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010002957A JP5512292B2 (ja) 2010-01-08 2010-01-08 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2011142264A JP2011142264A (ja) 2011-07-21
JP2011142264A5 JP2011142264A5 (https=) 2012-10-04
JP5512292B2 true JP5512292B2 (ja) 2014-06-04

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CN104362101B (zh) 2017-04-12
CN102142398B (zh) 2014-10-15
US8283210B2 (en) 2012-10-09
US20160056124A1 (en) 2016-02-25
US9177936B2 (en) 2015-11-03
US20140127860A1 (en) 2014-05-08
US8796074B2 (en) 2014-08-05
CN104362101A (zh) 2015-02-18
US20110171777A1 (en) 2011-07-14
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US9397072B2 (en) 2016-07-19
TWI493610B (zh) 2015-07-21

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